{"id":2799914,"url":"https://alion.io/job/aegis-japan-field-process-engineer-paneru-meka-","title":"Field Process Engineer（パネル）外資大手半導体製造装置メーカー／新横浜","company":{"id":2757203,"name":"Aegis Japan","domain":"aegis-japan.co.jp","url":"https://alion.io/company/aegis-japan","size_band":null,"is_staffing_agency":true,"employer_type":"agency","is_intermediary":false,"listed_via":null,"ats_vendor":null,"truth_index":{"grade":"D","score":50,"open_postings":529,"ghost_share":0.839,"stale_share":0,"repost_share":0,"time_to_fill_p50_days":null,"computed_at":"2026-11-01T06:10:25Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":null,"employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Yokohama, 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\n2026年に向けて、パネルメッキ装置が複数の顧客に導入される予定。\nまずはパネルメッキ装置をザルツブルグ本国のエンジニアと実施してもらい、パネルプロセスの習得を行います。\n出張に関して\n複数の地域に対してサポートが必要となるため、新横浜を拠点とし、出張ベースにて複数の顧客への対応を行います。\nザルツブルクへのデモやトレーニングでの海外出張機会もあります。\n\n近年、AIを搭載したチップセットは、従来のシリコン基板に代わり、\nガラス基板を用いた大面積インターポーザー上に形成される方向へと進化しています。\nこのトレンドは、高速通信・高集積化・低消費電力を実現するための新しいパッケージング技術として注目されており、\n次世代半導体実装の鍵となっています。 \n同社は、この新しい市場ニーズに対応するため、同装置の販売を開始いたしました。\nこれにより、ガラス基板を用いた大面積インターポーザー製造に必要なメッキ技術を強化し、\n顧客の先端パッケージング要求に応えていきます。\n応募条件\n1. 半導体製造装置を理解、プロセスに興味をもっていること。\n2. 薬品を使ったウエット工程の経験があると尚可。\n(半導体関連に拘らず、日本の主要産業である自動車・機械・電気電子・製鉄・化学産業等の出身)\n3. 電気化学の知識が有ると尚可。\n4. プロジェクトマネージメント経験があると尚可。\n(Excel等での進捗管理及びチームマネージメント)\n5. 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