Packaging Engineer
Confirmed on the employer's own hiring board on Oct 23, 2026. First seen by Alion on Jul 10, 2026. AMD scores B on the Alion truth index.
WHAT YOU DO AT AMD CHANGES EVERYTHING
At AMD, our mission is to build great products that accelerate next-generation computing experiences-from AI and data centers, to PCs, gamingand embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuityand a shared passion to create something extraordinary. When you join AMD, you’lldiscover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges-striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.Together, we advance your career.
THE ROLE:
Help turn “possibility” into “reality” every day. At AMD, we push the boundaries of what is possible by delivering innovative, high-performance computing solutions across data center, AI, and advanced packaging technologies.
We are seeking a highly motivated and technically strong Member of Technical Staff (MTS) to support the package design organization in the development and deployment of AI-driven automation workflows. This role will focus on improving the efficiency, quality, and scalability of complex package, bridge, and interposer design.
The candidate will contribute to accelerating the design of advanced heterogeneous integration technologies, including substrates, silicon interposers, and bridge-based architectures, through automation, and AI-enabled methodologies. This role operates in a fast-paced, results-oriented environment and plays a critical part in enabling next-generation packaging innovation
THE PERSON:
The ideal candidate is a hands-on technical contributor with a strong foundation in advanced packaging design and automation, combined with a passion for applying AI/ML techniques to engineering workflows.
They are expected to:
- Translate complex design challenges into scalable automation solutions
- Work effectively across Design, EDA, and AI/ML teams
- Demonstrate strong problem-solving skills and ownership mindset
- Operate with limited supervision, delivering high-quality results aligned to project goals
- The candidate should be comfortable working in a multi-disciplinary environment and have strong communication skills to collaborate across internal and external stakeholders.
KEY RESPONSIBILITIES:
- Develop, deploy, and maintain automation frameworks and AI-assisted workflows for Package substrates, silicon interposers and bridge-based integration.
- Apply AI/ML methodologies to enhance key design activities such as auto-routing and placement optimization, signal integrity and power delivery improvements, design rule compliance and verification.
- Collaborate with package design team to identify high-impact automation opportunities, reduce manual design effort and cycle time, improve design robustness and quality.
- Partner with EDA tools teams and vendors to implement automation features, enhance tool capabilities and workflows, support next-generation advanced packaging design enablement
- Develop automation and tools to enable design flow integration, data extraction and analysis, closed-loop optimization with simulation teams
- Support execution of design milestones and tape-outs, ensuring automation readiness and quality
- Contribute to documentation, best practices, and reusable workflows for broader team adoption
PREFERRED EXPERIENCE:
- 5+ years of experience in semiconductor packaging or SOC physical design automation
- Strong working knowledge of EDA packaging tools such as Cadence APD / SiP, Siemens Xpedition and Synopsys 3DICC or equivalent
- Expertise in scripting and automation using Python (preferred), Tcl, SKILL, or C++
- Experience applying AI/ML techniques to engineering or design workflows. Familiarity with frameworks such as PyTorch or TensorFlow .
- Understanding of advanced packaging technologies such as 2.5D / 3D IC, Chiplets and heterogeneous integration, Bridge/interposer-based architectures
- Familiarity with Design verification flows (DRC/LVS), Parasitic extraction and SI/PI fundamentals
- Experience working with cross-functional teams (Design, SI/PI, Mechanical, EDA)
ACADEMIC CREDENTIALS:
Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, Computer Science or related field.
LOCATION:
Hsinchu, Taiwan
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#LI-HYBRID
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
THE ROLE:
Help turn “possibility” into “reality” every day. At AMD, we push the boundaries of what is possible by delivering innovative, high-performance computing solutions across data center, AI, and advanced packaging technologies.
We are seeking a highly motivated and technically strong Member of Technical Staff (MTS) to support the package design organization in the development and deployment of AI-driven automation workflows. This role will focus on improving the efficiency, quality, and scalability of complex package, bridge, and interposer design.
The candidate will contribute to accelerating the design of advanced heterogeneous integration technologies, including substrates, silicon interposers, and bridge-based architectures, through automation, and AI-enabled methodologies. This role operates in a fast-paced, results-oriented environment and plays a critical part in enabling next-generation packaging innovation
THE PERSON:
The ideal candidate is a hands-on technical contributor with a strong foundation in advanced packaging design and automation, combined with a passion for applying AI/ML techniques to engineering workflows.
They are expected to:
- Translate complex design challenges into scalable automation solutions
- Work effectively across Design, EDA, and AI/ML teams
- Demonstrate strong problem-solving skills and ownership mindset
- Operate with limited supervision, delivering high-quality results aligned to project goals
- The candidate should be comfortable working in a multi-disciplinary environment and have strong communication skills to collaborate across internal and external stakeholders.
KEY RESPONSIBILITIES:
- Develop, deploy, and maintain automation frameworks and AI-assisted workflows for Package substrates, silicon interposers and bridge-based integration.
- Apply AI/ML methodologies to enhance key design activities such as auto-routing and placement optimization, signal integrity and power delivery improvements, design rule compliance and verification.
- Collaborate with package design team to identify high-impact automation opportunities, reduce manual design effort and cycle time, improve design robustness and quality.
- Partner with EDA tools teams and vendors to implement automation features, enhance tool capabilities and workflows, support next-generation advanced packaging design enablement
- Develop automation and tools to enable design flow integration, data extraction and analysis, closed-loop optimization with simulation teams
- Support execution of design milestones and tape-outs, ensuring automation readiness and quality
- Contribute to documentation, best practices, and reusable workflows for broader team adoption
PREFERRED EXPERIENCE:
- 5+ years of experience in semiconductor packaging or SOC physical design automation
- Strong working knowledge of EDA packaging tools such as Cadence APD / SiP, Siemens Xpedition and Synopsys 3DICC or equivalent
- Expertise in scripting and automation using Python (preferred), Tcl, SKILL, or C++
- Experience applying AI/ML techniques to engineering or design workflows. Familiarity with frameworks such as PyTorch or TensorFlow .
- Understanding of advanced packaging technologies such as 2.5D / 3D IC, Chiplets and heterogeneous integration, Bridge/interposer-based architectures
- Familiarity with Design verification flows (DRC/LVS), Parasitic extraction and SI/PI fundamentals
- Experience working with cross-functional teams (Design, SI/PI, Mechanical, EDA)
ACADEMIC CREDENTIALS:
Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, Computer Science or related field.
LOCATION:
Hsinchu, Taiwan
#LI-SC1
#LI-HYBRID
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.