{"id":3397650,"url":"https://alion.io/job/amd-packaging-engineer-5","title":"Packaging Engineer","company":{"id":93,"name":"AMD","domain":"amd.com","url":"https://alion.io/company/amd","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Jibe","truth_index":{"grade":"B","score":78,"open_postings":158,"ghost_share":0,"stale_share":0.873,"repost_share":0,"time_to_fill_p50_days":34,"computed_at":"2026-11-01T06:10:25Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":null,"employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Hsinchu, Taiwan"],"countries":["TW"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":15000,"max_usd":28000,"period":"year","method":"role_country_seniority_unknown","sample_n":81},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"FMEA","optional":true},{"name":"Statistical Process Control","optional":true}],"status":"live","first_seen_at":"2026-10-28T09:24:00Z","employer_posted_date":"2026-10-28","last_verified_at":"2026-11-01T10:01:16Z","board_verified":true,"closed_at":null,"days_open":4,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":4},"description":"ADVANCE YOUR CAREER. ADVANCE THE WORLD.\nAt AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.\nWhether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger - technology that moves the world forward. Join us and, together, we’ll advance your career.\nTHE ROLE:\nMain role is to lead assembly technology development with OSAT and foundry partners. In parallel this individual is also expected to drive technology development across the industry to meet future requirements.\nTHE PERSON:\nThis individual should be self-motivated and is able to work independently with minimal supervision. Excellent communication skills to collaborate with both internal and external partners. Established relationship with industry partners in the field of advanced assembly technology specifically in large module on substrate assembly.\nKEY RESPONSIBILITIES:\nDrive OSAT to develop advanced assembly technology capabilities to meet technology development deliverables.\nCollaborate with integration and design teams to integrate assembly and design needs. Formulate plans to enhance assembly capabilities to meet design needs.\nEstablish ecosystem partners to identify assembly capability improvement roadmap\nPREFERRED EXPERIENCE:\nDemonstrated leadership skills in managing OSATs and teams with various backgrounds\nIn depth process knowledge of key assembly processes: die prep, various die bond methods, underfill, lid attach etc..\nHands-on experience on large module/die assembly challenges, chip on wafer/panel and chip on substrate experience.\nWell verse in typical technology development tools, FMEA, SPC, control plans, etc..\nAbility to communicate well in both English and Chinese language\nACADEMIC CREDENTIALS:\nMinimum Msc, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or equivalent.\nLOCATION:\nHsinchu / Kaohsiung Taiwan\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.\nTHE ROLE:\nMain role is to lead assembly technology development with OSAT and foundry partners. In parallel this individual is also expected to drive technology development across the industry to meet future requirements.\nTHE PERSON:\nThis individual should be self-motivated and is able to work independently with minimal supervision. Excellent communication skills to collaborate with both internal and external partners. Established relationship with industry partners in the field of advanced assembly technology specifically in large module on substrate assembly.\nKEY RESPONSIBILITIES:\nDrive OSAT to develop advanced assembly technology capabilities to meet technology development deliverables.\nCollaborate with integration and design teams to integrate assembly and design needs. Formulate plans to enhance assembly capabilities to meet design needs.\nEstablish ecosystem partners to identify assembly capability improvement roadmap\nPREFERRED EXPERIENCE:\nDemonstrated leadership skills in managing OSATs and teams with various backgrounds\nIn depth process knowledge of key assembly processes: die prep, various die bond methods, underfill, lid attach etc..\nHands-on experience on large module/die assembly challenges, chip on wafer/panel and chip on substrate experience.\nWell verse in typical technology development tools, FMEA, SPC, control plans, etc..\nAbility to communicate well in both English and Chinese language\nACADEMIC CREDENTIALS:\nMinimum Msc, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or equivalent.\nLOCATION:\nHsinchu / Kaohsiung Taiwan\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.","description_format":"text","description_chars":5634,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":true},"security_clearance":false,"languages":[{"language":"Chinese","level":"All levels","optional":true},{"language":"English","level":"All levels","optional":true}]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-28T13:08:01Z"}],"visa":[],"liveness":{"score":70,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.695,"p_room":1,"age_days":3,"expected_fill_days":34,"reasons":["conf:2","stale_co","wave","velocity","win:early","comp:brand"],"computed_at":"2026-11-01T06:10:25Z"},"pay":null,"html_url":"https://alion.io/job/amd-packaging-engineer-5","json_url":"https://alion.io/job/amd-packaging-engineer-5.json","meta":{"generated_at":"2026-11-01T11:26:23Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":17682,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-02T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":93},"rest":"https://alion.io/mcp/rest/get_company?id=93"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Famd-packaging-engineer-5"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Famd-packaging-engineer-5"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Famd-packaging-engineer-5"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/amd-packaging-engineer-5\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Famd-packaging-engineer-5"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":3397650}},{"tool":"search_jobs","arguments":{"company":"amd.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":3397650},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. Docs: https://alion.io/developers"}}