{"id":2910167,"url":"https://alion.io/job/amd-silicon-design-engineer-4","title":"Silicon Design Engineer","company":{"id":93,"name":"AMD","domain":"amd.com","url":"https://alion.io/company/amd","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Jibe","truth_index":{"grade":"B","score":75,"open_postings":162,"ghost_share":0,"stale_share":0.994,"repost_share":0,"time_to_fill_p50_days":29,"computed_at":"2026-10-25T05:49:26Z"}},"role":"Hardware","role_family":"Hardware","seniority":null,"employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Hsinchu, Taiwan"],"countries":["TW"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":16000,"max_usd":39000,"period":"year","method":"role_country_seniority_unknown","sample_n":23},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"C++","optional":true},{"name":"Cadence Allegro","optional":true},{"name":"Mentor Xpedition","optional":true},{"name":"Python","optional":true},{"name":"PyTorch","optional":true},{"name":"TensorFlow","optional":true},{"name":"TensorFlow C++","optional":true}],"status":"live","first_seen_at":"2026-10-08T08:09:00Z","employer_posted_date":"2026-10-20","last_verified_at":"2026-10-25T13:31:37Z","board_verified":true,"closed_at":null,"days_open":17,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":17},"description":"ADVANCE YOUR CAREER. ADVANCE THE WORLD.\nAt AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.\nWhether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger - technology that moves the world forward. Join us and, together, we’ll advance your career.\nTHE ROLE:\nWe are looking for a hands-on automation engineer to drive the development and deployment of next-generation packaging design automation and AI-driven workflows. You will focus on accelerating the design of advanced heterogeneous integration technologies-specifically substrates, organic interposers, and bridge interconnects. AMD's environment is fast-paced, results-oriented, and built upon a legion of innovators with a passion for winning technology.\nTHE PERSON:\nThe successful candidate is a hands-on technical contributor who can bridge the gap between physical design requirements and software automation to build AI-driven workflows. He or she must have a drive for solutions and an aptitude to thrive in a multi-tasking environment, translating complex design challenges into scriptable, scalable workflows. They should possess good cross-functional collaboration skills to work across Design, EDA, and AI teams, with clear technical communication and documentation skills. Able to work effectively with minimal supervision and motivated to grow along the technical ladder.\nKEY RESPONSIBILITIES:\nDevelop, deploy, and maintain AI workflows for Substrate, Interposer, and Silicon Bridge design methodologies.\nApply AI/ML methodologies to optimize critical design stages, including auto-routing, component placement, and signal integrity optimization.\nWork with EDA vendors and internal stakeholders to evaluate and implement next-generation features for 2.5D and 3D packaging.\nContribute to the transition from manual design practices to \"Agentic\" and algorithmic design workflows.\nCollaborate with electrical and mechanical analysis teams to build closed-loop optimization systems that feed simulation results back into design construction.\nDocument and report automation efficiency gains, ROI, and tool-capability improvements.\nCollaborate with cross-functional teams to support critical design tape-outs and methodology milestones.\nShare coding best practices and packaging knowledge with peers.\nPREFERRED EXPERIENCE:\nStrong knowledge of EDA packaging design tools (Cadence APD/SiP, Siemens Xpedition, or Synopsys 3DIC/Compiler).\nHands-on track record of developing automation using Python, Tcl, SKILL, or C++.\nExperience applying AI/ML frameworks (PyTorch, TensorFlow, etc.) to engineering or design problems.\nFamiliarity with advanced packaging architectures (2.5D/3D, Chiplets, Fan-Out, Hybrid Bonding).\nFamiliarity with design verification flows (DRC/LVS) and electrical extraction concepts.\nExperience automating Cadence Allegro package databases (SKILL) and/or SI/PI data workflows (e.g., PowerSI) is a plus.\nGood teamwork and interpersonal skills.\nACADEMIC CREDENTIALS:\nBachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, with relevant packaging or CAD-automation experience.\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.\nTHE ROLE:\nWe are looking for a hands-on automation engineer to drive the development and deployment of next-generation packaging design automation and AI-driven workflows. You will focus on accelerating the design of advanced heterogeneous integration technologies-specifically substrates, organic interposers, and bridge interconnects. AMD's environment is fast-paced, results-oriented, and built upon a legion of innovators with a passion for winning technology.\nTHE PERSON:\nThe successful candidate is a hands-on technical contributor who can bridge the gap between physical design requirements and software automation to build AI-driven workflows. He or she must have a drive for solutions and an aptitude to thrive in a multi-tasking environment, translating complex design challenges into scriptable, scalable workflows. They should possess good cross-functional collaboration skills to work across Design, EDA, and AI teams, with clear technical communication and documentation skills. Able to work effectively with minimal supervision and motivated to grow along the technical ladder.\nKEY RESPONSIBILITIES:\nDevelop, deploy, and maintain AI workflows for Substrate, Interposer, and Silicon Bridge design methodologies.\nApply AI/ML methodologies to optimize critical design stages, including auto-routing, component placement, and signal integrity optimization.\nWork with EDA vendors and internal stakeholders to evaluate and implement next-generation features for 2.5D and 3D packaging.\nContribute to the transition from manual design practices to \"Agentic\" and algorithmic design workflows.\nCollaborate with electrical and mechanical analysis teams to build closed-loop optimization systems that feed simulation results back into design construction.\nDocument and report automation efficiency gains, ROI, and tool-capability improvements.\nCollaborate with cross-functional teams to support critical design tape-outs and methodology milestones.\nShare coding best practices and packaging knowledge with peers.\nPREFERRED EXPERIENCE:\nStrong knowledge of EDA packaging design tools (Cadence APD/SiP, Siemens Xpedition, or Synopsys 3DIC/Compiler).\nHands-on track record of developing automation using Python, Tcl, SKILL, or C++.\nExperience applying AI/ML frameworks (PyTorch, TensorFlow, etc.) to engineering or design problems.\nFamiliarity with advanced packaging architectures (2.5D/3D, Chiplets, Fan-Out, Hybrid Bonding).\nFamiliarity with design verification flows (DRC/LVS) and electrical extraction concepts.\nExperience automating Cadence Allegro package databases (SKILL) and/or SI/PI data workflows (e.g., PowerSI) is a plus.\nGood teamwork and interpersonal skills.\nACADEMIC CREDENTIALS:\nBachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, with relevant packaging or CAD-automation experience.\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.","description_format":"text","description_chars":8196,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-20T09:19:33Z"}],"visa":[],"liveness":{"score":51,"band":"ok","label":"Likely open","p_open":1,"p_active":0.572,"p_room":0.9,"age_days":16,"expected_fill_days":29,"reasons":["conf:0","stale_co","wave","velocity","win:mid","comp:brand"],"computed_at":"2026-10-25T05:49:26Z"},"pay":null,"html_url":"https://alion.io/job/amd-silicon-design-engineer-4","json_url":"https://alion.io/job/amd-silicon-design-engineer-4.json","meta":{"generated_at":"2026-10-25T16:28:23Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":23680,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-26T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":93},"rest":"https://alion.io/mcp/rest/get_company?id=93"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Famd-silicon-design-engineer-4"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Famd-silicon-design-engineer-4"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Famd-silicon-design-engineer-4"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/amd-silicon-design-engineer-4\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Famd-silicon-design-engineer-4"}]}