{"id":2912019,"url":"https://alion.io/job/amd-packaging-engineer-4","title":"Packaging Engineer","company":{"id":93,"name":"AMD","domain":"amd.com","url":"https://alion.io/company/amd","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Jibe","truth_index":{"grade":"B","score":75,"open_postings":163,"ghost_share":0,"stale_share":0.994,"repost_share":0,"time_to_fill_p50_days":28,"computed_at":"2026-10-24T06:02:35Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":null,"work_mode":"hybrid","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Hsinchu, Taiwan"],"countries":["TW"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":19000,"max_usd":44000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":7932},"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"C++","optional":true},{"name":"Mentor Xpedition","optional":true},{"name":"Python","optional":true},{"name":"PyTorch","optional":true},{"name":"TensorFlow","optional":true},{"name":"TensorFlow C++","optional":true}],"status":"live","first_seen_at":"2026-07-10T12:25:00Z","employer_posted_date":"2026-10-20","last_verified_at":"2026-10-24T06:43:09Z","board_verified":true,"closed_at":null,"days_open":105,"trust":{"level":"stale","repost_count":0,"flags":["stale"],"days_open":105},"description":"WHAT YOU DO AT AMD CHANGES EVERYTHING\nAt AMD, our mission is to build great products that accelerate next-generation computing experiences-from AI and data centers, to PCs, gamingand embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuityand a shared passion to create something extraordinary. When you join AMD, you’lldiscover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges-striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.Together, we advance your career.\nTHE ROLE:\nHelp turn “possibility” into “reality” every day. At AMD, we push the boundaries of what is possible by delivering innovative, high-performance computing solutions across data center, AI, and advanced packaging technologies.\nWe are seeking a highly motivated and technically strong Member of Technical Staff (MTS) to support the package design organization in the development and deployment of AI-driven automation workflows. This role will focus on improving the efficiency, quality, and scalability of complex package, bridge, and interposer design.\nThe candidate will contribute to accelerating the design of advanced heterogeneous integration technologies, including substrates, silicon interposers, and bridge-based architectures, through automation, and AI-enabled methodologies. This role operates in a fast-paced, results-oriented environment and plays a critical part in enabling next-generation packaging innovation\nTHE PERSON:\nThe ideal candidate is a hands-on technical contributor with a strong foundation in advanced packaging design and automation, combined with a passion for applying AI/ML techniques to engineering workflows.\nThey are expected to:\nTranslate complex design challenges into scalable automation solutions\nWork effectively across Design, EDA, and AI/ML teams\nDemonstrate strong problem-solving skills and ownership mindset\nOperate with limited supervision, delivering high-quality results aligned to project goals\nThe candidate should be comfortable working in a multi-disciplinary environment and have strong communication skills to collaborate across internal and external stakeholders.\nKEY RESPONSIBILITIES:\nDevelop, deploy, and maintain automation frameworks and AI-assisted workflows for Package substrates, silicon interposers and bridge-based integration.\nApply AI/ML methodologies to enhance key design activities such as auto-routing and placement optimization, signal integrity and power delivery improvements, design rule compliance and verification.\nCollaborate with package design team to identify high-impact automation opportunities, reduce manual design effort and cycle time, improve design robustness and quality.\nPartner with EDA tools teams and vendors to implement automation features, enhance tool capabilities and workflows, support next-generation advanced packaging design enablement\nDevelop automation and tools to enable design flow integration, data extraction and analysis, closed-loop optimization with simulation teams\nSupport execution of design milestones and tape-outs, ensuring automation readiness and quality\nContribute to documentation, best practices, and reusable workflows for broader team adoption\nPREFERRED EXPERIENCE:\n5+ years of experience in semiconductor packaging or SOC physical design automation\nStrong working knowledge of EDA packaging tools such as Cadence APD / SiP, Siemens Xpedition and Synopsys 3DICC or equivalent\nExpertise in scripting and automation using Python (preferred), Tcl, SKILL, or C++\nExperience applying AI/ML techniques to engineering or design workflows. Familiarity with frameworks such as PyTorch or TensorFlow .\nUnderstanding of advanced packaging technologies such as 2.5D / 3D IC, Chiplets and heterogeneous integration, Bridge/interposer-based architectures\nFamiliarity with Design verification flows (DRC/LVS), Parasitic extraction and SI/PI fundamentals\nExperience working with cross-functional teams (Design, SI/PI, Mechanical, EDA)\nACADEMIC CREDENTIALS:\nBachelor’s or higher degree in Electrical Engineering, Computer Engineering, Computer Science or related field.\n\nLOCATION:\nHsinchu, Taiwan\n#LI-SC1\n#LI-HYBRID\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.\nTHE ROLE:\nHelp turn “possibility” into “reality” every day. At AMD, we push the boundaries of what is possible by delivering innovative, high-performance computing solutions across data center, AI, and advanced packaging technologies.\nWe are seeking a highly motivated and technically strong Member of Technical Staff (MTS) to support the package design organization in the development and deployment of AI-driven automation workflows. This role will focus on improving the efficiency, quality, and scalability of complex package, bridge, and interposer design.\nThe candidate will contribute to accelerating the design of advanced heterogeneous integration technologies, including substrates, silicon interposers, and bridge-based architectures, through automation, and AI-enabled methodologies. This role operates in a fast-paced, results-oriented environment and plays a critical part in enabling next-generation packaging innovation\nTHE PERSON:\nThe ideal candidate is a hands-on technical contributor with a strong foundation in advanced packaging design and automation, combined with a passion for applying AI/ML techniques to engineering workflows.\nThey are expected to:\nTranslate complex design challenges into scalable automation solutions\nWork effectively across Design, EDA, and AI/ML teams\nDemonstrate strong problem-solving skills and ownership mindset\nOperate with limited supervision, delivering high-quality results aligned to project goals\nThe candidate should be comfortable working in a multi-disciplinary environment and have strong communication skills to collaborate across internal and external stakeholders.\nKEY RESPONSIBILITIES:\nDevelop, deploy, and maintain automation frameworks and AI-assisted workflows for Package substrates, silicon interposers and bridge-based integration.\nApply AI/ML methodologies to enhance key design activities such as auto-routing and placement optimization, signal integrity and power delivery improvements, design rule compliance and verification.\nCollaborate with package design team to identify high-impact automation opportunities, reduce manual design effort and cycle time, improve design robustness and quality.\nPartner with EDA tools teams and vendors to implement automation features, enhance tool capabilities and workflows, support next-generation advanced packaging design enablement\nDevelop automation and tools to enable design flow integration, data extraction and analysis, closed-loop optimization with simulation teams\nSupport execution of design milestones and tape-outs, ensuring automation readiness and quality\nContribute to documentation, best practices, and reusable workflows for broader team adoption\nPREFERRED EXPERIENCE:\n5+ years of experience in semiconductor packaging or SOC physical design automation\nStrong working knowledge of EDA packaging tools such as Cadence APD / SiP, Siemens Xpedition and Synopsys 3DICC or equivalent\nExpertise in scripting and automation using Python (preferred), Tcl, SKILL, or C++\nExperience applying AI/ML techniques to engineering or design workflows. Familiarity with frameworks such as PyTorch or TensorFlow .\nUnderstanding of advanced packaging technologies such as 2.5D / 3D IC, Chiplets and heterogeneous integration, Bridge/interposer-based architectures\nFamiliarity with Design verification flows (DRC/LVS), Parasitic extraction and SI/PI fundamentals\nExperience working with cross-functional teams (Design, SI/PI, Mechanical, EDA)\nACADEMIC CREDENTIALS:\nBachelor’s or higher degree in Electrical Engineering, Computer Engineering, Computer Science or related field.\n\nLOCATION:\nHsinchu, Taiwan\n#LI-SC1\n#LI-HYBRID\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.","description_format":"text","description_chars":9913,"description_truncated":false,"requirements":{"experience_years_min":5,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[{"name":"Taiwan","iso":"TW","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-20T09:44:57Z"}],"visa":[],"liveness":{"score":10,"band":"cold","label":"Long shot","p_open":1,"p_active":0.343,"p_room":0.28,"age_days":105,"expected_fill_days":28,"reasons":["conf:3","stale_co","wave","velocity","win:tail","crowd:brand"],"computed_at":"2026-10-24T06:02:35Z"},"pay":null,"html_url":"https://alion.io/job/amd-packaging-engineer-4","json_url":"https://alion.io/job/amd-packaging-engineer-4.json","meta":{"generated_at":"2026-10-24T09:09:39Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":13152,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-25T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":93},"rest":"https://alion.io/mcp/rest/get_company?id=93"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Famd-packaging-engineer-4"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Famd-packaging-engineer-4"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Famd-packaging-engineer-4"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/amd-packaging-engineer-4\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Famd-packaging-engineer-4"}]}