{"id":1224483,"url":"https://alion.io/job/amazon-senior-design-automation-engineer","title":"Senior Design Automation Engineer","company":{"id":19,"name":"Amazon","domain":"amazon.com","url":"https://alion.io/company/amazon","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Career site","truth_index":null},"role":"DevOps","role_family":"DevOps","seniority":"senior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Austin, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":185200,"max":250000,"currency":"USD","period":"year","gross":null,"usd_annual":250000},"salary_estimate":null,"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":true,"technologies":[{"name":"Cadence Allegro","optional":false},{"name":"Machine Learning","optional":false},{"name":"Python","optional":false}],"status":"live","first_seen_at":"2026-09-24T00:00:00Z","employer_posted_date":"2026-09-25","last_verified_at":"2026-09-29T17:45:27Z","board_verified":true,"closed_at":null,"days_open":6,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":6},"description":"Annapurna Labs designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago-even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.\nWe are seeking a Senior Design Automation Engineer to join our hardware team and contribute to the physical design of advanced IC packages and PCBs for next-generation machine learning and data center ASICs.\nIn this role, you will develop automation to enable physical design teams to execute Package and PCB products from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.\nKey job responsibilities\nDevelop and deploy efficient design methodologies to support Package and PCB layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.\nEvaluate industry EDA offerings and make recommendations for purchase and usage of advanced packaging features to design 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).\nDeliver custom design automation to improve RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.\nContribute to cross-level teams for co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.\nDevelop data integration flows for co-design data across Package, PCB and SI/PI flows.\nDevelop software in the following languages: Python, Skill, TCL. Utilize AI coding agents to speed development and iteration.\nIdentify preferred methodologies to integrate physical verification checks (DRC, connectivity, shorts/opens) into physical design cycles.\nFollow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.\nCollaborate with SI/PI engineers to incorporate electrical constraints into the physical layout methodologies - impedance-controlled routing, power plane optimization, and critical net shielding. About the team Our team is dedicated to supporting new members. We have a broad mix of experience levels and tenures, and we’re building an environment that celebrates knowledge-sharing and mentorship. Our senior members enjoy one-on-one mentoring and thorough, but kind, code reviews. We care about your career growth and strive to assign projects that help our team members develop your engineering expertise so you feel empowered to take on more complex tasks in the future.\nBasic qualifications\n- Bachelor's degree in Computer Science, Computer Engineering, or Electrical Engineering\n- 7+ years of experience working with physical design tools across Package and PCB domains: Allegro, APD, 3DICC, Expedition\n- 10+ years of Automation experience for physical designs\nPreferred qualifications\n- Master's degree or Ph.D. degree in Electrical Engineering or related field\nAmazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.\nOur inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.\nThe base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.\nUSA, TX, Austin - 185,200.00 - 250,000.00 USD annually","description_format":"text","description_chars":4675,"description_truncated":false,"requirements":{"experience_years_min":10,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":true},"security_clearance":false,"languages":[]},"benefits":["Health insurance","Parental leave","Restricted stock units"],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Advertising","Cloud Platforms (IaaS & PaaS)","Logistics","Streaming & OTT Platforms"],"lifecycle":[{"event":"open","at":"2026-09-25T13:01:37Z"}],"liveness":{"score":88,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.882,"p_room":1,"age_days":5,"expected_fill_days":18,"reasons":["conf:4","velocity","win:early","comp:brand"],"computed_at":"2026-09-29T05:45:00Z"},"pay":{"stated_usd_annual":250000,"is_top_pay":true},"html_url":"https://alion.io/job/amazon-senior-design-automation-engineer","json_url":"https://alion.io/job/amazon-senior-design-automation-engineer.json","meta":{"generated_at":"2026-09-30T02:45:28Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","usage":{"tier":"crawler","counted_by":"address","units_charged":1,"used_today":1960,"day_limit":5000,"remaining_today":3040,"minute_limit":60,"resets_at":"2026-10-01T00:00:00Z"}}}