{"id":3424071,"url":"https://alion.io/job/amd-director-advanced-packaging-panel-scale-technologies","title":"Director – Advanced Packaging (Panel-Scale Technologies)","company":{"id":93,"name":"AMD","domain":"amd.com","url":"https://alion.io/company/amd","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Jibe","truth_index":{"grade":"A","score":92,"open_postings":16,"ghost_share":0,"stale_share":0.125,"repost_share":0,"time_to_fill_p50_days":61,"computed_at":"2026-11-05T05:54:30Z"}},"role":"Hardware","role_family":"Hardware","seniority":"head","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Austin, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":205000,"max_usd":376000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":80},"experience_years_min":null,"visa_sponsorship":true,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-10-28T18:28:00Z","employer_posted_date":"2026-10-28","last_verified_at":"2026-11-05T20:08:33Z","board_verified":true,"closed_at":null,"days_open":8,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":8},"description":"ADVANCE YOUR CAREER. ADVANCE THE WORLD.\nAt AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.\nWhether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger - technology that moves the world forward. Join us and, together, we’ll advance your career.\nThe Role\nWe are seeking an advanced packaging technology leader to drive panel-scale packaging technology for next-generation data center and AI accelerator products. As a fabless company, AMD delivers packaging innovation through its ecosystem partners. In this role, you will set the panel-scale technology direction and lead through foundry, OSAT, substrate, materials, and equipment partners to define and deliver the materials, processes, design rules, and Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines that AMD products require.\nYou will own panel-scale technology readiness from concept through qualification and high-volume manufacturing, aligning partner roadmaps with AMD needs, holding partners accountable to technical and schedule commitments, and leading cross-functional AMD teams across geographies. You will communicate progress and risks to executive leadership and drive joint resolution of yield, reliability, and manufacturability challenges.\nThe Person\nYou have a proven track record of driving semiconductor technology development through external partners, ideally in advanced packaging for data center products. You lead through influence, building trusted, technically deep relationships with suppliers and foundries while setting clear requirements and driving execution. You are an excellent communicator who can convey complex technical findings and recommendations to partners, colleagues, and AMD executive leadership.\nKey Responsibilities\nDefine the panel-scale packaging technology roadmap for data center and AI products and align partner technology roadmaps to it.\nLead panel-scale technology development with partners-including panel-level fan-out, large-format RDL(re-distribution layer) and interposers, and panel-scale die bonding-from concept through full qualification.\nSet technical requirements and guide partners in materials selection and process definition, ensuring solutions meet AMD performance, reliability, and cost targets.\nWork with partners to establish design rules and DFM/DFY guidelines, using jointly defined test vehicles to validate capability.\nDrive partner equipment and infrastructure readiness for panel-format manufacturing.\nEngage partners to resolve large-panel challenges including warpage, dimensional stability, overlay and alignment, and large-area uniformity.\nEstablish yield and reliability targets, monitor partner data, and drive joint improvement plans through high-volume ramp.\nLead cross-functional AMD teams across geographies and provide executive-level updates on partner progress, risks, and decisions.\nPreferred Experience\nSemiconductor technology development.\nLeading technology development through foundries, OSATs, substrate suppliers, materials suppliers, and equipment vendors.\nDeep knowledge of 2.5D and 3D packaging, with experience in panel-level packaging or large-format substrates.\nExperience in wafer-level assembly processes such as fan-out, RDL fabrication, bumping, chip-on-wafer assembly, molding, temporary bonding/debonding, and wafer thinning.\nExperience with die bonding technologies, including mass reflow, thermocompression bonding (TCB), and hybrid bonding.\nFamiliarity with emerging panel technologies such as glass-core substrates and panel-level RDL and interposers.\nBreadth of experience addressing thermo-mechanical, power delivery, and signal integrity challenges in large, high-power data center packages.\nProven track record of qualifying new packaging technologies with partners for advanced data center products and ramping them to high-volume manufacturing.\nLeadership experience driving cross-functional teams and influencing external partners without direct authority.\nAcademic Credentials\nBS/MS/PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Applied Physics, Applied Mathematics, or equivalent.\nThis role is not eligible for visa sponsorship.\n#LI-AP1\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.\nThe Role\nWe are seeking an advanced packaging technology leader to drive panel-scale packaging technology for next-generation data center and AI accelerator products. As a fabless company, AMD delivers packaging innovation through its ecosystem partners. In this role, you will set the panel-scale technology direction and lead through foundry, OSAT, substrate, materials, and equipment partners to define and deliver the materials, processes, design rules, and Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines that AMD products require.\nYou will own panel-scale technology readiness from concept through qualification and high-volume manufacturing, aligning partner roadmaps with AMD needs, holding partners accountable to technical and schedule commitments, and leading cross-functional AMD teams across geographies. You will communicate progress and risks to executive leadership and drive joint resolution of yield, reliability, and manufacturability challenges.\nThe Person\nYou have a proven track record of driving semiconductor technology development through external partners, ideally in advanced packaging for data center products. You lead through influence, building trusted, technically deep relationships with suppliers and foundries while setting clear requirements and driving execution. You are an excellent communicator who can convey complex technical findings and recommendations to partners, colleagues, and AMD executive leadership.\nKey Responsibilities\nDefine the panel-scale packaging technology roadmap for data center and AI products and align partner technology roadmaps to it.\nLead panel-scale technology development with partners-including panel-level fan-out, large-format RDL(re-distribution layer) and interposers, and panel-scale die bonding-from concept through full qualification.\nSet technical requirements and guide partners in materials selection and process definition, ensuring solutions meet AMD performance, reliability, and cost targets.\nWork with partners to establish design rules and DFM/DFY guidelines, using jointly defined test vehicles to validate capability.\nDrive partner equipment and infrastructure readiness for panel-format manufacturing.\nEngage partners to resolve large-panel challenges including warpage, dimensional stability, overlay and alignment, and large-area uniformity.\nEstablish yield and reliability targets, monitor partner data, and drive joint improvement plans through high-volume ramp.\nLead cross-functional AMD teams across geographies and provide executive-level updates on partner progress, risks, and decisions.\nPreferred Experience\nSemiconductor technology development.\nLeading technology development through foundries, OSATs, substrate suppliers, materials suppliers, and equipment vendors.\nDeep knowledge of 2.5D and 3D packaging, with experience in panel-level packaging or large-format substrates.\nExperience in wafer-level assembly processes such as fan-out, RDL fabrication, bumping, chip-on-wafer assembly, molding, temporary bonding/debonding, and wafer thinning.\nExperience with die bonding technologies, including mass reflow, thermocompression bonding (TCB), and hybrid bonding.\nFamiliarity with emerging panel technologies such as glass-core substrates and panel-level RDL and interposers.\nBreadth of experience addressing thermo-mechanical, power delivery, and signal integrity challenges in large, high-power data center packages.\nProven track record of qualifying new packaging technologies with partners for advanced data center products and ramping them to high-volume manufacturing.\nLeadership experience driving cross-functional teams and influencing external partners without direct authority.\nAcademic Credentials\nBS/MS/PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Applied Physics, Applied Mathematics, or equivalent.\nThis role is not eligible for visa sponsorship.\n#LI-AP1\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.","description_format":"text","description_chars":10346,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-28T21:46:35Z"}],"visa":[],"liveness":{"score":90,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.903,"p_room":1,"age_days":7,"expected_fill_days":61,"reasons":["conf:2","velocity","win:early","comp:brand"],"computed_at":"2026-11-05T05:54:30Z"},"pay":null,"html_url":"https://alion.io/job/amd-director-advanced-packaging-panel-scale-technologies","json_url":"https://alion.io/job/amd-director-advanced-packaging-panel-scale-technologies.json","meta":{"generated_at":"2026-11-05T20:55:45Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":554,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-06T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":93},"rest":"https://alion.io/mcp/rest/get_company?id=93"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Famd-director-advanced-packaging-panel-scale-technologies"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Famd-director-advanced-packaging-panel-scale-technologies"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Famd-director-advanced-packaging-panel-scale-technologies"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/amd-director-advanced-packaging-panel-scale-technologies\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Famd-director-advanced-packaging-panel-scale-technologies"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":3424071}},{"tool":"search_jobs","arguments":{"company":"amd.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":3424071},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. Docs: https://alion.io/developers"}}