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Salary
≈ $34k – $79k per year (Estimated)
Location
In office (Shanghai)
Seniority
Middle · 3+ years exp
Employment
Full-Time

Confirmed on the employer's own hiring board on Oct 17, 2026. First seen by Alion on Oct 9, 2026.

Overview
Company
Impact
Profile match
AMEC manufactures plasma etch and thin film deposition equipment for semiconductor fabrication. Its tools are qualified at leading logic and memory fabs across Asia. The company is one of China's most advanced domestic chip equipment makers.

独立完成PCBA原理图核对、元器件选型评估与Layout布局布线;

执行DRC(设计规则检查)、ERC及信号完整性/电源完整性基础分析;

输出Gerber、钻孔文件、BOM、装配图及生产测试文件,跟进PCB打样、贴片与调试问题闭环;

与EE硬件工程师、结构工程师及生产工艺团队协同,优化可制造性与散热/抗干扰设计;

管理项目版本与设计文档,确保图纸符合公司ISO/质量体系要求。

资历要求 :

学历专业:专科及以上学历,电子工程、自动化、机电一体化或相关专业;

工作经验:3年以上PCBA Layout设计经验,有半导体设备、LED/Solar电源控制板或高多层(4-8层)高速板设计者优先;

技能要求:

精通Altium Designer / Cadence Allegro / PowerPCB 至少一款主流EDA工具;

熟悉DFM/DFA规范,掌握阻抗控制、铺铜散热及EMC基础设计原则;

具备基础的英语技术文档阅读能力(Datasheet/原理图/IPC标准);

综合素质:具备强时间节点意识与跨部门沟通协作能力,工作严谨负责,能适应多项目并行开发节奏。

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