NewPhotonics
newphotonics.com
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Financials
Funding and backers
Team
11-50
employees, estimated range
Grants
$2.7M
1 grant · CORDIS
Backers
1
AWZ Ventures
Momentum
15/100
in the news
Last sign of life
this month
a posting or a news item
The story so fareach stage dated by its source: the company's releases, the press, registers, filings
Mar 12
Launched NewPhotonics(R) Introduces Industry First 3.2Tbps DR8 Transmitter-on-Chip PIC with Integrated OSPic(TM) Optical Signal Processor for AI Data Center C… · marketwatch.com
Sep 23, 2024
Partnership Softbank and NewPhotonics Announce Collaboration on Advanced Photonics Technology for LPO, CPO and All-Optics Switch Fabric Targeting AI-RAN · Nasdaq
Mar 25, 2024
Launched NewPhotonics Introduces Transmitter-on-Chip PIC with Integrated Equalizer for LPO and LRO Data Center Connectivity · PRNewswire
Dec 1, 2022
Won a grant $2.7M · CORDIS
Funding rounds
| Round | Date | Amount | Investors | Source |
|---|---|---|---|---|
| Grant | Dec 2022 | $2.7M | — | CORDIS |
Backed byfrom the funds' portfolios and accelerator catalogs
AWZ Ventures Similar startupsby what they do, their industry and backers
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News
Tower Semiconductor and NewPhotonics Launch High-Volume AI Optical Engine Shipments
Tipranks Press Release.
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Report
NewPhotonics and Tower Semiconductor Begin High-Volume Shipments of Laser-Integrated, Serviceable Optical Engine PICs for Scale-Out and Scale Up AI Interconnect
Companies commercialize scale manufacturability of 800G to 1.6T PICs in external pluggable and CPX MSA compliant NPO socket pluggable solutions bu...
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Report
Tower and NewPhotonics Ship Laser-Integrated PICs for AI Interconnect
Tower Semiconductor and NewPhotonics have begun high-volume shipments of laser-integrated, serviceable optical engine photonic integrated circuits for scale-out and scale-up AI interconnect, the companies said in a joint...
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Report
NewPhotonics and Tower Semiconductor Begin High-Volume Shipments of Laser-Integrated, Serviceable Optical Engine PICs for Scale-Out and Scale Up AI Interconnect
Companies commercialize scale manufacturability of 800G to 1.6T PICs in external pluggable and CPX MSA compliant NPO socket pluggable solutions built on PH18DA platform designed for high-density monolithic laser integration, SOAs, modulators and detectors
Read more
Report
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Financials
Total raised
$2.7M
Latest round
Grant
Funding rounds
1
Funding rounds
| Round | Announced | Amount | |
|---|---|---|---|
| Grant | 2022 | $2.7M | Details |