TSMC
tsmc.com
Actively hiring
Processors, MCUs & AI Chips
Semiconductor Manufacturing
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Overview
Salaries
Products
People
Growth
Offices
Financials
Overview
Taiwan Semiconductor Manufacturing Company, known as TSMC, is the world's largest dedicated semiconductor foundry, founded in 1987 and headquartered in Hsinchu, Taiwan. It manufactures chips designed by other companies, producing the leading-edge logic used in smartphones, artificial intelligence accelerators, data centre processors, automotive systems and consumer electronics for customers such as Apple, NVIDIA, AMD and Qualcomm. The company runs advanced fabrication plants in Taiwan alongside new sites in Arizona, Japan and Germany, and its packaging technologies have become a bottleneck resource for the AI hardware industry.
Products
Specialty Technologies
TSMC's specialty lines cover radio frequency, embedded memory, power management, image sensors and microcontroller processes. These mature nodes serve automotive, industrial and connectivity customers.
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Open Innovation Platform
The Open Innovation Platform is TSMC's design ecosystem of verified process design kits, IP blocks and EDA flows. It lets fabless customers move from design to tape-out with predictable results on each node.
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InFO Packaging
Integrated Fan-Out packaging places dies in a thin, low-cost package without an interposer. It is widely used for mobile application processors where thickness and power efficiency matter.
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CoWoS Advanced Packaging
CoWoS is TSMC's chip-on-wafer-on-substrate packaging technology that places logic dies next to high-bandwidth memory on a silicon interposer. It is the packaging used by most modern AI training accelerators and its capacity has been a key industry constraint.
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Advanced Logic Process Nodes
TSMC's leading-edge nodes, currently spanning three and five nanometre families with two nanometre in ramp, produce the fastest and most power-efficient logic available. They are used for flagship mobile processors and AI accelerators.
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People
Morris Chang
Founder
Morris Chang founded TSMC in 1987 and invented the pure-play foundry business model that separated chip design from manufacturing. He led the company as chairman and chief executive across two tenures before retiring in 2018.
C.C. Wei
Chairman & Chief Executive Officer
C.C. Wei leads TSMC as chairman and chief executive, directing its technology roadmap and global capacity expansion. He joined the company in 1998 and previously ran its business development organisation.
Wendell Huang
Chief Financial Officer
Wendell Huang leads TSMC's finance organisation and its capital expenditure planning. He joined the company in 1999 and has held several senior finance roles.
Mark Liu
former Chairman
Mark Liu served as TSMC's chairman until 2024 and previously as co-chief executive. He oversaw the company's advanced node ramp and overseas fabrication strategy.
Names and roles come from public filings, company registers and the company's own site. Is this you? Correct or remove · How we handle this data
Growth
Hiring Momentum
48/100
Stable
Open positions
1
0 opened / 0 closed in 30 days
Hiring Dynamics
+100%
Hiring Focus
The percentage next to each role is its share of the company's job openings over the last 90 days; the arrow shows the shift versus the previous period.
Industrial Engineering
100% ▲
Offices
Where the company hires and what each office is for
Cities
2
Hiring now
1
Countries
1
Busiest office
Taoyuan
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Headquarters
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Hsinchu
Taiwan
HQ
Taoyuan
Taiwan
1 open roles 1 posted in 90 days 5000+ est. staff
hires for Industrial Engineering
Financials
Est. Annual Revenue
$90B
2024
Revenue
+29% YoY
Estimate
Low-high range
Modelled from public signals, not audited accounts - read it as an order of magnitude.
| Year | Estimate | Low | High |
|---|---|---|---|
| 2015 | $26.4B | $25.6B | $27.2B |
| 2016 | $29.3B | $28.5B | $30B |
| 2017 | $32.3B | $31.5B | $33B |
| 2018 | $34.3B | $33.5B | $35B |
| 2019 | $34.8B | $34B | $35.5B |
| 2020 | $45.7B | $44.8B | $46.5B |
| 2021 | $56.9B | $56B | $57.8B |
| 2022 | $75.7B | $74.5B | $76.8B |
| 2023 | $69.5B | $68.5B | $70.5B |
| 2024 | $90B | $88.5B | $91.5B |