{"id":1131336,"url":"https://alion.io/job/analog-devices-senior-engineer-semi-packaging-engineering-2","title":"Senior Engineer, Semi Packaging Engineering","company":{"id":58431,"name":"Analog Devices","domain":"analog.com","url":"https://alion.io/company/analog-devices","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":80,"open_postings":54,"ghost_share":0,"stale_share":0.815,"repost_share":0,"time_to_fill_p50_days":49,"computed_at":"2026-10-29T05:49:05Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Wilmington, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":95600,"max":131450,"currency":"USD","period":"year","gross":null,"usd_annual":131450},"salary_estimate":null,"experience_years_min":2,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"CAPA","optional":false},{"name":"Design Controls","optional":false},{"name":"FMEA","optional":false},{"name":"Mandiant capa","optional":false},{"name":"Physical AI","optional":false},{"name":"SolidWorks","optional":false},{"name":"Statistical Process Control","optional":false}],"status":"live","first_seen_at":"2026-09-22T00:00:00Z","employer_posted_date":"2026-09-22","last_verified_at":"2026-10-29T11:57:55Z","board_verified":true,"closed_at":null,"days_open":37,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":37},"description":"About Analog Devices\nAnalog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.\nWe are seeking a highly motivated Senior Engineer, Systems Semiconductor Packaging Engineer to join a multidisciplinary team developing advanced semiconductor modules and systems level solutions for Healthcare, Industrial, New Energy, Robotics and Physical AI applications.\nThis role will drive product realization from concept through manufacturing by working closely with cross-functional design teams, OSAT, ODM and EMS partners, material suppliers and global manufacturing vendors across multiple time zones. The ideal candidate should have 2 - 5 years of experience in semiconductor packaging, system integration, manufacturing process development and reliability engineering.\nWe will consider candidates with a PhD and less industry experience.\nPotential candidate is expected to:\nWork closely with cross-functional teams to design and develop advanced systems level packaging solutions including heterogeneous packaging solutions, multi-chip modules, sensor packages and high-density interconnect assemblies. \nLead assembly process developments to support Digital Health Care, Medical Devices, Industrial, Robotics and Physical AI applications. Adheres to strict documentation practices in a regulated environment and owns design control processes. Engineer new materials, processes and assembly capabilities to suit to end applications.\nOwn manufacturing engineering activities including process characterization, collaborate with QA and Reliability teams to drive root cause analysis, yield improvements and Corrective/ preventive actions (CAPA) to meet manufacturability, scalability, and cost optimizations. \nDrive PFMEA, DOE, SPC, GR&R and statical analysis activities to improve process capability, assembly robustness and long-term reliability.\nWork closely with OSATs, substrate vendors, PCB suppliers and assembly partners to define package architecture, DFM/DFX requirements and qualification strategies. Takes accountability in design and process development for high volume production. Benchmark industry best practices and evaluate emerging technologies for design and process innovation.\nAbility to collate information with appropriate supporting data and present into a coherent report for communication and distribution.\nCommunicate complex technical concepts effectively to global engineering, operations, suppliers and executive teams. \nMinimum Qualifications\nMaster's degree in Engineering (Mechanical Engineering, Materials Science, Semiconductor Engineering, Applied Physics, or equivalent).\nPh.D. in a relevant engineering or science discipline is preferred.\nMust have 2-5 years of industrial experience in advanced semiconductor packaging, electronics assembly, systems integration engineering, or manufacturing engineering.\nCandidates with a Ph.D. and limited industry experience are encouraged to apply, provided they demonstrate strong technical expertise relevant to semiconductor packaging, materials engineering, process development, or systems integration.\nExperience working with OSATs, substrate vendors, EMS partners, and semiconductor manufacturing ecosystems.\nStrong understanding of advanced semiconductor packaging technologies, heterogeneous integration, multi-chip modules, materials, and assembly processes.\nFamiliarity with DOE, PFMEA, SPC, GR&R, 8D, RCA, design controls, and statistical analysis techniques.\nEducational background in materials science and mechanical behavior of materials with the ability to apply engineering fundamentals to practical product design.\nExperience with 3D CAD tools (SolidWorks or equivalent).\nExcellent analytical, problem-solving, project management, and communication skills.\nExperience in Medical Devices, Healthcare, Industrial Systems, Robotics, or regulated manufacturing environments is a strong advantage.\nFor positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position - except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) - may have to go through an export licensing review process.\nAnalog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.\nEEO is the Law: Notice of Applicant Rights Under the Law.\nJob Req Type: ExperiencedRequired Travel: Yes, 10% of the timeShift Type: 1st Shift/DaysThe expected wage range for a new hire into this position is $95,600 to $131,450.Actual wage offered may vary depending on work location, experience, education, training, external market data, internal payequity, or other bona fide factors.\n\nThis position qualifies for a discretionary performance-based bonus which is based on personal and company factors.\n\nThis position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.","description_format":"text","description_chars":5976,"description_truncated":false,"requirements":{"experience_years_min":2,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":false},"security_clearance":false,"languages":[]},"benefits":["401k plan"],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Sensors & Transducers","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-09-23T03:36:02Z"}],"visa":[],"liveness":{"score":45,"band":"ok","label":"Likely open","p_open":1,"p_active":0.596,"p_room":0.75,"age_days":37,"expected_fill_days":49,"reasons":["conf:4","stale_co","velocity","win:late","comp:brand"],"computed_at":"2026-10-29T05:49:05Z"},"pay":{"stated_usd_annual":131450,"is_top_pay":false},"html_url":"https://alion.io/job/analog-devices-senior-engineer-semi-packaging-engineering-2","json_url":"https://alion.io/job/analog-devices-senior-engineer-semi-packaging-engineering-2.json","meta":{"generated_at":"2026-10-29T15:03:56Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":22718,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-30T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":58431},"rest":"https://alion.io/mcp/rest/get_company?id=58431"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fanalog-devices-senior-engineer-semi-packaging-engineering-2"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fanalog-devices-senior-engineer-semi-packaging-engineering-2"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fanalog-devices-senior-engineer-semi-packaging-engineering-2"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/analog-devices-senior-engineer-semi-packaging-engineering-2\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fanalog-devices-senior-engineer-semi-packaging-engineering-2"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":1131336}},{"tool":"search_jobs","arguments":{"company":"analog.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":1131336},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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