{"id":2909838,"url":"https://alion.io/job/amd-packaging-engineer-substrate","title":"Packaging Engineer, Substrate","company":{"id":93,"name":"AMD","domain":"amd.com","url":"https://alion.io/company/amd","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Jibe","truth_index":{"grade":"B","score":75,"open_postings":163,"ghost_share":0,"stale_share":0.994,"repost_share":0,"time_to_fill_p50_days":28,"computed_at":"2026-10-24T06:02:35Z"}},"role":"Semiconductors","role_family":"Semiconductors","seniority":null,"employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Hsinchu, Taiwan"],"countries":["TW"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":15000,"max_usd":28000,"period":"year","method":"role_country_seniority_unknown","sample_n":80},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Statistical Process Control","optional":true}],"status":"live","first_seen_at":"2026-10-20T03:28:00Z","employer_posted_date":"2026-10-20","last_verified_at":"2026-10-24T11:15:48Z","board_verified":true,"closed_at":null,"days_open":4,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":4},"description":"ADVANCE YOUR CAREER. ADVANCE THE WORLD.\nAt AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.\nWhether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger - technology that moves the world forward. Join us and, together, we’ll advance your career.\nTHE ROLE:\nWe are seeking a proactive team member for our External Manufacturing Operations (Substrate) team. This role is crucial in ensuring the stable supply of IC substrates for a leading CPU/GPU company. You will be responsible for driving key performance metrics related to NPI projects, supplier readiness, process optimization, and improvements in areas like yield, BCP, and CIP.\nTHE PERSON:\nThe successful candidate will be a strong team player with a problem-solving mindset, capable of meeting deadlines in a fast-paced, multitasking environment. You should have excellent communication, project management, and data analysis skills to effectively manage substrate suppliers. Proficiency in English (speaking, writing, and presenting) is essential.\nKEY RESPONSIBILITIES:\n Supplier Management:Manage substrate supplier from NPI bring up/qualification to production release.\nSubstrate supplier’s new production site bring up & qualification.\nOversee NPI/LVM/HVM yield monitoring, sustaining, and improvements.\nDrive HVM yield attainment and, sustaining issue resolution and prevention through data analytics and corrective actions.\nLead knowledge-sharing initiatives (Best Known Methods, lessons learned) and drive Continuous Improvement Projects (CIPs).\nMonitor supplier performance using scorecards and lead quarterly technical reviews to ensure improvements.\nLead projects to drive cross supplier performance improvement/quality enhancement.\n\nAdditional Responsibilities:Ad hoc tasks as assigned by the supervisor based on business needs.\n\nPREFERRED EXPERIENCE:\nExperience in IC Substrate industries.\nTechnical expertise in FC-BGA, LGA substrate manufacturing, assembly, and test processes.\nExperience in substrate development, from NPI to HVM, is a plus.\nStrong statistical knowledge (DOE, SPC, 6 Sigma) and expertise in data analysis and technical report writing.\nStrong interpersonal communication and teamwork skills.\nSolid time management and project management skills.\nACADEMIC CREDENTIALS:\nBachelor/MS degree in Mechanical or Material or Chemical Engineering\nLOCATION:\nHsinchu, Taiwan\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.\nTHE ROLE:\nWe are seeking a proactive team member for our External Manufacturing Operations (Substrate) team. This role is crucial in ensuring the stable supply of IC substrates for a leading CPU/GPU company. You will be responsible for driving key performance metrics related to NPI projects, supplier readiness, process optimization, and improvements in areas like yield, BCP, and CIP.\nTHE PERSON:\nThe successful candidate will be a strong team player with a problem-solving mindset, capable of meeting deadlines in a fast-paced, multitasking environment. You should have excellent communication, project management, and data analysis skills to effectively manage substrate suppliers. Proficiency in English (speaking, writing, and presenting) is essential.\nKEY RESPONSIBILITIES:\n Supplier Management:Manage substrate supplier from NPI bring up/qualification to production release.\nSubstrate supplier’s new production site bring up & qualification.\nOversee NPI/LVM/HVM yield monitoring, sustaining, and improvements.\nDrive HVM yield attainment and, sustaining issue resolution and prevention through data analytics and corrective actions.\nLead knowledge-sharing initiatives (Best Known Methods, lessons learned) and drive Continuous Improvement Projects (CIPs).\nMonitor supplier performance using scorecards and lead quarterly technical reviews to ensure improvements.\nLead projects to drive cross supplier performance improvement/quality enhancement.\n\nAdditional Responsibilities:Ad hoc tasks as assigned by the supervisor based on business needs.\n\nPREFERRED EXPERIENCE:\nExperience in IC Substrate industries.\nTechnical expertise in FC-BGA, LGA substrate manufacturing, assembly, and test processes.\nExperience in substrate development, from NPI to HVM, is a plus.\nStrong statistical knowledge (DOE, SPC, 6 Sigma) and expertise in data analysis and technical report writing.\nStrong interpersonal communication and teamwork skills.\nSolid time management and project management skills.\nACADEMIC CREDENTIALS:\nBachelor/MS degree in Mechanical or Material or Chemical Engineering\nLOCATION:\nHsinchu, Taiwan\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.","description_format":"text","description_chars":6666,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":null,"security_clearance":false,"languages":[{"language":"English","level":"Advanced (C1)","optional":false}]},"benefits":[],"hiring_locations":[{"name":"Taiwan","iso":"TW","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-20T09:19:33Z"}],"visa":[],"liveness":{"score":63,"band":"ok","label":"Likely open","p_open":1,"p_active":0.632,"p_room":1,"age_days":4,"expected_fill_days":28,"reasons":["conf:3","stale_co","velocity","win:early","comp:brand"],"computed_at":"2026-10-24T06:02:35Z"},"pay":null,"html_url":"https://alion.io/job/amd-packaging-engineer-substrate","json_url":"https://alion.io/job/amd-packaging-engineer-substrate.json","meta":{"generated_at":"2026-10-24T11:47:19Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":16859,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-25T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":93},"rest":"https://alion.io/mcp/rest/get_company?id=93"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Famd-packaging-engineer-substrate"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Famd-packaging-engineer-substrate"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Famd-packaging-engineer-substrate"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/amd-packaging-engineer-substrate\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Famd-packaging-engineer-substrate"}]}