Failure analysis Development Engineer (Shift role)
Confirmed on the employer's own hiring board on Oct 20, 2026. First seen by Alion on Sep 4, 2026.
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THE ROLE
The Failure Analysis Engineer will be responsible for investigating yield and reliability issues on advanced microprocessors, graphics processors, and heterogeneous integration products built on leading-edge 3nm FinFET and below technologies. The role involves end-to-end failure analysis, advanced sample preparation, defect localization, and material characterization using state-of-the-art analytical techniques. This individual will work closely with product, process, and manufacturing teams to identify root causes of failures and drive continuous improvements in product quality, yield, and reliability.
THE PERSON
The ideal candidate is a hands-on semiconductor professional with strong expertise in failure analysis, device physics, and materials characterization. They are comfortable working with advanced analytical tools such as FIB, TEM, AFM, electron microscopy, and nano-probing techniques to solve complex silicon and package-level issues. The successful candidate is detail-oriented, technically curious, and capable of troubleshooting both process and equipment-related challenges. Experience mentoring junior engineers or technicians, combined with the ability to collaborate effectively across engineering and manufacturing teams, will be highly valued.
KEY RESPONSIBILITIES:
- The position focuses on the failure analysis of advanced microprocessors and graphics processors based on 3nm FINFET and below technologies.
- Perform comprehensive failure analysis including transistor nano-probing, electrical characterization using AFM, Electron Microscopy and Material Analysis.
- Perform advanced sample preparation for SoIC and other heterogeneous integration products, including planar, cross-sectional and site-specific preparation
- Prepare high-quality site-specific TEM lamellae using focused ion beam techniques for structural, material, interface, and defect characterization
- Conduct plasma FIB sample preparation and yield failure analysis on advanced products, including large-volume material removal, defect localization, cross-sectioning, and preparation for downstream analytical techniques
- Follow laboratory safety, EHS, operating procedures, and quality requirements, particularly when operating high-energy beam systems and handling chemicals during night shifts.
- Support continuous improvement and automation initiatives to increase sample-preparation success rate, throughput, tool utilization, and turnaround time.
- Support continuous improvement and automation initiatives to increase sample-preparation success rate, throughput, tool utilization, and turnaround time.
PREFERRED EXPERIENCE:
- Able to work in 12hrs alternate 4days / 3days night shift. Attractive allowance provided.
- Preferable to have mentored / managed junior engineers, associate engineers & technicians.
- Candidate should possess a fundamental understanding of device physics
- A strong background in semiconductor wafer processing and materials characterization is preferred.
- An ability to perform basic tool troubleshooting and interact with vendor to resolve tool issues.
- Candidates with experience in fabless semiconductor and wafer fabs are highly preferred.
ACADEMIC CREDENTIALS:
- B.Eng in Electrical Engineering, Microelectronics, Materials Engineering and related fields.
LOCATION:
Singapore
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
THE ROLE
The Failure Analysis Engineer will be responsible for investigating yield and reliability issues on advanced microprocessors, graphics processors, and heterogeneous integration products built on leading-edge 3nm FinFET and below technologies. The role involves end-to-end failure analysis, advanced sample preparation, defect localization, and material characterization using state-of-the-art analytical techniques. This individual will work closely with product, process, and manufacturing teams to identify root causes of failures and drive continuous improvements in product quality, yield, and reliability.
THE PERSON
The ideal candidate is a hands-on semiconductor professional with strong expertise in failure analysis, device physics, and materials characterization. They are comfortable working with advanced analytical tools such as FIB, TEM, AFM, electron microscopy, and nano-probing techniques to solve complex silicon and package-level issues. The successful candidate is detail-oriented, technically curious, and capable of troubleshooting both process and equipment-related challenges. Experience mentoring junior engineers or technicians, combined with the ability to collaborate effectively across engineering and manufacturing teams, will be highly valued.
KEY RESPONSIBILITIES:
- The position focuses on the failure analysis of advanced microprocessors and graphics processors based on 3nm FINFET and below technologies.
- Perform comprehensive failure analysis including transistor nano-probing, electrical characterization using AFM, Electron Microscopy and Material Analysis.
- Perform advanced sample preparation for SoIC and other heterogeneous integration products, including planar, cross-sectional and site-specific preparation
- Prepare high-quality site-specific TEM lamellae using focused ion beam techniques for structural, material, interface, and defect characterization
- Conduct plasma FIB sample preparation and yield failure analysis on advanced products, including large-volume material removal, defect localization, cross-sectioning, and preparation for downstream analytical techniques
- Follow laboratory safety, EHS, operating procedures, and quality requirements, particularly when operating high-energy beam systems and handling chemicals during night shifts.
- Support continuous improvement and automation initiatives to increase sample-preparation success rate, throughput, tool utilization, and turnaround time.
- Support continuous improvement and automation initiatives to increase sample-preparation success rate, throughput, tool utilization, and turnaround time.
PREFERRED EXPERIENCE:
- Able to work in 12hrs alternate 4days / 3days night shift. Attractive allowance provided.
- Preferable to have mentored / managed junior engineers, associate engineers & technicians.
- Candidate should possess a fundamental understanding of device physics
- A strong background in semiconductor wafer processing and materials characterization is preferred.
- An ability to perform basic tool troubleshooting and interact with vendor to resolve tool issues.
- Candidates with experience in fabless semiconductor and wafer fabs are highly preferred.
ACADEMIC CREDENTIALS:
- B.Eng in Electrical Engineering, Microelectronics, Materials Engineering and related fields.
LOCATION:
Singapore
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.