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Overview

Breaking the AI memory wall through ultra-high bandwidth High-Resolution Interconnects. Syenta raises Series A from Playground Global and Australia's National Reconstruction Fund to scale semiconductor innovation; Pat Gelsinger (Ex-CEO of Intel) joins the board.

News

News 3D InCites 1 year ago
Syenta Raises A$8.8M to Break AI's Memory Wall with Next-Gen Chip Packaging Technology - IMAPS 3D InCites Content Platform
Syenta raised A$8.8 million in Pre-Series A funding to commercialize its chip packaging breakthrough that could unlock next-gen AI.
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News Forbes Australia 1 year ago
Syenta raises $8.8m to solve one of AI's 'biggest bottlenecks'
The Sydney-headquartered startup led by Dr Jekaterina Viktorova was spun out of ANU in 2022. Its proprietary chip packaging breakthrough could unlock the next generation of AI and quantum computing.
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