{"id":2912225,"url":"https://alion.io/job/amd-failure-analysis-engineer-power-thermal","title":"Failure Analysis Engineer - Power & Thermal","company":{"id":93,"name":"AMD","domain":"amd.com","url":"https://alion.io/company/amd","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Jibe","truth_index":{"grade":"B","score":80,"open_postings":157,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":15,"computed_at":"2026-10-22T06:10:10Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":null,"employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Secaucus, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":81000,"max_usd":191000,"period":"year","method":"role_country_seniority_unknown","sample_n":14270},"experience_years_min":null,"visa_sponsorship":true,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Linux","optional":true},{"name":"Python","optional":true},{"name":"Windows","optional":true}],"status":"live","first_seen_at":"2026-06-05T18:35:00Z","employer_posted_date":"2026-10-20","last_verified_at":"2026-10-22T11:40:18Z","board_verified":true,"closed_at":null,"days_open":138,"trust":{"level":"stale","repost_count":0,"flags":["stale"],"days_open":138},"description":"WHAT YOU DO AT AMD CHANGES EVERYTHING\nAt AMD, our mission is to build great products that accelerate next-generation computing experiences-from AI and data centers, to PCs, gamingand embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuityand a shared passion to create something extraordinary. When you join AMD, you’lldiscover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges-striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.Together, we advance your career.\nTHE ROLE:\nThe Quality Engineering team is looking for an experienced Failure Analysis Engineer focused on Power and Thermal, with strong expertise in power behavior, thermal analysis, liquid-cooling performance, failure isolation, and rail bring-up. This individual will support customer and factory failure investigations for GPU accelerators, with primary ownership of PCB triage and board-level fault isolation for power- and thermal-related issues. They will review schematics and layouts to develop targeted debug strategies, set up scope measurements and diagnostics, run functional test DOE’s to reproduce and isolate failures, and work closely with design, validation, FW, and manufacturing teams to accelerate root cause analysis and corrective actions. Your contributions will directly impact product quality, reliability, and customer satisfaction.\nTHE PERSON:\nThe ideal candidate is a hands-on engineer with a strong hardware foundation and deep experience in power- and thermal-related failure analysis, debug, and board bring-up. They bring a strong analytical mindset and are skilled at triaging complex PCB failures by narrowing issues to the board, component, rail, thermal condition, cooling behavior, or system interaction level. They are comfortable reviewing schematics, setting up scope captures, running diagnostics, and designing functional test DOE’s to reproduce and isolate hard-to-find failures, while working effectively across design, validation, manufacturing, and repair teams. A strong understanding of liquid-cooling fundamentals-including flow rates, heat dissipation, and thermal transfer behavior-is important for this role. Their communication and documentation skills enable clear reporting and collaboration, and their curiosity and persistence help drive timely, high-quality root cause analysis and corrective actions.\nKEY RESPONSIBILITIES:\nSupport internal and external requests to troubleshoot AMD GPU product failures with primary focus on Power and Thermal failure analysis, PCB triage, and board-level failure isolation for continuous yield, quality, and customer support improvements.\n\nDevelop and execute diagnostics, scope-based measurements, and functional test DOE’s to reproduce, characterize, and isolate difficult board-, power-, and thermal-related failures.\n\nDevelop Automation and tools to run tests and analyze results/logs.\n\nPerform structured PCB triage by narrowing failures to the board, component, power rail, layout interaction, or system integration level, and work with the contract manufacturer and internal AMD teams to reproduce failures, isolate root cause, and determine the most effective next steps for debug and corrective action.\n\nUse schematics, layout data, lab measurements, and power/thermal behavior knowledge to understand system behavior, trace likely fault paths, form debug hypotheses, and build targeted validation plans that drive efficient fault isolation and high-quality failure analysis.\n\nAnalyze liquid-cooling performance and thermal dissipation behavior, including flow-related conditions, heat transfer effectiveness, and cooling-path anomalies, to support efficient root cause analysis of Power and Thermal failures.\n\nDocument all findings into FA database and create a complete failure analysis report for customer consumption as needed.\n\nPresent findings to key stakeholders, including senior management.\n\nImplement ongoing continuous improvements of failure analysis process & techniques and create procedures of the steps to follow.\n\nOversee the set-up of new products and test stations for Failure Analysis operations.\n\nPREFERRED EXPERIENCE:\nDeep expertise in hardware debug fundamentals, Power and Thermal failure analysis, diagnostics, and structured failure reproduction, including functional test development.\n\nSkilled in using lab equipment (oscilloscopes, logic analyzers, power analyzers, and custom test tools) to capture scope shots, validate rails, characterize thermal behavior, and support hardware debug.\n\nWorking knowledge of liquid-cooling systems and thermal management concepts, including flow rates, heat dissipation, thermal transfer, and cooling loop behavior in high-power server environments.\n\nStrong background in PCB triage, board-level failure analysis, schematic review, diagnostics, and failure isolation techniques, with added experience debugging power and thermal issues from NPI through production.\n\nProficient in Python, shell scripting, and working across Windows and Linux environments.\n\nSolid understanding of firmware, drivers, and hardware interactions, with the ability to tune firmware as needed.\n\nExtensive experience in hardware verification and system integration.\n\nHands-on experience assembling, installing, and configuring computer systems and servers.\n\nStrong communication, documentation, collaboration, and presentation skills.\n\nAble to read schematics, interpret datasheets, identify components, and perform soldering/rework to support efficient hardware debug and failure isolation.\n\nKnowledge of high-speed digital design, power delivery networks, voltage regulator behavior, memory interfaces (HBM, GDDR), PCIe, and display outputs (DP, HDMI).\n\nExperience with GPU data center infrastructure and AI/ML technologies is a plus.\n\nACADEMIC CREDENTIALS:\nBachelor’s degree in Electrical Engineering, Computer Engineering, or a related field.\n\nThis role is not eligible for Visa sponsorship\n#LI-LB1\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.\nTHE ROLE:\nThe Quality Engineering team is looking for an experienced Failure Analysis Engineer focused on Power and Thermal, with strong expertise in power behavior, thermal analysis, liquid-cooling performance, failure isolation, and rail bring-up. This individual will support customer and factory failure investigations for GPU accelerators, with primary ownership of PCB triage and board-level fault isolation for power- and thermal-related issues. They will review schematics and layouts to develop targeted debug strategies, set up scope measurements and diagnostics, run functional test DOE’s to reproduce and isolate failures, and work closely with design, validation, FW, and manufacturing teams to accelerate root cause analysis and corrective actions. Your contributions will directly impact product quality, reliability, and customer satisfaction.\nTHE PERSON:\nThe ideal candidate is a hands-on engineer with a strong hardware foundation and deep experience in power- and thermal-related failure analysis, debug, and board bring-up. They bring a strong analytical mindset and are skilled at triaging complex PCB failures by narrowing issues to the board, component, rail, thermal condition, cooling behavior, or system interaction level. They are comfortable reviewing schematics, setting up scope captures, running diagnostics, and designing functional test DOE’s to reproduce and isolate hard-to-find failures, while working effectively across design, validation, manufacturing, and repair teams. A strong understanding of liquid-cooling fundamentals-including flow rates, heat dissipation, and thermal transfer behavior-is important for this role. Their communication and documentation skills enable clear reporting and collaboration, and their curiosity and persistence help drive timely, high-quality root cause analysis and corrective actions.\nKEY RESPONSIBILITIES:\nSupport internal and external requests to troubleshoot AMD GPU product failures with primary focus on Power and Thermal failure analysis, PCB triage, and board-level failure isolation for continuous yield, quality, and customer support improvements.\n\nDevelop and execute diagnostics, scope-based measurements, and functional test DOE’s to reproduce, characterize, and isolate difficult board-, power-, and thermal-related failures.\n\nDevelop Automation and tools to run tests and analyze results/logs.\n\nPerform structured PCB triage by narrowing failures to the board, component, power rail, layout interaction, or system integration level, and work with the contract manufacturer and internal AMD teams to reproduce failures, isolate root cause, and determine the most effective next steps for debug and corrective action.\n\nUse schematics, layout data, lab measurements, and power/thermal behavior knowledge to understand system behavior, trace likely fault paths, form debug hypotheses, and build targeted validation plans that drive efficient fault isolation and high-quality failure analysis.\n\nAnalyze liquid-cooling performance and thermal dissipation behavior, including flow-related conditions, heat transfer effectiveness, and cooling-path anomalies, to support efficient root cause analysis of Power and Thermal failures.\n\nDocument all findings into FA database and create a complete failure analysis report for customer consumption as needed.\n\nPresent findings to key stakeholders, including senior management.\n\nImplement ongoing continuous improvements of failure analysis process & techniques and create procedures of the steps to follow.\n\nOversee the set-up of new products and test stations for Failure Analysis operations.\n\nPREFERRED EXPERIENCE:\nDeep expertise in hardware debug fundamentals, Power and Thermal failure analysis, diagnostics, and structured failure reproduction, including functional test development.\n\nSkilled in using lab equipment (oscilloscopes, logic analyzers, power analyzers, and custom test tools) to capture scope shots, validate rails, characterize thermal behavior, and support hardware debug.\n\nWorking knowledge of liquid-cooling systems and thermal management concepts, including flow rates, heat dissipation, thermal transfer, and cooling loop behavior in high-power server environments.\n\nStrong background in PCB triage, board-level failure analysis, schematic review, diagnostics, and failure isolation techniques, with added experience debugging power and thermal issues from NPI through production.\n\nProficient in Python, shell scripting, and working across Windows and Linux environments.\n\nSolid understanding of firmware, drivers, and hardware interactions, with the ability to tune firmware as needed.\n\nExtensive experience in hardware verification and system integration.\n\nHands-on experience assembling, installing, and configuring computer systems and servers.\n\nStrong communication, documentation, collaboration, and presentation s...","description_format":"text","description_chars":13531,"description_truncated":true,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-20T09:52:16Z"}],"visa":[],"liveness":{"score":2,"band":"cold","label":"Long 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