Capcon
capconsemicon.com
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Overview
Technologies
Salaries
Products
People
Growth
Offices
Jobs
Financials
Overview
Capcon, known in Chinese as Huafeng Technology, is a semiconductor equipment maker that develops die bonding machines for advanced chip packaging. Its equipment covers fan-out wafer-level packaging, PoP, MCM, eMCP, stacked die, SiP, 2.5D and 3D, FCCSP and FCBGA processes for customers including TSMC, ASE, SPIL, JCET and Tongfu Microelectronics, and its Singapore entity hires software, electrical, quality control, service and process engineers. The company is based in Singapore.
Tech stack
Technologies named in job postings at Capcon over the last 12 months, by layer, with the share of postings for each.
Technologies in use
5
Postings analysed
2
Stack modernity
85/100
Languages
C++
JavaScript
Python
SQL
Cloud & platforms
Windows
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Salary insights
Compensation ranges based on this company's open jobs
Median
$54k
Typical range
$47k – $61k
Open positions
2
2
Jobs
Senior
100%
| Level | Jobs | Median | Typical range |
|---|---|---|---|
| Senior | 2 | $54k | $47k – $61k |
Highest paying role
Software Engineer / Senior Software Engineer
$61k
Normalized to USD per year
Growth
Hiring Momentum
26/100
Slowing
Open positions
2
0 opened / 0 closed in 30 days
Median time-to-fill
31 days
faster than 40% of the market
Hiring Dynamics
0%
Hiring Focus
The percentage next to each role is its share of the company's job openings over the last 90 days; the arrow shows the shift versus the previous period.
Backend
33% ▲
Hardware
33% ▲
Industrial Engineering
33% ▲
Offices
Where the company hires and what each office is for
Cities
1
Hiring now
1
Countries
1
Busiest office
Singapore
Singapore
Singapore
HQ
3 open roles 6 posted in 90 days 67% engineering $55k Avg Salary
hires for Backend, Hardware, Industrial Engineering
Jobs
$33k – $61k per year (gross) • In office • Full-Time • 3+ years exp • Singapore
Python
JavaScript
SQL
C++
Windows
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