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Salary
≈ $127k – $293k per year (Estimated)
Location
In office (Zurich)
Seniority
Senior · 5+ years exp
Employment
Full-Time

Confirmed on the employer's own hiring board on Oct 20, 2026. First seen by Alion on Oct 1, 2026. Amazon scores B on the Alion truth index.

Overview
Company
Impact
Profile match
Amazon is an American technology and retail conglomerate founded by Jeff Bezos in 1994 as an online bookstore and headquartered in Seattle, Washington. It operates the world's largest online marketplace together with a global logistics network, physical grocery stores and a third-party seller platform that accounts for most units sold. Amazon Web Services, launched in 2006, is the leading public cloud provider and generates the majority of the group's operating profit, while advertising, Prime Video, Alexa devices and Kuiper satellite broadband round out the business.

RIVR, an Amazon company, is building Physical AI by deploying autonomous robots for real-world doorstep delivery. Operating daily in diverse urban environments, RIVR's robots continuously learn from and navigate the millions of scenarios encountered during deliveries. By owning the full stack from software to hardware, RIVR is purpose-built for safety, reliability, and the customer from day one.

As a Electronics Engineer - Carrier Board, you will own the design of GPU/SoC carrier boards for our robotic compute platform - from schematic capture through PCB layout, bring-up, and production release. You will integrate high-speed digital interfaces and sensor front-ends into compact, reliable board designs for mobile Physical AI applications. Beyond technical depth, you will manage supplier and partner relationships, define development priorities, and drive sourcing decisions. You are the technical owner of the carrier board, not just a layout executor.

Key job responsibilities

Design and own carrier boards for GPU/SoC compute modules end-to-end: requirements → schematic → layout → bring-up → production release.

Integrate high-speed digital interfaces such as multi-gigabit Ethernet, DDR4, PCIe, MIPI CSI-2, GMSL SerDes, and USB 3.x.

Design electrical front-ends for sensors and modules including cameras, LIDARs, RADARs, and wireless connectivity (WiFi/5G).

Manage supplier and partner relationships: SoC vendors, connector suppliers, contract manufacturers, and module providers.

Evaluate and select components and suppliers based on cost, availability, quality, and roadmap fit.

Define and own development milestones and timelines; coordinate across internal teams and external partners.

Make trade-off decisions (features vs. schedule vs. cost) and communicate them clearly to stakeholders.

Perform board bring-up, debug, and validation of high-speed interfaces.

Provide signal integrity guidance for PCB layout (impedance control, length-matching, stackup definition).

Collaborate closely with firmware, mechanical, and systems engineering teams.

Basic qualifications

- 5+ years designing carrier boards or motherboards for GPU/SoC compute modules.

- Proven track record integrating high-speed digital interfaces (e.g., DDR4, PCIe, multi-gig Ethernet, GMSL) at board level.

- Experience owning a board design end-to-end from requirements through production release.

- Ideally worked in mobile, edge-compute, or automotive-adjacent applications (robotics, autonomous vehicles, drones, mobile AI platforms).

- Hands-on schematic capture and PCB layout skills (Altium, OrCAD, or equivalent).

- Strong understanding of signal integrity fundamentals.

- Demonstrated ability to manage supplier and partner relationships and drive sourcing decisions.

- Comfortable defining priorities, timelines, and trade-offs for a board development project.

- Strong problem-solving skills and ability to debug high-speed interfaces during bring-up.

- Master’s degree or higher in Electrical Engineering, Electronics, or a closely related field.

Preferred qualifications

- Experience with NVIDIA Jetson, Orin, or Drive platform carrier board design.

- Signal integrity simulation experience (eye-diagram analysis, S-parameter extraction).

- Familiarity with automotive-grade design requirements (temperature range, vibration, component qualification).

- Experience with power delivery design for high-current GPU modules.

- Knowledge of thermal management integration at PCB level.

- EMC/EMI pre-compliance testing experience.

Amazon is an equal opportunities employer. We believe passionately that employing a diverse workforce is central to our success. We make recruiting decisions based on your experience and skills. We value your passion to discover, invent, simplify and build. Protecting your privacy and the security of your data is a longstanding top priority for Amazon. Please consult our Privacy Notice (https://www.amazon.jobs/en/privacy_page) to know more about how we collect, use and transfer the personal data of our candidates.

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.

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