{"id":958392,"url":"https://alion.io/job/analog-devices-sr-manager-product-test-engineering-power-modules","title":"Sr Manager, Product & Test Engineering - Power Modules","company":{"id":58431,"name":"Analog Devices","domain":"analog.com","url":"https://alion.io/company/analog-devices","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":81,"open_postings":47,"ghost_share":0,"stale_share":0.766,"repost_share":0,"time_to_fill_p50_days":48,"computed_at":"2026-11-10T06:52:35Z"}},"role":"Hardware","role_family":"Hardware","seniority":"senior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"explicit","locations":["Taipei, Taiwan","Zhubei, Taiwan"],"countries":["TW"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":23000,"max_usd":52000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":1936},"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"C++","optional":false},{"name":"Design of Experiments","optional":false},{"name":"FMEA","optional":false},{"name":"Python","optional":false},{"name":"Advantest / Teradyne ATE","optional":true},{"name":"JMP","optional":true},{"name":"Minitab","optional":true},{"name":"Statistical Process Control","optional":true},{"name":"Tableau","optional":true}],"status":"live","first_seen_at":"2026-09-16T07:29:50Z","employer_posted_date":"2026-09-16","last_verified_at":"2026-11-10T04:17:45Z","board_verified":true,"closed_at":null,"days_open":54,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":54},"description":"About Analog Devices\nAnalog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.\nSenior Manager, Product & Test Engineering - Power Modules\nLocation: Taiwan\nReports To: Head of Product & Test Engineering - Data Center & Energy\nFunction: Product & Test Engineering - Power Modules (Si, SiC, GaN)\nTravel: 15-25%, including international travel to manufacturing sites, OSAT partners, and key customers\nPosition Summary\nWe are seeking an accomplished Technical Manager, Product & Test Engineering to lead the strategic direction, technical execution, and team development for our advanced power module product lines (Si, SiC, GaN). This role combines deep product engineering ownership - from New Product Introduction (NPI) through high-volume manufacturing (HVM) and sustaining.\nThe Technical Manager serves as the senior technical authority who bridges R&D, reliability engineering, manufacturing, product marketing, and customer-facing teams. You will manage a team of product & test engineers while remaining hands-on in driving technical decisions, qualification strategies, and critical customer engagements. This is a high-impact leadership role for someone who thrives at the intersection of deep technical expertise and business-driven product strategy.\nKey Responsibilities\nProduct Engineering & NPI Execution\nOwn end-to-end product engineering execution for advanced power modules from NPI through high-volume production and sustaining.\nLead product bring-up, characterization, and silicon readiness in partnership with Design, Test, and Applications teams.\nDefine and maintain product specifications, test limits, and guard-bands based on silicon behavior and manufacturing capability.\nDrive corner lot planning including characterization and qualification testing.\nDrive wafer acceptance test (WAT) to final test specification alignment.\nOwn manufacturing release, qualification execution, and product change management (PCNs).\nDrive design for test (DFT) and design for manufacturability (DFM), and quality improvement through PPM reduction.\nModule Test Engineering & ATE Strategy\nDrive adoption of advanced test methodologies including adaptive testing, multi-site test optimization, and data-driven outlier screening to improve quality and reduce cost.\nManage relationships with test equipment vendors and subcontract test operations at OSAT partners; own test floor readiness and capacity alignment for production ramps.\nDefine Design-for-Test (DFT) requirements during the design phase; ensure adequate test access, built-in self-test (BIST) coverage, and production testability for new designs.\nLead test yield improvement programs through statistical analysis - test limit optimization, guard-banding, GRR studies, Cpk monitoring, and STDF data analytics.\nEstablish bench-to-ATE correlation methodology and standards for precision analog measurements: DC parametrics, AC response, gain/offset, noise, PSRR, leakage, timing, and power efficiency.\nDrive test hardware design standards for load boards, probe cards, and device interface boards; ensure signal integrity, power integrity, and measurement accuracy across all test interfaces.\nOversee test program development and maintenance - automated test software (C/C++, Python), test coverage optimization, and test time reduction initiatives.\nDefine and execute the test strategy for power module product lines across Si, SiC, and GaN technologies - spanning wafer sort, module-level final test, and system-level validation.\nManufacturing & Assembly Ownership\nOwn the manufacturability of advanced power modules, driving robust assembly processes across contract manufacturers (CM).\nEstablish and enforce assembly workmanship standards, ensuring compliance with IPC-A-610 (Acceptability of Electronic Assemblies).\nDrive cross-functional alignment across Design, Test, Quality, and Manufacturing to enable scalable, high-yield module production.\nLead resolution of assembly-related excursions, including die attach, clip attach, solder integrity, and module-level defects.\nWork with assembly team to drive the packaging roadmap for current and next-generation module platforms, including advanced packaging technologies (fan-out, embedded die, flip-chip).\nCoordinate with supply chain team on capacity planning, technology qualification, and supply chain readiness.\nQualification, Reliability & Compliance\nWork with Reliability team to define, execute, and oversee comprehensive qualification and reliability test plans aligned with IPC-9592 / IPC-9592B for power conversion devices.\nExecute and oversee reliability tests including: HTRB, HTGB, HAST, Temperature Cycling, Power Cycling, Thermal Shock, Vibration, Mechanical Shock, HTS/LTS, Life testing, and Burn-in.\nConduct HALT (Highly Accelerated Life Testing) and HASS (Highly Accelerated Stress Screening) per IPC-9592A guidelines; establish operational and destruct limits for power modules.\nApply Design for Reliability practices including MTBF analysis, derating, FMEA, corrosion analysis, and moisture sensitivity assessment.\nEnsure compliance with automotive standards and AEC-Q qualifications where applicable.\nValidate that all products meet customer, regulatory, and internal reliability requirements prior to production release.\nCustomer & Market Engagement\nServe as the senior technical interface for strategic customers on product, quality, manufacturing, and roadmap topics.\nOwn successful execution of assigned customer programs - align internal timelines with customer expectations and proactively identify and mitigate risks.\nLead technical escalations for production issues, customer returns, and corrective actions.\nConduct regular program reviews with internal and customer stakeholders; provide data-driven status updates on schedule, quality, and risks.\nEstablish execution dashboards and performance metrics for customer-facing program management.\nSupport design-in activities, product qualification at customer sites, and on-site technical consultations.\nTeam Leadership & Development\nBuild, manage, and develop a team of product engineers - including hiring, onboarding, mentoring, and performance management.\nEstablish product & test engineering standards for product readiness, manufacturability, and quality across the team.\nDrive workforce planning to scale the product engineering function in alignment with business growth.\nFoster a culture of technical excellence, data-driven decision-making, and continuous improvement.\nMentor and grow next-generation technical leaders within the organization.\nData-Driven Execution & Continuous Improvement\nLead yield analysis, parametric trend monitoring, and root-cause investigations across the module portfolio.\nDrive cost, yield, and cycle-time improvement through data-driven analysis and systematic problem-solving.\nLeverage hands-on experience with FA laboratories, Design of Experiments (DOE), and material/process characterization.\nEstablish and maintain KPIs and dashboards for product engineering performance, quality, and delivery.\nChampion continuous improvement initiatives across the product engineering function.\nRequired Qualifications\nEducation\nBachelor's degree required in Electrical Engineering, Computer Engineering, Electronics Engineering, Materials Science, Microelectronics, or a related field.\nMaster's degree strongly preferred in a relevant engineering discipline.\nMechanical Engineering background is a plus, particularly for roles involving module packaging, thermomechanical analysis, and assembly optimization.\nExperience\n10+ years of progressive experience in semiconductor product engineering, manufacturing engineering or test engineering - with demonstrated end-to-end ownership from NPI through high-volume production.\n5+ years in a leadership role managing engineers or cross-functional technical teams.\nStrong technical depth in semiconductor power products (IGBT, MOSFET, SiC, GaN) and advanced power module design, assembly, and manufacturing.\nDemonstrated expertise in module product & test engineering, qualification, reliability testing, failure analysis, and assembly/packaging development.\nProven track record of defining and executing product roadmaps, driving new product introductions, and managing product lifecycle.\nIn-depth knowledge of IPC-9592 / IPC-9592B qualification, reliability, and manufacturing conformance requirements.\nExperience with automotive standards and AEC-Q qualification processes.\nHands-on experience interfacing with CM partners and managing manufacturing transfers across global sites.\nTechnical Skills\nDeep understanding of thermal, electro-thermal, and mechanical fatigue failure mechanisms in power modules.\nWorking knowledge of advanced packaging technologies (fan-out, embedded die, flip-chip) and module assembly methods.\nProficiency in both front-end and back-end semiconductor manufacturing processes.\nAdvanced proficiency in data analysis tools including JMP, Minitab, Python, and Excel.\nProficiency in reliability statistical methods (Weibull analysis, DOE, FMEA).\nUnderstanding of DC/DC converter architectures and power delivery systems.\nWorking knowledge of ATE platforms (Teradyne Eagle/ETS, Advantest V93000) and test program architecture - sufficient to provide technical direction and review test engineering output.\nFamiliarity with test hardware design: load board schematics, probe card specifications, and high-frequency measurement interface requirements.\nUnderstanding of semiconductor test economics: test time optimization, multi-site efficiency, test coverage vs. cost trade-offs, and test floor capacity modeling.\nExperience with production test data infrastructure - STDF format, yield analytics platforms (Spotfire, Tableau, or equivalent), and statistical process control for test operations.\nLeadership & Communication\nProven leadership in building, managing, and developing high-performing engineering teams.\nExceptional project ownership, organizational abilities, and stakeholder management skills - comfortable operating at both executive and hands-on technical levels.\nExcellent communication and presentation capabilities - skilled at articulating complex technical concepts to customers, senior leadership, and cross-functional partners.\nAbility to lead without direct authority across multi-disciplinary, global teams.\nStrong analytical and troubleshooting capability with confident, systematic decision-making.\nPreferred Qualifications\nExperience in AI / data center power delivery, hyperscaler programs, or high-performance computing power solutions.\nExperience with customer-facing program management for Tier-1 OEMs or hyperscale customers.\nSix Sigma or equivalent quality methodology certification.\nHands-on background in ATE test program development or test engineering earlier in career, with progression into leadership.\nExperience building and scaling test engineering teams in Asia-Pacific (Taiwan, Thailand, or Southeast Asia).\nExposure to AI/ML techniques applied to test data analysis, adaptive testing, or predictive yield modeling.\nFor positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. 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