Associate Equipment Engineer (Grinding/Dicing/LLO/Bonding)

ams OSRAM • English: B2 • Sensors & Transducers • LED Lighting & Luminaires • 24 days ago
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Salary
≈ $9.5k – $19k per year (Estimated)
Location
In office (Kulim)
Seniority
Junior · 5+ years exp

Confirmed on the employer's own hiring board on Oct 19, 2026. First seen by Alion on Sep 25, 2026.

Overview
Company
Impact
Profile match

ams OSRAM

ams OSRAM is an Austrian semiconductor company headquartered in Premstaetten near Graz. It designs optical sensors, emitters and lighting components used in smartphones, cars and medical devices. The group was formed when ams acquired the German lighting company OSRAM and is listed on the SIX Swiss Exchange.
ams-osram.com • HQ: Premstätten, Austria • LED Lighting & Luminaires • Sensors & Transducers • Optics & Photonic Components • 1001-5000 employees • Est. 1981
Tech stack of ams OSRAM
  • To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
  • Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
  • Carry out calibration/ preventive maintenance to the machine and equipment.
  • Ensure the availability of materials and spare parts. Maintains records of daily, monthly and yearly maintenance programs.
  • Performs other project related to improve production operation. Assist process engineer to carry out evaluation
  • Document production equipment and assembly work instruction to hand off from Engineering to Operations

What we look for

  • Min. Diploma or equivalent qualification in engineering.
  • Min 5 years experience in manufacturing environment and maintenance engineering.
  • Preferably experience in handling grinding/ dicing/ LLO/ Bonding process.
  • Able to communicate in English and Bahasa Malaysia.

Please contact Shin Yih Cheah for further information via [email protected].

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