{"id":2909949,"url":"https://alion.io/job/amd-technical-program-manager-thermal-mechanical-engineering","title":"Technical Program Manager, Thermal & Mechanical Engineering","company":{"id":93,"name":"AMD","domain":"amd.com","url":"https://alion.io/company/amd","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Jibe","truth_index":{"grade":"B","score":75,"open_postings":164,"ghost_share":0,"stale_share":0.994,"repost_share":0,"time_to_fill_p50_days":29,"computed_at":"2026-10-27T05:46:45Z"}},"role":"Product","role_family":"Product","seniority":null,"employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["George Town, Malaysia"],"countries":["MY"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":17500,"max_usd":50000,"period":"year","method":null,"sample_n":10387},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"FMEA","optional":true},{"name":"Power BI","optional":true},{"name":"Python","optional":true},{"name":"SQL","optional":true}],"status":"live","first_seen_at":"2026-10-16T08:36:00Z","employer_posted_date":"2026-10-20","last_verified_at":"2026-10-27T08:57:26Z","board_verified":true,"closed_at":null,"days_open":11,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":11},"description":"ADVANCE YOUR CAREER. ADVANCE THE WORLD.\nAt AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.\nWhether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger - technology that moves the world forward. Join us and, together, we’ll advance your career.\nTHE ROLE:\nYou will lead thermal, mechanical and advanced board-assembly development programs from requirements through engineering builds, qualification, manufacturing release and production ramp. You will connect package, board, cooling and chassis integration to make sure engineering and supplier deliverables support the product schedule. The role includes regional travel to supplier sites and engineering builds.\nTHE PERSON:\nYou are an individual contributor who drives decisions across global engineering, manufacturing and supplier teams without direct authority. You have enough technical depth to challenge assumptions and assess risk, while engineering owners keep design approval. You communicate clearly with engineers and executives alike.\nKEY RESPONSIBILITIES:\nDefine program scope, milestones, owners and acceptance criteria. Build integrated schedules and manage critical paths, resources and budgets.\nCoordinate package, board and chassis interfaces, including thermal, power, mechanical and assembly requirements, and assess the impact of design changes.\nLead execution reviews with cooling suppliers, CMs, ODMs and OSATs. Track specifications, samples, tooling, capacity, quality and recovery actions.\nPlan engineering and validation builds, and drive evidence-based entry and exit decisions at each milestone.\nCoordinate program deliverables for advanced SMT and large BGA assembly, including process windows, warpage mitigation, defect reduction, edge bond/underfill and BGA rework, with the responsible engineers.\nManage risks, issues, dependencies and engineering changes. Present recovery options with schedule, cost and qualification impact to decision-makers.\nDrive DFM/DFA reviews, release documentation, manufacturing handover, ramp issue closure and lessons learned.\nPREFERRED EXPERIENCE:\nSubstantial experience in thermal/mechanical hardware, electronic packaging or electronics NPI, including leading complex cross-functional technical programs.\nProven delivery from engineering development through qualification and production ramp.\nWorking knowledge of SMT processes and large BGA assembly challenges (warpage, coplanarity, solder-joint integrity) is advantageous.\nUnderstanding of the package-to-system heat path, TIMs, tolerance stack-ups, shock/vibration and board-level reliability qualification is advantageous.\nExperience managing cooling suppliers, CMs, ODMs or OSATs, preferably in the Asia-Pacific region is advantageous.\nExperience with DOE, root-cause analysis (8D, FMEA) and phase-gate program management is advantageous.\nProficient in English, technical writing and executive communication skills.\nHigh-performance computing, GPU or server programs; liquid/air cooling products; PMP or equivalent; Power BI, SQL or Python is advantageous.\nACADEMIC CREDENTIALS:\nBachelor's degree in Mechanical, Materials, Manufacturing, Electrical or Electronics Engineering, or a related discipline. Equivalent directly relevant experience may be considered.\nLOCATION:\nPenang, Malaysia\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.\nTHE ROLE:\nYou will lead thermal, mechanical and advanced board-assembly development programs from requirements through engineering builds, qualification, manufacturing release and production ramp. You will connect package, board, cooling and chassis integration to make sure engineering and supplier deliverables support the product schedule. The role includes regional travel to supplier sites and engineering builds.\nTHE PERSON:\nYou are an individual contributor who drives decisions across global engineering, manufacturing and supplier teams without direct authority. You have enough technical depth to challenge assumptions and assess risk, while engineering owners keep design approval. You communicate clearly with engineers and executives alike.\nKEY RESPONSIBILITIES:\nDefine program scope, milestones, owners and acceptance criteria. Build integrated schedules and manage critical paths, resources and budgets.\nCoordinate package, board and chassis interfaces, including thermal, power, mechanical and assembly requirements, and assess the impact of design changes.\nLead execution reviews with cooling suppliers, CMs, ODMs and OSATs. Track specifications, samples, tooling, capacity, quality and recovery actions.\nPlan engineering and validation builds, and drive evidence-based entry and exit decisions at each milestone.\nCoordinate program deliverables for advanced SMT and large BGA assembly, including process windows, warpage mitigation, defect reduction, edge bond/underfill and BGA rework, with the responsible engineers.\nManage risks, issues, dependencies and engineering changes. Present recovery options with schedule, cost and qualification impact to decision-makers.\nDrive DFM/DFA reviews, release documentation, manufacturing handover, ramp issue closure and lessons learned.\nPREFERRED EXPERIENCE:\nSubstantial experience in thermal/mechanical hardware, electronic packaging or electronics NPI, including leading complex cross-functional technical programs.\nProven delivery from engineering development through qualification and production ramp.\nWorking knowledge of SMT processes and large BGA assembly challenges (warpage, coplanarity, solder-joint integrity) is advantageous.\nUnderstanding of the package-to-system heat path, TIMs, tolerance stack-ups, shock/vibration and board-level reliability qualification is advantageous.\nExperience managing cooling suppliers, CMs, ODMs or OSATs, preferably in the Asia-Pacific region is advantageous.\nExperience with DOE, root-cause analysis (8D, FMEA) and phase-gate program management is advantageous.\nProficient in English, technical writing and executive communication skills.\nHigh-performance computing, GPU or server programs; liquid/air cooling products; PMP or equivalent; Power BI, SQL or Python is advantageous.\nACADEMIC CREDENTIALS:\nBachelor's degree in Mechanical, Materials, Manufacturing, Electrical or Electronics Engineering, or a related discipline. Equivalent directly relevant experience may be considered.\nLOCATION:\nPenang, Malaysia\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.","description_format":"text","description_chars":8494,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[{"language":"English","level":"Advanced (C1)","optional":true}]},"benefits":[],"hiring_locations":[{"name":"Malaysia","iso":"MY","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-20T09:19:33Z"}],"visa":[],"liveness":{"score":53,"band":"ok","label":"Likely open","p_open":1,"p_active":0.588,"p_room":0.9,"age_days":10,"expected_fill_days":29,"reasons":["conf:1","stale_co","velocity","win:mid","comp:brand"],"computed_at":"2026-10-27T05:46:45Z"},"pay":null,"html_url":"https://alion.io/job/amd-technical-program-manager-thermal-mechanical-engineering","json_url":"https://alion.io/job/amd-technical-program-manager-thermal-mechanical-engineering.json","meta":{"generated_at":"2026-10-27T09:08:51Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":10130,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-28T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":93},"rest":"https://alion.io/mcp/rest/get_company?id=93"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Famd-technical-program-manager-thermal-mechanical-engineering"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Famd-technical-program-manager-thermal-mechanical-engineering"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Famd-technical-program-manager-thermal-mechanical-engineering"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/amd-technical-program-manager-thermal-mechanical-engineering\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Famd-technical-program-manager-thermal-mechanical-engineering"}]}