3D Integration Engineer H/F

Join our Process Integration team, within the Quantum Hardware & Infrastructure department, and help turn cutting-edge QPU designs into physical reality.

This role sits right at the crossroads of nanofabrication, assembly, and scalable QPU design. You'll work hand in hand with teams across our entire hardware organization - from roadmap definition to fabrication, packaging, and validation - to build the 3D integration technologies that will power the next generation of our quantum processors.

Responsabilities

• Explore, identify, and benchmark the most promising 3D assembly technologies for QPUs, evaluated against the demanding constraints of superconducting circuits: material and process compatibility, microwave performance, and cryogenic reliability
• Develop and qualify our core 3D integration building blocks - airbridges, flip-chip bonding, TSV, multi-layer wiring (MLW), superconducting interconnects, and wafer-level assembly - working closely with our fabrication and packaging teams
• Design and drive integration test plans in collaboration with cross-functional teams
• Build scalable, well-documented integration procedures that will support the company as it grows
• Dive into integration issues and technical anomalies, tracking them down to their root cause and making sure everything stays aligned with our specifications and performance targets
• Be the go-to technical contact for 3D integration with our external foundries, packaging partners, and equipment vendors, working alongside our foundry partnerships expert

Requirements

• PhD or MSc in physics, materials science, electrical engineering, or microelectronics, with strong hands-on cleanroom experience
• 3+ years of demonstrated 3D integration experience, in flip-chip / bump bonding and TSV processing.
• Proven track record of developing and qualifying an integration process brick end to end - from literature survey and test-vehicle design through experiments, data analysis, and go/no-go decision
• Solid grounding in failure analysis and reliability assessment of 3D interconnects: cross-sectioning, SEM, X-ray inspection / tomography, profilometry, electrical test structures
• Understanding of superconducting QPU fabrication and of what cryogenic operation demands from materials and interfaces is a plus

Recruitment process

• Screening Call with Alexandra Talent Acquisition Specialist (30 min)
• Hiring Manager Interview with the Hiring Manager (45 min)
• Technical Interview/Presentation with the Team (90 min)
• Leadership and Fit Interview (60 min)