Wire Bond Process Engineer

• Responsible for line sustaining issues & full accountability of outgoing yield and quality of Wire Bond process. KPIV, KPOV & LoD are key. Updating documentation on a timely manner (FMEA, WI, POCAP, CP, Build sheet…etc).
• Hands on & run the equipment/process in production mode. Expected to spend time on the production floor daily.
• Equip with wire bond process knowledge through self-learning and able to do some minor troubleshooting whenever there are any quality/maverick issues occur.
• Work closely with cross functional team like equipment, PO & Quality team on any issues arise.
• Work closely with R&D for new product development to ensure robust process & manufacturability. Support new product pre-series and ramp-up.
• Initiate cost & yield improvement projects which may need to drive the upstream process on any incoming quality deviations.

What we look for

• Min Bachelor's Degree in Electrical / Electronics / Mechanical Engineering or equivalent.
• Preferred with min 8 years working experience in High Volume Manufacturing and Complex process for IC or LED manufacturing.
• Experience in the Wire Bond process is highly preferred.
• 6 Sigma Methodology, Green/Black Belt is an advantage.
• Process control knowledge-Control Plan, FMEA, SPC, MSA, 8D, DOE, Minitab, PBI.

Please contact Nurul Ain Rosli for further information via [email protected] or +60 (4) 3053200.