{"id":2909990,"url":"https://alion.io/job/amd-packaging-design-engineer","title":"Packaging Design Engineer","company":{"id":93,"name":"AMD","domain":"amd.com","url":"https://alion.io/company/amd","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Jibe","truth_index":null},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":null,"employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Austin, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":77000,"max_usd":182000,"period":"year","method":"role_country_seniority_unknown","sample_n":14270},"experience_years_min":null,"visa_sponsorship":true,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-10-14T20:18:00Z","employer_posted_date":"2026-10-20","last_verified_at":"2026-10-21T02:27:25Z","board_verified":true,"closed_at":null,"days_open":6,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":6},"description":"ADVANCE YOUR CAREER. ADVANCE THE WORLD.\nAt AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.\nWhether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger - technology that moves the world forward. Join us and, together, we’ll advance your career.\nTHE ROLE:\nWe are seeking a Package Design Engineer to support complex package design execution. This role requires a self-driven technical expert who thrives in a fast-paced, dynamic, and high-pressure environment, and can deliver high-quality designs with speed, precision, and scalability. The successful candidate will play a key role in advancing AMD’s packaging methodologies by leveraging AI-driven design techniques, automation, and next-generation workflows to address the increasing complexity of heterogeneous integration and advanced packaging architectures.\nTHE PERSON:\nThe ideal candidate is an experienced package or silicon physical designer who:\nDemonstrates strong ownership and accountability across multiple programs\nExcels in fast-phase execution environments with competing priorities\nApplies AI/ML and automation to improve design productivity and quality\nOperates with minimal supervision while influencing cross-functional teams\nBalances deep technical expertise with strong collaboration and communication skills\nKEY RESPONSIBILITIES:\nDesign Execution & Technical Leadership\nPerform end-to-end package design execution for complex products, ensuring performance, cost, quality, and schedule targets are met\nHandle multiple concurrent design programs in a fast-paced and high-pressure environment\nDevelop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures) \nDrive design decisions through close collaboration with SI/PI, mechanical, and SOC teams\nCross-Functional Collaboration\nPartner with internal engineering teams, OSATs, and substrate suppliers to deliver optimized solutions \nInterface with stakeholders to communicate design status, risks, and mitigation strategies\nContribute to design reviews, signoff readiness, and tapeout processes\nMethodology & Continuous Improvement\nDefine and enhance package design methodologies, flows, and best practices\nDrive improvements in layout efficiency, reuse, and design standardization \nPREFERRED EXPERIENCE:\nDesigning complex substrate design or Silicon Bridge or Interposers\nProven ability to execute in multi-project, fast-phased, and high-pressure environments\nStrong experience in advanced packaging technologies: \nHands-on experience with EDA tools such as: \nExperience working with OSATs, foundries, and substrate vendors \nSolid understanding of Signal Integrity and Power Integrity fundamentals \nACADEMIC CREDENTIALS:\nBachelor’s or higher degree in Electrical Engineering, Computer Engineering, or related field\nThis role is not eligible for visa sponsorship.\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.\nTHE ROLE:\nWe are seeking a Package Design Engineer to support complex package design execution. This role requires a self-driven technical expert who thrives in a fast-paced, dynamic, and high-pressure environment, and can deliver high-quality designs with speed, precision, and scalability. The successful candidate will play a key role in advancing AMD’s packaging methodologies by leveraging AI-driven design techniques, automation, and next-generation workflows to address the increasing complexity of heterogeneous integration and advanced packaging architectures.\nTHE PERSON:\nThe ideal candidate is an experienced package or silicon physical designer who:\nDemonstrates strong ownership and accountability across multiple programs\nExcels in fast-phase execution environments with competing priorities\nApplies AI/ML and automation to improve design productivity and quality\nOperates with minimal supervision while influencing cross-functional teams\nBalances deep technical expertise with strong collaboration and communication skills\nKEY RESPONSIBILITIES:\nDesign Execution & Technical Leadership\nPerform end-to-end package design execution for complex products, ensuring performance, cost, quality, and schedule targets are met\nHandle multiple concurrent design programs in a fast-paced and high-pressure environment\nDevelop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures) \nDrive design decisions through close collaboration with SI/PI, mechanical, and SOC teams\nCross-Functional Collaboration\nPartner with internal engineering teams, OSATs, and substrate suppliers to deliver optimized solutions \nInterface with stakeholders to communicate design status, risks, and mitigation strategies\nContribute to design reviews, signoff readiness, and tapeout processes\nMethodology & Continuous Improvement\nDefine and enhance package design methodologies, flows, and best practices\nDrive improvements in layout efficiency, reuse, and design standardization \nPREFERRED EXPERIENCE:\nDesigning complex substrate design or Silicon Bridge or Interposers\nProven ability to execute in multi-project, fast-phased, and high-pressure environments\nStrong experience in advanced packaging technologies: \nHands-on experience with EDA tools such as: \nExperience working with OSATs, foundries, and substrate vendors \nSolid understanding of Signal Integrity and Power Integrity fundamentals \nACADEMIC CREDENTIALS:\nBachelor’s or higher degree in Electrical Engineering, Computer Engineering, or related field\nThis role is not eligible for visa sponsorship.\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.","description_format":"text","description_chars":7660,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Packaging & Labeling","Processors, MCUs & AI Chips","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-20T09:19:33Z"}],"visa":[],"liveness":{"score":70,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.778,"p_room":0.9,"age_days":6,"expected_fill_days":15,"reasons":["conf:3","win:mid","comp:brand"],"computed_at":"2026-10-21T05:46:44Z"},"pay":null,"html_url":"https://alion.io/job/amd-packaging-design-engineer","json_url":"https://alion.io/job/amd-packaging-design-engineer.json","meta":{"generated_at":"2026-10-21T05:46:44Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":8452,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-22T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":93},"rest":"https://alion.io/mcp/rest/get_company?id=93"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Famd-packaging-design-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Famd-packaging-design-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Famd-packaging-design-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/amd-packaging-design-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Famd-packaging-design-engineer"}]}