{"id":2912006,"url":"https://alion.io/job/amd-thermal-design-validation-engineer","title":"Thermal Design & Validation Engineer","company":{"id":93,"name":"AMD","domain":"amd.com","url":"https://alion.io/company/amd","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Jibe","truth_index":{"grade":"B","score":75,"open_postings":163,"ghost_share":0,"stale_share":0.994,"repost_share":0,"time_to_fill_p50_days":28,"computed_at":"2026-10-24T06:02:35Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":null,"employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Secaucus, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":90000,"max_usd":211000,"period":"year","method":"role_country_seniority_unknown","sample_n":14270},"experience_years_min":null,"visa_sponsorship":true,"relocation_package":false,"has_equity":false,"technologies":[{"name":"HPC","optional":false},{"name":"ANSYS","optional":true},{"name":"GD&T","optional":true},{"name":"MATLAB","optional":true},{"name":"Python","optional":true},{"name":"SolidWorks","optional":true}],"status":"live","first_seen_at":"2026-07-15T17:27:00Z","employer_posted_date":"2026-10-20","last_verified_at":"2026-10-24T11:15:48Z","board_verified":true,"closed_at":null,"days_open":100,"trust":{"level":"stale","repost_count":0,"flags":["stale"],"days_open":100},"description":"WHAT YOU DO AT AMD CHANGES EVERYTHING\nAt AMD, our mission is to build great products that accelerate next-generation computing experiences-from AI and data centers, to PCs, gamingand embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuityand a shared passion to create something extraordinary. When you join AMD, you’lldiscover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges-striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.Together, we advance your career.\nTHE ROLE:\nJoin AMD’s Data Center Platform Engineering Group (DPEG), where you will help develop the next generation of liquid-cooled AI and high-performance computing platforms. As a Staff Liquid Cooling Thermal Design & Validation Engineer, you will be part of a highly collaborative thermal engineering team responsible for creating innovative cooling solutions that enable AMD’s industry-leading data center GPU products. In this role, you will work across the entire product development lifecycle, partnering with thermal engineers, mechanical engineers, silicon teams, system architects, manufacturing partners, and external vendors to develop and validate advanced thermal solutions. Your work will span from concept development and simulation to hands-on laboratory testing and prototype validation. You will have the opportunity to influence the design of cutting-edge AI hardware while working in a fast-paced environment that combines technical innovation, experimentation, and real-world product impact.\nTHE PERSON:\nThe ideal candidate is a self-starter who enjoys solving complex engineering challenges and thrives in a collaborative, fast-paced environment. They are naturally curious, enjoy hands-on technical work, and possess strong problem-solving and troubleshooting abilities.Successful candidates are comfortable working across multiple disciplines, communicating with technical and non-technical stakeholders, and driving projects forward with minimal oversight. They are motivated by learning new technologies, tackling challenging engineering problems, and contributing to innovative products that push the boundaries of AI and data center computing.\nKEY RESPONSIBILITIES:\nDevelop and validate liquid cooling solutions for AMD data center GPU and AI computing platforms. \nDrive thermal-mechanical solution development from concept through prototype validation and production readiness. \nCollaborate with internal engineering teams and external vendors to develop innovative cold plate, heat sink, and liquid cooling technologies. \nPerform thermal simulations and laboratory-based validation testing. \nConduct flow, pressure drop, temperature mapping, and thermal performance measurements. \nAnalyze test results, identify thermal bottlenecks, and recommend design improvements. \nGenerate technical documentation and communicate findings to engineering stakeholders. \nContribute to continuous improvement initiatives that enhance product quality, reliability, and time-to-market. \nSupport the development and deployment of next-generation liquid-cooled server and rack-level cooling solutions.\nPREFERRED EXPERIENCE:\nThermal design and validation of high-power electronics, AI platforms, HPC systems, or data center server products.\nDevelopment of liquid cooling technologies including cold plates, heat sinks, and rack-level cooling solutions.\nExperience working with vendors and suppliers on thermal-mechanical solution development.\nCFD analysis using Icepak, FloTHERM, Ansys Fluent, or similar tools.\nStrong understanding of heat transfer, fluid mechanics, electronics cooling, and thermal management principles.\nFlow network modeling, pressure drop analysis, and coolant optimization.\nLaboratory testing, instrumentation, telemetry systems, data acquisition, and thermal characterization.\nMechanical design experience using Creo, SolidWorks, or similar CAD tools.\nKnowledge of GD&T, manufacturing tolerances, assembly processes, and design-for-manufacturing methodologies.\nUnderstanding of cold plate manufacturing technologies including machining, brazing, skiving, friction stir welding, or additive manufacturing.\nExperience with thermal and mechanical validation of liquid-cooled server platforms.\nFamiliarity with FEA, statistical analysis, design optimization, and experimental methodologies.\nExperience with Python, MATLAB, LabVIEW, or similar tools for automation and data analysis.\nFamiliarity with Open Compute Project (OCP) standards and modern AI infrastructure architectures.\nACADEMIC CREDENTIALS:\nBachelor's or master’s degree preferred in Mechanical Engineering or a related engineering discipline.\nMaster's degree preferred in Mechanical Engineering, Thermal Engineering, Heat Transfer, Fluid Mechanics, or a related field.\nDoctoral degree desired.\nRelevant certifications, research experience, or specialized training in thermal engineering, CFD, liquid cooling, or mechanical design are a plus.\nLOCATION: Secaucus, New Jersey\nThis role is not eligible for visa sponsorship.\n#LI-CS1\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.\n\nThis posting is for an existing vacancy.\nTHE ROLE:\nJoin AMD’s Data Center Platform Engineering Group (DPEG), where you will help develop the next generation of liquid-cooled AI and high-performance computing platforms. As a Staff Liquid Cooling Thermal Design & Validation Engineer, you will be part of a highly collaborative thermal engineering team responsible for creating innovative cooling solutions that enable AMD’s industry-leading data center GPU products. In this role, you will work across the entire product development lifecycle, partnering with thermal engineers, mechanical engineers, silicon teams, system architects, manufacturing partners, and external vendors to develop and validate advanced thermal solutions. Your work will span from concept development and simulation to hands-on laboratory testing and prototype validation. You will have the opportunity to influence the design of cutting-edge AI hardware while working in a fast-paced environment that combines technical innovation, experimentation, and real-world product impact.\nTHE PERSON:\nThe ideal candidate is a self-starter who enjoys solving complex engineering challenges and thrives in a collaborative, fast-paced environment. They are naturally curious, enjoy hands-on technical work, and possess strong problem-solving and troubleshooting abilities.Successful candidates are comfortable working across multiple disciplines, communicating with technical and non-technical stakeholders, and driving projects forward with minimal oversight. They are motivated by learning new technologies, tackling challenging engineering problems, and contributing to innovative products that push the boundaries of AI and data center computing.\nKEY RESPONSIBILITIES:\nDevelop and validate liquid cooling solutions for AMD data center GPU and AI computing platforms. \nDrive thermal-mechanical solution development from concept through prototype validation and production readiness. \nCollaborate with internal engineering teams and external vendors to develop innovative cold plate, heat sink, and liquid cooling technologies. \nPerform thermal simulations and laboratory-based validation testing. \nConduct flow, pressure drop, temperature mapping, and thermal performance measurements. \nAnalyze test results, identify thermal bottlenecks, and recommend design improvements. \nGenerate technical documentation and communicate findings to engineering stakeholders. \nContribute to continuous improvement initiatives that enhance product quality, reliability, and time-to-market. \nSupport the development and deployment of next-generation liquid-cooled server and rack-level cooling solutions.\nPREFERRED EXPERIENCE:\nThermal design and validation of high-power electronics, AI platforms, HPC systems, or data center server products.\nDevelopment of liquid cooling technologies including cold plates, heat sinks, and rack-level cooling solutions.\nExperience working with vendors and suppliers on thermal-mechanical solution development.\nCFD analysis using Icepak, FloTHERM, Ansys Fluent, or similar tools.\nStrong understanding of heat transfer, fluid mechanics, electronics cooling, and thermal management principles.\nFlow network modeling, pressure drop analysis, and coolant optimization.\nLaboratory testing, instrumentation, telemetry systems, data acquisition, and thermal characterization.\nMechanical design experience using Creo, SolidWorks, or similar CAD tools.\nKnowledge of GD&T, manufacturing tolerances, assembly processes, and design-for-manufacturing methodologies.\nUnderstanding of cold plate manufacturing technologies including machining, brazing, skiving, friction stir welding, or additive manufacturing.\nExperience with thermal and mechanical validation of liquid-cooled server platforms.\nFamiliarity with FEA, statistical analysis, design optimization, and experimental methodologies.\nExperience with Python, MATLAB, LabVIEW, or similar tools for automation and data analysis.\nFamiliarity with Open Compute Project (OCP) standards and modern AI infrastructure architectures.\nACADEMIC CREDENTIALS:\nBachelor's or master’s degree preferred in Mechanical Engineering or a related engineering discipline.\nMaster's degree preferred in Mechanical Engineering, Thermal Engineering, Heat Transfer, Fluid Mechanics, or a related field.\nDoctoral degree desired.\nRelevant certifications, research experience, or specialized training in thermal engineering, CFD, liquid cooling, or mechanical design are a plus.\nLOCATION: Secaucus, New Jersey\nThis role is not eligible for visa sponsorship.\n#LI-CS1\nBenefits offered are described: AMD benefits at a glance.\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. 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