{"id":1599441,"url":"https://alion.io/job/amkor-technology-director-package-development","title":"Director, Package Development","company":{"id":58427,"name":"Amkor Technology","domain":"amkor.com","url":"https://alion.io/company/amkor-technology","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"SuccessFactors","truth_index":null},"role":"Leadership","role_family":"Leadership","seniority":"head","employment_type":null,"work_mode":"hybrid","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-10-01T18:56:23Z","employer_posted_date":"2026-10-01","last_verified_at":"2026-10-12T18:45:08Z","board_verified":true,"closed_at":null,"days_open":11,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":11},"description":"Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world’s leading semiconductor and electronics companies to bring advanced technologies to market. The company’s comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. For more information visit amkor.com.\nPosition Summary:\nAmkor is seeking a senior Director of Advanced Packaging and Wafer Services for the Tempe, AZ office. This role will provide strategic and technical leadership for the development and commercialization of advanced wafer-based IC package platforms, including HDFO, 2.5D, chiplet-based architectures, and other leading-edge package constructions for computing, networking, AI, and mobile market segments. The successful candidate will serve as a senior customer-facing leader and primary interface with Tier 1 customers, Amkor's global R&D centers, and cross-functional business and engineering teams to drive technology roadmaps, program execution, and successful transition from development into production ramp.\nEssential Duties and Responsibilities:\nLead strategic customer engagements and development programs with Tier 1 customers, aligning customer requirements with Amkor's advanced packaging technology roadmap.\nDrive and coordinate development activities with Amkor's R&D teams in Korea and other global engineering organizations to ensure timely execution of advanced package programs.\nServe as the senior technical and program interface for customer meetings, executive reviews, technical discussions, issue resolution, and follow-up actions during the development and qualification phases.\nLead cross-functional teams across R&D, design, characterization, simulation, process engineering, product management, operations, suppliers, and business development to execute complex advanced packaging programs.\nOwn customer product management through concept definition, feasibility assessment, development, qualification, and initial production ramp.\nGuide technical tradeoff decisions related to package architecture, wafer process integration, design rules, materials, reliability, manufacturability, cost, schedule, and yield risk.\nLead key engagements with ecosystem partners and wafer processing suppliers to influence technology choices, supplier readiness, and future roadmap direction.\n\nRequired Qualifications:\nBachelor's degree in Engineering required; Master's degree or Ph.D. preferred.\n10+ years of experience in semiconductor package development, wafer-level packaging, IC packaging, or wafer process technology.\nDemonstrated leadership in advanced packaging development programs, including direct customer engagement with major semiconductor, computing, networking, AI, or mobile customers.\nStrong technical understanding of IC package architecture, package design environments, wafer process integration, design-rule tradeoffs, and manufacturability considerations.\nWorking knowledge of IC packaging materials, failure modes, reliability qualification, process characterization, and production ramp requirements.\nProven ability to lead cross-functional and global teams, influence technical and business stakeholders, and drive alignment across customers, engineering, operations, suppliers, and executive leadership.\nExcellent written and verbal communication skills, including the ability to present complex technical and business topics to senior customer and internal leadership.\nThis position requires 10-20% domestic and international travel.\nPreferred Qualifications:\nDeep expertise in high-density fan-out, 2.5D integration, chiplet module architectures, bridge-like constructions, advanced substrate technologies, or heterogeneous integration.\nExperience taking advanced package technologies from concept through qualification and early production ramp.\nFamiliarity with cost modeling, yield improvement, design-for-manufacturing, and technology roadmap planning.\nExperience working with global R&D teams, OSAT operations, foundries, fabless semiconductor companies, or major system customers.\nLocation:\nTempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.\nAmkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.","description_format":"text","description_chars":5105,"description_truncated":false,"requirements":{"experience_years_min":10,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":true,"industries":["Semiconductor Manufacturing"],"lifecycle":[{"event":"open","at":"2026-10-12T04:45:49Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 6","filings_12m":6,"filings_prev_12m":4,"green_card_filings_12m":0,"median_offered_wage_usd":127500,"route":null,"cap_exempt":false,"checked_at":"2026-10-03T21:08:04+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":76,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.847,"p_room":0.9,"age_days":11,"expected_fill_days":27,"reasons":["conf:10","win:mid"],"computed_at":"2026-10-13T05:45:00Z"},"pay":null,"html_url":"https://alion.io/job/amkor-technology-director-package-development","json_url":"https://alion.io/job/amkor-technology-director-package-development.json","meta":{"generated_at":"2026-10-13T18:37:02Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":28540,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-14T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":58427},"rest":"https://alion.io/mcp/rest/get_company?id=58427"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Famkor-technology-director-package-development"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Famkor-technology-director-package-development"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Famkor-technology-director-package-development"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/amkor-technology-director-package-development\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Famkor-technology-director-package-development"}]}