{"id":2910103,"url":"https://alion.io/job/amd-sr-manager-packaging-engineering-3","title":"Sr. Manager Packaging Engineering","company":{"id":93,"name":"AMD","domain":"amd.com","url":"https://alion.io/company/amd","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Jibe","truth_index":null},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Markham, Canada"],"countries":["CA"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":67000,"max_usd":115000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":447},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"HPC","optional":true}],"status":"live","first_seen_at":"2026-10-09T18:54:00Z","employer_posted_date":"2026-10-20","last_verified_at":"2026-10-21T11:49:04Z","board_verified":true,"closed_at":null,"days_open":11,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":11},"description":"WHAT YOU DO AT AMD CHANGES EVERYTHING\nAt AMD, our mission is to build great products that accelerate next-generation computing experiences-from AI and data centers, to PCs, gamingand embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuityand a shared passion to create something extraordinary. When you join AMD, you’lldiscover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges-striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.Together, we advance your career.\n THE ROLE:\nHelp turn “possibility” into “reality” by leading the design execution of next-generation Data Center GPU and MI programs. This role represents a critical leadership position responsible for delivering high-performance, high-complexity package designs in a fast-paced environment.\nIn this role you will lead cross-functional teams across design, Signal/Power Integrity, substrate vendors, OSAT partners, and program management to ensure successful execution of multiple concurrent programs. You will drive operational excellence, scale execution using automation and AI-enabled methodologies, and deliver best-in-class package solutions that meet aggressive timelines and technical requirements.\nTHE PERSON :\nThe ideal candidate will have excellent program management and leadership skills. Can work with global cross functional teams in a fast paced environment and someone who can excel at influencing.\nKEY RESPONSIBILITIES:\nProgram & Execution Leadership\nLead end-to-end execution of multiple Data Center GPU / MI package design programs, ensuring schedule, quality, and cost targets are consistently met.\nDrive execution in fast-paced, dynamic, and high-pressure environments, managing competing priorities across programs.\nEstablish and maintain robust execution frameworks, including milestone tracking, risk management, and readiness gates.\nInterface with senior leadership to provide clear program status, risks, and mitigation strategies.\nTeam Leadership & Development\nLead, mentor, and grow a high-performing team of package design engineers across geographies.\nFoster a culture of accountability, innovation, and continuous improvement aligned with AMD engineering excellence.\nConduct performance reviews, talent development planning, and succession management.\nTechnical & Cross-Functional Leadership\nCollaborate with silicon, SI/PI, thermal, mechanical, and manufacturing teams to ensure design convergence.\nEngage with OSAT and substrate vendors to drive design feasibility, manufacturability, and yield optimization.\nProcess & Methodology Innovation\nDefine and drive improved design methodologies, workflows, and best practices to enhance execution efficiency.\nChampion adoption of AI/ML-enabled tools and automation (e.g., layout optimization, design rule checking, predictive analytics) to improve productivity and decision-making.\nScale digital transformation initiatives within the package design organization.\nPREFERRED EXPERIENCE:\nExperience in semiconductor package design, with strong focus on high-performance or data center products.\nProven experience leading teams and executing multiple concurrent complex projects in fast-paced environments.\nStrong understanding of package layout, high-speed design considerations, and multi-die integration.\nExperience with AI/ML applications in engineering workflows (design automation, data analytics, optimization).\nExcellent leadership, communication, and stakeholder management skills.\nDemonstrated ability to handle ambiguity, drive decisions, and deliver under pressure.\nExperience working with OSATs, substrate vendors, and manufacturing partners.\nHands-on experience with industry tools such as Synopsys 3DICC, Cadence SiP / APD or equivalent.\nExperience in Data Center GPU, HPC, or advanced packaging technologies (e.g., chiplets, 2.5D/3D integration).\nEDUCATION : B.S. or higher in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field.\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.\nTHE ROLE:\nHelp turn “possibility” into “reality” by leading the design execution of next-generation Data Center GPU and MI programs. This role represents a critical leadership position responsible for delivering high-performance, high-complexity package designs in a fast-paced environment.\nIn this role you will lead cross-functional teams across design, Signal/Power Integrity, substrate vendors, OSAT partners, and program management to ensure successful execution of multiple concurrent programs. You will drive operational excellence, scale execution using automation and AI-enabled methodologies, and deliver best-in-class package solutions that meet aggressive timelines and technical requirements.\nTHE PERSON :\nThe ideal candidate will have excellent program management and leadership skills. Can work with global cross functional teams in a fast paced environment and someone who can excel at influencing.\nKEY RESPONSIBILITIES:\nProgram & Execution Leadership\nLead end-to-end execution of multiple Data Center GPU / MI package design programs, ensuring schedule, quality, and cost targets are consistently met.\nDrive execution in fast-paced, dynamic, and high-pressure environments, managing competing priorities across programs.\nEstablish and maintain robust execution frameworks, including milestone tracking, risk management, and readiness gates.\nInterface with senior leadership to provide clear program status, risks, and mitigation strategies.\nTeam Leadership & Development\nLead, mentor, and grow a high-performing team of package design engineers across geographies.\nFoster a culture of accountability, innovation, and continuous improvement aligned with AMD engineering excellence.\nConduct performance reviews, talent development planning, and succession management.\nTechnical & Cross-Functional Leadership\nCollaborate with silicon, SI/PI, thermal, mechanical, and manufacturing teams to ensure design convergence.\nEngage with OSAT and substrate vendors to drive design feasibility, manufacturability, and yield optimization.\nProcess & Methodology Innovation\nDefine and drive improved design methodologies, workflows, and best practices to enhance execution efficiency.\nChampion adoption of AI/ML-enabled tools and automation (e.g., layout optimization, design rule checking, predictive analytics) to improve productivity and decision-making.\nScale digital transformation initiatives within the package design organization.\nPREFERRED EXPERIENCE:\nExperience in semiconductor package design, with strong focus on high-performance or data center products.\nProven experience leading teams and executing multiple concurrent complex projects in fast-paced environments.\nStrong understanding of package layout, high-speed design considerations, and multi-die integration.\nExperience with AI/ML applications in engineering workflows (design automation, data analytics, optimization).\nExcellent leadership, communication, and stakeholder management skills.\nDemonstrated ability to handle ambiguity, drive decisions, and deliver under pressure.\nExperience working with OSATs, substrate vendors, and manufacturing partners.\nHands-on experience with industry tools such as Synopsys 3DICC, Cadence SiP / APD or equivalent.\nExperience in Data Center GPU, HPC, or advanced packaging technologies (e.g., chiplets, 2.5D/3D integration).\nEDUCATION : B.S. or higher in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field.\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.","description_format":"text","description_chars":9550,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-20T09:19:33Z"}],"visa":[],"liveness":{"score":68,"band":"ok","label":"Likely open","p_open":1,"p_active":0.907,"p_room":0.75,"age_days":11,"expected_fill_days":15,"reasons":["conf:3","wave","velocity","win:late","comp:brand"],"computed_at":"2026-10-21T05:46:15Z"},"pay":null,"html_url":"https://alion.io/job/amd-sr-manager-packaging-engineering-3","json_url":"https://alion.io/job/amd-sr-manager-packaging-engineering-3.json","meta":{"generated_at":"2026-10-21T12:12:26Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":17341,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-22T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":93},"rest":"https://alion.io/mcp/rest/get_company?id=93"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Famd-sr-manager-packaging-engineering-3"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Famd-sr-manager-packaging-engineering-3"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Famd-sr-manager-packaging-engineering-3"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/amd-sr-manager-packaging-engineering-3\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Famd-sr-manager-packaging-engineering-3"}]}