Egis Technology
egistec.com
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Overview
Egis Technology develops fingerprint sensors and biometric authentication solutions. Its chips are integrated into smartphones and laptop devices. The company supplies major consumer electronics manufacturers.
News
Egis Group Brings Cross-Orbit Satellite and Physical AI Integration to MWC Barcelona 2026
Barcelona, Spain - March 2, 2026 - At MWC Barcelona 2026 (March 2-5), EGIS TECHNOLOGY INC. will present an integrated space-to-ground connectivity and Physical AI platform at Booth 1C32, together with group companies ALGOLTEK, INC., ENE TECHNOLOGY INC., C
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Creative5 and Viasat Pioneer Smart Forestry Monitoring through Hybrid Satellite IoT at CES 2026
Figure 1 Creative5 hybrid IoT smart forestry monitoring nodes deployed in forest areas at National Ilan University (NIU), Taiwan. The system integrates NTN satellite connectivity with terrestrial networks, LoRaWAN, and BLE Mesh, combined with solar power
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Egis Group Showcases Cutting-Edge Innovations at 2025 Egis Tech Day
3nm Heterogeneous Computing, 6nm AI Chiplet, and Next-Generation AI Vision Platform Unveiled-Leading a New Era of AI Computing Power Taipei, Taiwan - October 28, 2025 - Egis Technology Inc. (6462.TWO) today hosted its "2025 Egis Tech Day" at the Taipei Ma
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InPsytech showcases 3nm UCIe 3.0 technology at OCP 2025, Accelerating Innovation in Chiplet Ecosystem
(October 13, 2025, Taipei) - InPsytech, a subsidiary of Egis Technology (6462.TWO) specializing in high-speed interface intellectual property (IP) development, announced today that it will participate in the Open Compute Project (OCP) Global Summit 2025,
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InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard Enabling High-Speed Interconnects for 3D Heterogeneous Integration
July 15, 2025 - Hsinchu, Taiwan -InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for TSMC's Face-to-Face (F2F) SoIC technology, fully c
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