{"id":3458191,"url":"https://alion.io/job/amazon-sr-manager-package-sipi-annapurna-labs","title":"Sr Manager Package SIPI, Annapurna Labs","company":{"id":19,"name":"Amazon","domain":"amazon.com","url":"https://alion.io/company/amazon","size_band":"1-10","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Career site","truth_index":{"grade":"B","score":78,"open_postings":4562,"ghost_share":0,"stale_share":0.89,"repost_share":0.002,"time_to_fill_p50_days":24,"computed_at":"2026-10-31T05:58:55Z"}},"role":"Hardware","role_family":"Hardware","seniority":"senior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Austin, United States","Cupertino, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":143000,"max_usd":264000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":1517},"experience_years_min":12,"visa_sponsorship":false,"relocation_package":false,"has_equity":true,"technologies":[{"name":"Ansys HFSS","optional":false},{"name":"Ansys SIwave","optional":false},{"name":"Cadence Sigrity","optional":false},{"name":"Keysight ADS","optional":false},{"name":"MATLAB","optional":false},{"name":"Python","optional":false},{"name":"Synopsys HSPICE","optional":false},{"name":"NVLink","optional":true}],"status":"live","first_seen_at":"2026-10-28T00:00:00Z","employer_posted_date":"2026-10-29","last_verified_at":"2026-11-01T02:24:49Z","board_verified":true,"closed_at":null,"days_open":4,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":4},"description":"About the Role\nWe are looking for a Senior Manager of Package Signal & Power Integrity to lead a small team of engineers delivering SI/PI solutions for next-generation 2.5D/3D chiplet-based products. This is a player-coach role: you will set the technical direction for package-level SI/PI across advanced packaging platforms (CoWoS, EMIB, 3D die stacking) while staying hands-on with modeling, simulation, and post-silicon correlation.\nYou will own the SI/PI strategy from early architecture through high-volume production, partnering with silicon design, physical design, system architecture, and possible with OSAT/substrate vendors to ensure robust signaling and power delivery across die-to-die, memory, and high-speed SerDes interfaces.\nWhat You Will Do\nLead and develop a team of SI/PI engineers, setting priorities, driving career growth, and building world-class packaging expertise.\nDefine and execute SI/PI design methodology for 2.5D/3D IC packages-including silicon interposer, RDL, TSV, and bridge-based architectures.\nDrive chip-package-system co-design by performing end-to-end SI/PI analysis and optimization for HBM (HBM3/HBM3E+), PCIe Gen5/Gen6/Gen7, UCIe die-to-die interconnects and high-speed SerDes (112G+/224G PAM4).\nOwn PDN design and sign-off across die, interposer, package substrate, and PCB, including AC/DC/transient droop analysis and decoupling strategy.\nDevelop and validate channel models (S-parameter, IBIS-AMI) and perform BER/eye-diagram analysis for multi-lane high-speed links.\nEstablish SI/PI design guidelines, sign-off criteria, and automation flows; drive continuous improvement in accuracy and productivity.\nPartner with ASIC architects, PHY/IP teams, package layout, thermal/mechanical, PCB, and system design teams to close electrical specifications.\nCollaborate with other internal partners and external partners (possible like foundry, OSAT, and substrate suppliers etc.) on technology assessment, DFM trade-offs, and new package platform enablement.\nLead post-silicon validation and model-to-hardware correlation using VNA, TDR, oscilloscope, and spectrum analyzer measurements. Required Qualifications\nMS or PhD in Electrical Engineering, with emphasis in electromagnetics, signal integrity, power integrity, or microelectronics.\n12+ years of progressive SI/PI engineering experience in semiconductor packaging (IC package, interposer, or substrate design).\n3+ years of direct people-management experience leading SI/PI or packaging engineering teams.\nDemonstrated expertise in 2.5D/3D advanced packaging technologies (CoWoS-S/L/R, EMIB, Foveros, 3D die stacking, TSV, RDL, flip-chip BGA).\nHands-on experience with SI/PI analysis for high-speed SerDes interfaces at 56G NRZ / 112G+ PAM4 data rates.\nStrong background in HBM3/4 SI/PI design and timing budget methodology (HBM3/HBM3E/HBM4 or newer).\nExperience with PCIe Gen5/Gen6 channel design, compliance, and sign-off at the package and system level.\nWorking knowledge of UCIe or comparable die-to-die interconnect standards for chiplet architectures.\nProficiency in industry EDA/simulation tools: Ansys HFSS/SIwave/Q3D, Cadence Sigrity (PowerSI, SystemSI), Keysight ADS, HSPICE/Spectre.\nStrong scripting skills (Python, MATLAB, Tcl) for simulation automation and data analysis.\nProven ability to drive cross-functional alignment across silicon, package, board, and system teams in a fast-paced product environment. Preferred Qualifications\nExperience with PCIe Gen7, 200G/400G Ethernet SerDes, or NVLink-class ultra-high-speed interconnects.\nExpertise in UCIe advanced (UCIe 2.0) protocol-level SI/PI considerations and latency-sensitive chiplet integration.\nFamiliarity with next-generation HBM standards (HBM4e) and associated PHY/package co-design challenges.\nTrack record of new product introduction (NPI) from concept through high-volume manufacturing.\nExperience with on-die EMIR/DVD analysis and chip-package PDN co-simulation workflows.\nExposure to EMI/EMC analysis and mitigation at the package and system level.\nKnowledge of thermal-aware SI/PI design-understanding package warpage, material Dk/Df drift, and reliability impacts on signal performance.\nExperience evaluating emerging packaging platforms (glass substrate, hybrid bonding, fan-out panel-level packaging).\nActive participation in industry standards bodies (IEEE, UCIe Consortium, JEDEC, OIF).\nBasic qualifications\n- Master's degree or Ph.D. degree in Electrical Engineering or related field\n- Master's degree in Electrical/Communications Engineering, or 8+ years of practical semiconductor design work including full-chip and subsystem integration experience\n- 3+ years of direct people management, including managing managers or senior individual contributors experience\nPreferred qualifications\n- Experience with PCIe Gen7, 200G/400G Ethernet SerDes, or NVLink-class ultra-high-speed interconnects.\n- Expertise in UCIe advanced (UCIe 2.0) protocol-level SI/PI considerations and latency-sensitive chiplet integration.\n- Familiarity with next-generation HBM standards (HBM4e) and associated PHY/package co-design challenges.\nAmazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.\nLos Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies. Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness and professionalism, and safeguard business operations and the Company’s reputation. Pursuant to the Los Angeles County Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records.\nOur inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.\nThe base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.\nUSA, CA, Cupertino - 277,400.00 - 350,000.00 USD annually\nUSA, TX, Austin - 241,200.00 - 325,600.00 USD annually","description_format":"text","description_chars":7483,"description_truncated":false,"requirements":{"experience_years_min":12,"management_years_min":3,"team_size_min":null,"manages_managers":true,"education":{"level":"master","optional":false},"security_clearance":false,"languages":[]},"benefits":["Health insurance","Parental leave","Restricted stock units"],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Robotics AI","Logistics & Warehouse Robotics","Video Production","Developer Tools"],"lifecycle":[{"event":"open","at":"2026-10-29T12:48:32Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 16,768 · green card filings: 56","filings_12m":16768,"filings_prev_12m":16262,"green_card_filings_12m":56,"median_offered_wage_usd":162609,"route":null,"cap_exempt":false,"checked_at":"2026-10-29T16:27:21+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":63,"band":"ok","label":"Likely open","p_open":1,"p_active":0.632,"p_room":1,"age_days":3,"expected_fill_days":24,"reasons":["conf:1","stale_co","velocity","win:early","comp:brand"],"computed_at":"2026-10-31T05:58:55Z"},"pay":null,"html_url":"https://alion.io/job/amazon-sr-manager-package-sipi-annapurna-labs","json_url":"https://alion.io/job/amazon-sr-manager-package-sipi-annapurna-labs.json","meta":{"generated_at":"2026-11-01T03:52:06Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":6075,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-02T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":19},"rest":"https://alion.io/mcp/rest/get_company?id=19"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Famazon-sr-manager-package-sipi-annapurna-labs"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Famazon-sr-manager-package-sipi-annapurna-labs"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Famazon-sr-manager-package-sipi-annapurna-labs"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/amazon-sr-manager-package-sipi-annapurna-labs\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Famazon-sr-manager-package-sipi-annapurna-labs"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":3458191}},{"tool":"search_jobs","arguments":{"company":"amazon.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":3458191},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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