{"id":1254781,"url":"https://alion.io/job/ams-osram-ic-package-pcb-layout-engineer-dmf","title":"IC Package / PCB Layout Engineer (d/m/f)","company":{"id":54725,"name":"ams OSRAM","domain":"ams-osram.com","url":"https://alion.io/company/ams-osram","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"SuccessFactors","truth_index":null},"role":"Hardware","role_family":"Hardware","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"inferred","locations":[],"countries":[],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":6,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Altium Designer","optional":false},{"name":"Cadence Allegro","optional":false},{"name":"Mentor PADS","optional":false},{"name":"Cadence Virtuoso","optional":true},{"name":"Siemens Calibre","optional":true}],"status":"live","first_seen_at":"2026-09-25T18:54:56Z","employer_posted_date":"2026-09-25","last_verified_at":"2026-09-30T21:08:45Z","board_verified":true,"closed_at":null,"days_open":5,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":5},"description":"Design and develop RF and high-frequency IC substrate and PCB layouts for sensor, and mixed-signal applications, ensuring compliance with electrical, thermal, and manufacturing requirements\nPerform RF-aware component placement and transmission line routing, including controlled impedance structures, differential pairs, coplanar waveguides (CPW), microstrip, and stripline implementations\nOptimize layout for signal integrity (SI), power integrity (PI), and RF performance, minimizing coupling, crosstalk, insertion loss, return loss, and electromagnetic interference (EMI)\nCreate and maintain package substrate and PCB layouts using Cadence Allegro Suite (Allegro X, APD), Altium Designer and/or Siemens PADS including design libraries, stack-ups, and constraint management\nCollaborate with EMC, analog, package, and IC design engineers to support chip-package-board co-design and ensure successful integration of high-frequency circuits and support for simulation activities using SI/PI/EM extraction tools\nPerform design verification and manufacturability reviews, including DRC/ERC checks, fabrication rule compliance\nSupplier selection and qualification for PCB and SMT (surface mount technology), including supply chain and assembly support\nWho we are looking for\nBachelor's or Master's Degree in Electrical Engineering, Microelectronics, Semiconductor Physics, Computer Engineering, or a related field\nMinimum of 6 years experience in Semiconductor/Electronic Industry\nStrong experience with Cadence Allegro Suite (Allegro X, APD, Package Designer) and/or Altium Designer\nExperience with Cadence Virtuoso Suite and Physical Verification Tools such as Siemens Calibre/Candence PVS of is highly desirable\nKnowledge of semiconductor processes, analog/mixed-signal design considerations, and ESD/EMC concepts is considered a strong benefit\nKnowledge of controlled impedance routing, electromagnetic coupling, grounding strategies, shielding concepts, and RF matching networks\nExperience with IC package substrates, HDI PCB technologies, BGA, wirebond, and flip-chip packaging\nCMOS IC layout experience is highly desirable, providing valuable expertise in parasitic control, matching techniques, device placement, shielding concepts, and chip-package-board co-design\nGood technical English is a must, German is beneficial\nWe offer competitive salaries and additional benefits based on your performance, experience and qualification.\nThe employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/).\nWe offer a higher compensation depending on your expertise and skills.\nPlease contact Hana Krsul for further information via  or +43 664 9665611.","description_format":"text","description_chars":2826,"description_truncated":false,"requirements":{"experience_years_min":6,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[{"language":"English","level":"All levels","optional":false}]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Sensors & Transducers","LED Lighting & Luminaires","Optics & Photonic Components"],"lifecycle":[{"event":"open","at":"2026-09-25T18:54:56Z"}],"liveness":{"score":39,"band":"fade","label":"Fading","p_open":1,"p_active":0.704,"p_room":0.55,"age_days":4,"expected_fill_days":3,"reasons":["conf:4","velocity","win:tail","comp:brand"],"computed_at":"2026-09-30T05:45:00Z"},"pay":null,"html_url":"https://alion.io/job/ams-osram-ic-package-pcb-layout-engineer-dmf","json_url":"https://alion.io/job/ams-osram-ic-package-pcb-layout-engineer-dmf.json","meta":{"generated_at":"2026-10-01T02:06:02Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","usage":{"tier":"crawler","counted_by":"address","units_charged":1,"used_today":1761,"day_limit":5000,"remaining_today":3239,"minute_limit":60,"resets_at":"2026-10-02T00:00:00Z"}}}