{"id":2910629,"url":"https://alion.io/job/amd-3d-ic-and-soc-cad-engineer","title":"3D IC and SoC CAD ENGINEER","company":{"id":93,"name":"AMD","domain":"amd.com","url":"https://alion.io/company/amd","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Jibe","truth_index":{"grade":"A","score":97,"open_postings":17,"ghost_share":0,"stale_share":0.118,"repost_share":0,"time_to_fill_p50_days":49,"computed_at":"2026-11-09T06:03:00Z"}},"role":"Hardware","role_family":"Hardware","seniority":null,"employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Austin, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":120000,"max_usd":271000,"period":"year","method":"role_country_seniority_unknown","sample_n":3123},"experience_years_min":null,"visa_sponsorship":true,"relocation_package":false,"has_equity":false,"technologies":[{"name":"AI Agents","optional":false},{"name":"LLM","optional":false},{"name":"Machine Learning","optional":false},{"name":"Linux","optional":true},{"name":"Perl","optional":true},{"name":"Python","optional":true},{"name":"Synopsys PrimeTime","optional":true},{"name":"Unix","optional":true},{"name":"Verilog","optional":true}],"status":"closed","first_seen_at":"2026-09-30T18:30:00Z","employer_posted_date":"2026-11-04","last_verified_at":"2026-11-04T18:06:17Z","board_verified":false,"closed_at":"2026-11-04T18:06:17Z","days_open":34,"trust":{"level":"not_scored","repost_count":null,"flags":[],"days_open":34},"description":"ADVANCE YOUR CAREER. ADVANCE THE WORLD.\nAt AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.\nWhether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger - technology that moves the world forward. Join us and, together, we’ll advance your career.\nTHE ROLE:\nOur CAD team delivers automated environments for industry-leading methodologies for 3D IC stack and advanced packaging design. Our flows encompass 3D netlist and physical design, advanced packaging implementation, and 3D analysis across EMIR, PERC/ESD, physical verification, and STA. 3D design and advance packaging complexity continue in increase. AMD designs are complex heterogeneous systems requiring a mix of specialized in-house capabilities while leveraging best in class EDA vendor solutions.\nThis role is part of a global CAD team working in concert with mulitple design teams. You will collaborate directly with project teams to understand design requirements and deliver innovative solutions. The ideal candidate brings a strong silicon hardware design background, scripting proficiency, and hands-on experience applying machine learning to CAD or EDA workflows.\nTHE PERSON:\nYou have a passion for modern, complex processor architecture, digital design, and the automation that makes it scale. You are energized by the intersection of AI and CAD - whether that means applying ML models to improve QoR, building LLM-assisted flows, or designing agentic systems that reduce manual iteration. You are a team player with excellent communication skills, comfortable collaborating across sites and time zones, and eager to take on hard, open-ended problems.\nPREFERRED EXPERIENCE:\nStrong understanding of industry EDA tools, with emphasis on place-and-route, extraction, and analysis tools (e.g., ICC2, Innovus, Primetime, etc.).\nFamiliarity with chip- or system-level netlists and ability to debug connectivity across industry-standard formats (DEF/LEF/SPEF/Verilog/UPF/OAS/GDS).\nExposure with system level design verification processes including LEC, LVS, DRC, etc.\nComfort navigating large datasets and utilizing automation, distributed and cloud compute environments.\nDemonstrated experience applying AI (ML-based optimization, LLM-assisted automation, agentic frameworks) to CAD, EDA, or hardware design problems.\nStrong scripting skills in Python, TCL, and Perl within a Linux/Unix environment.\nExperience with advanced-node tapeouts across silicon technologies.\nExposure to Advanced Packaging technologies preferred (2.5D, 3D, 3.5D, including interposers and silcion bridges).\nExposure to chip-level construction (PDN, bump planning) and analysis a plus.\nExcellent verbal and written communication skills.\nKEY RESPONSIBILITIES:\nImplement and maintain 3D-IC and advanced packaging design flows from RTL through signoff.\nLead hands-on debug and automation involving large chip level physical and logical netlists.\nPartner with EDA vendors (Synopsys, Cadence) on 3D-IC feature requirements, enhancement requests, and AI co-development opportunities.\nPartake in deep-dive discussions to provide guidelines to various organizations across AMD.\nDevelop and integrate end-to-end AI capabilities into CAD flows - including ML-based optimization, predictive modeling, and LLM-assisted automation.\nDefine strategy and key initiatives to ensure flows meet future design requirements and advanced technology nodes.\nRegress methodology, analyze results, and develop capabilities that measurably improve quality of results.\nWork closely with design and CAD implementation teams to deliver tools and flows meeting key QoR metrics: Timing, Area, and Performance.\nACADEMIC CREDENTIALS:\nBachelors or Masters degree in computer engineering/Electrical Engineering\nLOCATION: Austin, TX\nThis role is not eligible for visa sponsorship.\n#LI-SL3\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.\nTHE ROLE:\nOur CAD team delivers automated environments for industry-leading methodologies for 3D IC stack and advanced packaging design. Our flows encompass 3D netlist and physical design, advanced packaging implementation, and 3D analysis across EMIR, PERC/ESD, physical verification, and STA. 3D design and advance packaging complexity continue in increase. AMD designs are complex heterogeneous systems requiring a mix of specialized in-house capabilities while leveraging best in class EDA vendor solutions.\nThis role is part of a global CAD team working in concert with mulitple design teams. You will collaborate directly with project teams to understand design requirements and deliver innovative solutions. The ideal candidate brings a strong silicon hardware design background, scripting proficiency, and hands-on experience applying machine learning to CAD or EDA workflows.\nTHE PERSON:\nYou have a passion for modern, complex processor architecture, digital design, and the automation that makes it scale. You are energized by the intersection of AI and CAD - whether that means applying ML models to improve QoR, building LLM-assisted flows, or designing agentic systems that reduce manual iteration. You are a team player with excellent communication skills, comfortable collaborating across sites and time zones, and eager to take on hard, open-ended problems.\nPREFERRED EXPERIENCE:\nStrong understanding of industry EDA tools, with emphasis on place-and-route, extraction, and analysis tools (e.g., ICC2, Innovus, Primetime, etc.).\nFamiliarity with chip- or system-level netlists and ability to debug connectivity across industry-standard formats (DEF/LEF/SPEF/Verilog/UPF/OAS/GDS).\nExposure with system level design verification processes including LEC, LVS, DRC, etc.\nComfort navigating large datasets and utilizing automation, distributed and cloud compute environments.\nDemonstrated experience applying AI (ML-based optimization, LLM-assisted automation, agentic frameworks) to CAD, EDA, or hardware design problems.\nStrong scripting skills in Python, TCL, and Perl within a Linux/Unix environment.\nExperience with advanced-node tapeouts across silicon technologies.\nExposure to Advanced Packaging technologies preferred (2.5D, 3D, 3.5D, including interposers and silcion bridges).\nExposure to chip-level construction (PDN, bump planning) and analysis a plus.\nExcellent verbal and written communication skills.\nKEY RESPONSIBILITIES:\nImplement and maintain 3D-IC and advanced packaging design flows from RTL through signoff.\nLead hands-on debug and automation involving large chip level physical and logical netlists.\nPartner with EDA vendors (Synopsys, Cadence) on 3D-IC feature requirements, enhancement requests, and AI co-development opportunities.\nPartake in deep-dive discussions to provide guidelines to various organizations across AMD.\nDevelop and integrate end-to-end AI capabilities into CAD flows - including ML-based optimization, predictive modeling, and LLM-assisted automation.\nDefine strategy and key initiatives to ensure flows meet future design requirements and advanced technology nodes.\nRegress methodology, analyze results, and develop capabilities that measurably improve quality of results.\nWork closely with design and CAD implementation teams to deliver tools and flows meeting key QoR metrics: Timing, Area, and Performance.\nACADEMIC CREDENTIALS:\nBachelors or Masters degree in computer engineering/Electrical Engineering\nLOCATION: Austin, TX\nThis role is not eligible for visa sponsorship.\n#LI-SL3\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.","description_format":"text","description_chars":9546,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Incident Response","Processors, MCUs & AI Chips","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-20T09:28:01Z"},{"event":"close","at":"2026-11-04T01:47:01Z"},{"event":"reopen","at":"2026-11-04T06:53:24Z"},{"event":"close","at":"2026-11-04T18:06:17Z"}],"visa":[],"liveness":null,"pay":null,"html_url":"https://alion.io/job/amd-3d-ic-and-soc-cad-engineer","json_url":"https://alion.io/job/amd-3d-ic-and-soc-cad-engineer.json","meta":{"generated_at":"2026-11-09T07:10:36Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":4092,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-10T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.1,"usd":0.01,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":93},"rest":"https://alion.io/mcp/rest/get_company?id=93"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Famd-3d-ic-and-soc-cad-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":2,"usd":0.2},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Famd-3d-ic-and-soc-cad-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.1,"usd":0.01},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Famd-3d-ic-and-soc-cad-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/amd-3d-ic-and-soc-cad-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Famd-3d-ic-and-soc-cad-engineer"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":2910629}},{"tool":"search_jobs","arguments":{"company":"amd.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":2910629},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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