{"id":1885636,"url":"https://alion.io/job/ams-osram-process-development-senior-engineer-die-attach-wire-bond","title":"Process Development Senior Engineer (Die Attach / Wire Bond)","company":{"id":54725,"name":"ams OSRAM","domain":"ams-osram.com","url":"https://alion.io/company/ams-osram","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"SuccessFactors","truth_index":{"grade":"A","score":100,"open_postings":4,"ghost_share":0,"stale_share":0,"repost_share":0,"time_to_fill_p50_days":14,"computed_at":"2026-11-03T05:54:40Z"}},"role":"Semiconductors","role_family":"Semiconductors","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Bayan Lepas, Malaysia"],"countries":["MY"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":21000,"max_usd":42000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":107},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Minitab","optional":false}],"status":"live","first_seen_at":"2026-10-05T02:20:22Z","employer_posted_date":"2026-10-05","last_verified_at":"2026-11-03T20:57:02Z","board_verified":true,"closed_at":null,"days_open":30,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":30},"description":"Develop or optimize Die Attach and Wire Bond processes for new product development project to meet project cost, quality and timeline targets.\nParticipate and support FOL processes tehcnology roadmap and building block activities.\nEquipment selection which meet project cost, quality and timeline target.\nShare and transfer technical know how within R&D and to Manufacturing team.\nProvide technical guidance or job coaching to junior supporting staff\nParticipate in engineering sample, pre-series and ramp-up build to fulfill customer order.\nWhat we look for\nDegree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent.\n2-3 years in semiconductor field especially in Die Attach and Wire Bond processes.\nProcess egnineering knowledge in semiconductors or LED manufacturing processes.\nKnowledge in process development step and statistic.\nB. Minitab knowledge will be advantage.\nSix Sigma Green or Black Belt will be advantage.\nPlease contact Nurul Ain Rosli for further information via  or +60 (4) 3053200.","description_format":"text","description_chars":1072,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":true},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Consumer Electronics","Hardware","Sensors & Transducers","LED Lighting & Luminaires"],"lifecycle":[{"event":"open","at":"2026-10-05T02:20:22Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 8 · green card filings: 1","filings_12m":8,"filings_prev_12m":3,"green_card_filings_12m":1,"median_offered_wage_usd":148611,"route":null,"cap_exempt":false,"checked_at":"2026-10-29T16:27:21+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":24,"band":"cold","label":"Long shot","p_open":1,"p_active":0.698,"p_room":0.35,"age_days":29,"expected_fill_days":14,"reasons":["conf:1","velocity","win:tail","comp:brand"],"computed_at":"2026-11-03T05:54:40Z"},"pay":null,"html_url":"https://alion.io/job/ams-osram-process-development-senior-engineer-die-attach-wire-bond","json_url":"https://alion.io/job/ams-osram-process-development-senior-engineer-die-attach-wire-bond.json","meta":{"generated_at":"2026-11-04T05:39:04Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":8828,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-05T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":54725},"rest":"https://alion.io/mcp/rest/get_company?id=54725"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fams-osram-process-development-senior-engineer-die-attach-wire-bond"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fams-osram-process-development-senior-engineer-die-attach-wire-bond"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fams-osram-process-development-senior-engineer-die-attach-wire-bond"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/ams-osram-process-development-senior-engineer-die-attach-wire-bond\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fams-osram-process-development-senior-engineer-die-attach-wire-bond"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":1885636}},{"tool":"search_jobs","arguments":{"company":"ams-osram.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":1885636},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. Docs: https://alion.io/developers"}}