{"id":2909981,"url":"https://alion.io/job/amd-packaging-engineer","title":"Packaging Engineer","company":{"id":93,"name":"AMD","domain":"amd.com","url":"https://alion.io/company/amd","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Jibe","truth_index":{"grade":"B","score":75,"open_postings":162,"ghost_share":0,"stale_share":0.994,"repost_share":0,"time_to_fill_p50_days":29,"computed_at":"2026-10-25T05:49:26Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":null,"employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Hsinchu, Taiwan"],"countries":["TW"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":15000,"max_usd":28000,"period":"year","method":"role_country_seniority_unknown","sample_n":80},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"AI Agents","optional":true},{"name":"JMP","optional":true},{"name":"Minitab","optional":true}],"status":"live","first_seen_at":"2026-10-15T01:48:00Z","employer_posted_date":"2026-10-20","last_verified_at":"2026-10-25T13:31:37Z","board_verified":true,"closed_at":null,"days_open":10,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":10},"description":"ADVANCE YOUR CAREER. ADVANCE THE WORLD.\nAt AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.\nWhether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger - technology that moves the world forward. Join us and, together, we’ll advance your career.\nTHE ROLE:\nBeing in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement in external Flip Chip bumping/fan out/RDL/on substrate assembly manufacturer on delivering key performance indices in terms on yield, excursion free and enabling new capabilities.\nTHE PERSON:\nThe successful candidates must have strong commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, conflict management skill, analytics & trouble shooting skill with strong interpersonal skills with good presentation skills. Good in writing and speaking in English.\nKEY RESPONSIBILITIES:\nDrive for supplier engagement on continuous improvement and new capabilities ahead of need.\nPlan and drive for New Product Introduction activities and Ramp Up readiness. \nDrive external manufacturer on issue resolution and issue prevention with leading indicators to proactively identify risks\nTimely execution of special work requests, with comprehensive reports. \nMonitor performance of external manufacturing site regarding yield, out of control lots of disposition, and any outliers reporting from internal or external parties.\nPlan and execute change management from internal or external parties.\nProactively identifies improvement opportunities and drives towards continuous improvement in process simplification and quality enhancement, be it in internal and external environments. \nOccasionally to support on site audit and travelling.\nMay involve in regional supplier management.\nAssist in additional duties as deemed fit by supervisor.\nPREFERRED EXPERIENCE:\nStrong knowledge in Bumping/fan out/RDL process (while Flip Chip assembly, advance package is added advantage)\nProven experience in process development, qualification, and high-volume manufacturing within a semiconductor ASIC environment\n\nFamiliar with tools (AI agents, JMP, minitab, failure analysis knowledge, package reliability knowledges) and industry standard (ESD, Jedec, Automotive).\nGood leadership and interpersonal relationship.\nGood English speaking, communication, and writing skills.\nACADEMIC CREDENTIALS:\nBachelor/MS degree in Mechanical or Material or Chemical Engineering\nLOCATION:\nHsinchu, Taiwan\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.\nTHE ROLE:\nBeing in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement in external Flip Chip bumping/fan out/RDL/on substrate assembly manufacturer on delivering key performance indices in terms on yield, excursion free and enabling new capabilities.\nTHE PERSON:\nThe successful candidates must have strong commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, conflict management skill, analytics & trouble shooting skill with strong interpersonal skills with good presentation skills. Good in writing and speaking in English.\nKEY RESPONSIBILITIES:\nDrive for supplier engagement on continuous improvement and new capabilities ahead of need.\nPlan and drive for New Product Introduction activities and Ramp Up readiness. \nDrive external manufacturer on issue resolution and issue prevention with leading indicators to proactively identify risks\nTimely execution of special work requests, with comprehensive reports. \nMonitor performance of external manufacturing site regarding yield, out of control lots of disposition, and any outliers reporting from internal or external parties.\nPlan and execute change management from internal or external parties.\nProactively identifies improvement opportunities and drives towards continuous improvement in process simplification and quality enhancement, be it in internal and external environments. \nOccasionally to support on site audit and travelling.\nMay involve in regional supplier management.\nAssist in additional duties as deemed fit by supervisor.\nPREFERRED EXPERIENCE:\nStrong knowledge in Bumping/fan out/RDL process (while Flip Chip assembly, advance package is added advantage)\nProven experience in process development, qualification, and high-volume manufacturing within a semiconductor ASIC environment\n\nFamiliar with tools (AI agents, JMP, minitab, failure analysis knowledge, package reliability knowledges) and industry standard (ESD, Jedec, Automotive).\nGood leadership and interpersonal relationship.\nGood English speaking, communication, and writing skills.\nACADEMIC CREDENTIALS:\nBachelor/MS degree in Mechanical or Material or Chemical Engineering\nLOCATION:\nHsinchu, Taiwan\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.","description_format":"text","description_chars":7136,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":null,"security_clearance":false,"languages":[{"language":"English","level":"All levels","optional":false}]},"benefits":[],"hiring_locations":[{"name":"Taiwan","iso":"TW","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-20T09:19:33Z"}],"visa":[],"liveness":{"score":53,"band":"ok","label":"Likely open","p_open":1,"p_active":0.587,"p_room":0.9,"age_days":10,"expected_fill_days":29,"reasons":["conf:0","stale_co","velocity","win:mid","comp:brand"],"computed_at":"2026-10-25T05:49:26Z"},"pay":null,"html_url":"https://alion.io/job/amd-packaging-engineer","json_url":"https://alion.io/job/amd-packaging-engineer.json","meta":{"generated_at":"2026-10-25T13:34:51Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":19311,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-26T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":93},"rest":"https://alion.io/mcp/rest/get_company?id=93"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Famd-packaging-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Famd-packaging-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Famd-packaging-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/amd-packaging-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Famd-packaging-engineer"}]}