{"id":3378130,"url":"https://alion.io/job/amd-advanced-smt-process-development-engineer-2","title":"Advanced SMT Process Development Engineer","company":{"id":93,"name":"AMD","domain":"amd.com","url":"https://alion.io/company/amd","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Jibe","truth_index":{"grade":"A","score":95,"open_postings":7,"ghost_share":0,"stale_share":0,"repost_share":0,"time_to_fill_p50_days":80,"computed_at":"2026-10-31T05:58:55Z"}},"role":"Biotech","role_family":"Biotech","seniority":null,"employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["George Town, Malaysia"],"countries":["MY"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":20000,"max_usd":52000,"period":"year","method":null,"sample_n":1456},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Cadence Allegro","optional":true},{"name":"JMP","optional":true},{"name":"Minitab","optional":true}],"status":"live","first_seen_at":"2026-10-28T02:47:00Z","employer_posted_date":"2026-10-28","last_verified_at":"2026-10-31T17:13:40Z","board_verified":true,"closed_at":null,"days_open":3,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":3},"description":"ADVANCE YOUR CAREER. ADVANCE THE WORLD.\nAt AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.\nWhether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger - technology that moves the world forward. Join us and, together, we’ll advance your career.\nTHE ROLE:\nYou will be AMD's senior technical expert for advanced SMT and board-assembly process development on high-complexity computing platforms. You will define assembly strategies, influence product design, and make complex PCB assemblies manufacturable, especially those with large BGA packages and significant warpage and coplanarity challenges. Your work will set the standards that manufacturing partners use worldwide.\nTHE PERSON:\nYou are a hands-on technical authority who solves non-standard assembly problems using data and engineering judgment. You influence decisions across package, PCB, thermal/mechanical, reliability and manufacturing teams without direct people management, and you communicate complex topics clearly to different audiences.\nKEY RESPONSIBILITIES:\nLead end-to-end SMT process development (stencil/printing, placement, reflow, post-reflow) and define robust process windows for yield, reliability and scale.\nOwn assembly of large, high-warpage BGA packages. Turn warpage, coplanarity and thermal data into design rules, process controls and board-support/fixture concepts.\nReduce solder defects (insufficient solder, head-in-pillow, bridging, voiding) through stencil design, paste/flux selection and reflow optimization, including vacuum and inert-atmosphere reflow.\nDefine and qualify edge bonding and underfill strategies to improve mechanical shock, vibration and board-level reliability. Develop manufacturable processes for integrating mechanical and thermal hardware (heatsinks, clamping, thermal interface materials).\nEvaluate how mechanical stress transfers to solder joints. Make sure post-SMT and controlled BGA rework processes are repeatable, auditable and meet reliability requirements.\nLead DFM reviews (land patterns, via-in-pad, solder mask, keep-outs), and author board-assembly guidelines and BKMs for internal teams and EMS partners.\nRun DOEs and root-cause analysis for complex yield and reliability issues. Evaluate new technologies such as low-temperature solder, micro spring/spacer and removable-lid concepts.\nWork with contract manufacturers, material suppliers and equipment vendors to qualify capability and drive improvements.\nPREFERRED EXPERIENCE:\nExtensive hands-on SMT process development for high-complexity PCB assemblies, from engineering builds to high-volume manufacturing.\nProven experience with large BGAs (>70 mm) and high warpage (~400-500 µm), including warpage measurement (Shadow Moiré, DIC) and inspection (X-ray, C-SAM).\nStrong DOE, statistical and root-cause analysis skills (Minitab, JMP or equivalent).\nKnowledge of IPC/J-STD standards and board-level reliability qualification (temperature cycling, vibration, mechanical shock, failure analysis).\nExperience working with global EMS partners and equipment vendors.\nFamiliarity with PCB CAD tools (Mentor Graphics, Cadence Allegro or Pentalogix) for DFM review.\nACADEMIC CREDENTIALS:\nBachelor's or Master's degree in Manufacturing Engineering, Mechanical Engineering, Materials Science or a related discipline.\nLOCATION:\nPenang, Malaysia\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.\nTHE ROLE:\nYou will be AMD's senior technical expert for advanced SMT and board-assembly process development on high-complexity computing platforms. You will define assembly strategies, influence product design, and make complex PCB assemblies manufacturable, especially those with large BGA packages and significant warpage and coplanarity challenges. Your work will set the standards that manufacturing partners use worldwide.\nTHE PERSON:\nYou are a hands-on technical authority who solves non-standard assembly problems using data and engineering judgment. You influence decisions across package, PCB, thermal/mechanical, reliability and manufacturing teams without direct people management, and you communicate complex topics clearly to different audiences.\nKEY RESPONSIBILITIES:\nLead end-to-end SMT process development (stencil/printing, placement, reflow, post-reflow) and define robust process windows for yield, reliability and scale.\nOwn assembly of large, high-warpage BGA packages. Turn warpage, coplanarity and thermal data into design rules, process controls and board-support/fixture concepts.\nReduce solder defects (insufficient solder, head-in-pillow, bridging, voiding) through stencil design, paste/flux selection and reflow optimization, including vacuum and inert-atmosphere reflow.\nDefine and qualify edge bonding and underfill strategies to improve mechanical shock, vibration and board-level reliability. Develop manufacturable processes for integrating mechanical and thermal hardware (heatsinks, clamping, thermal interface materials).\nEvaluate how mechanical stress transfers to solder joints. Make sure post-SMT and controlled BGA rework processes are repeatable, auditable and meet reliability requirements.\nLead DFM reviews (land patterns, via-in-pad, solder mask, keep-outs), and author board-assembly guidelines and BKMs for internal teams and EMS partners.\nRun DOEs and root-cause analysis for complex yield and reliability issues. Evaluate new technologies such as low-temperature solder, micro spring/spacer and removable-lid concepts.\nWork with contract manufacturers, material suppliers and equipment vendors to qualify capability and drive improvements.\nPREFERRED EXPERIENCE:\nExtensive hands-on SMT process development for high-complexity PCB assemblies, from engineering builds to high-volume manufacturing.\nProven experience with large BGAs (>70 mm) and high warpage (~400-500 µm), including warpage measurement (Shadow Moiré, DIC) and inspection (X-ray, C-SAM).\nStrong DOE, statistical and root-cause analysis skills (Minitab, JMP or equivalent).\nKnowledge of IPC/J-STD standards and board-level reliability qualification (temperature cycling, vibration, mechanical shock, failure analysis).\nExperience working with global EMS partners and equipment vendors.\nFamiliarity with PCB CAD tools (Mentor Graphics, Cadence Allegro or Pentalogix) for DFM review.\nACADEMIC CREDENTIALS:\nBachelor's or Master's degree in Manufacturing Engineering, Mechanical Engineering, Materials Science or a related discipline.\nLOCATION:\nPenang, Malaysia\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.","description_format":"text","description_chars":8598,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[{"name":"Malaysia","iso":"MY","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Electronics Manufacturing","Processors, MCUs & AI Chips","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-28T03:38:20Z"}],"visa":[],"liveness":{"score":90,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.903,"p_room":1,"age_days":3,"expected_fill_days":80,"reasons":["conf:3","velocity","win:early","comp:brand"],"computed_at":"2026-10-31T05:58:55Z"},"pay":null,"html_url":"https://alion.io/job/amd-advanced-smt-process-development-engineer-2","json_url":"https://alion.io/job/amd-advanced-smt-process-development-engineer-2.json","meta":{"generated_at":"2026-10-31T20:30:38Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":32265,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-01T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":93},"rest":"https://alion.io/mcp/rest/get_company?id=93"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Famd-advanced-smt-process-development-engineer-2"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Famd-advanced-smt-process-development-engineer-2"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Famd-advanced-smt-process-development-engineer-2"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/amd-advanced-smt-process-development-engineer-2\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Famd-advanced-smt-process-development-engineer-2"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":3378130}},{"tool":"search_jobs","arguments":{"company":"amd.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":3378130},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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