{"id":3285949,"url":"https://alion.io/job/analog-devices-staff-engineer-semi-packaging-engineering-3","title":"Staff Engineer, Semi Packaging Engineering","company":{"id":58431,"name":"Analog Devices","domain":"analog.com","url":"https://alion.io/company/analog-devices","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":79,"open_postings":49,"ghost_share":0,"stale_share":0.837,"repost_share":0,"time_to_fill_p50_days":48,"computed_at":"2026-11-03T05:54:40Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"staff","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Wilmington, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":113190,"max":163905,"currency":"USD","period":"year","gross":null,"usd_annual":163905},"salary_estimate":null,"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"ANSYS","optional":false},{"name":"Cadence Allegro","optional":true}],"status":"live","first_seen_at":"2026-10-26T18:22:23Z","employer_posted_date":"2026-10-26","last_verified_at":"2026-11-04T01:28:41Z","board_verified":true,"closed_at":null,"days_open":8,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":8},"description":"About Analog Devices\nAnalog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.\nJob Description\nThis role will be responsible for the development of advanced packaging solutions for semiconductor devices across various market segments. The packaging solutions must meet demanding product requirements while balancing reliability, manufacturability, and cost. Candidates will be expected to:\nLead the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products.\nProvide technical leadership in package mechanical and thermal analysis to support package architecture selection, design optimization, and reliability risk assessment.\nPerform mechanical simulations of IC packages and systems using FEM tools to evaluate chip-package interaction, package-board interaction, warpage, stress, and reliability risks.\nPerform component- and system-level thermal simulations for semiconductor packages using commercial simulation tools.\nWork closely with cross-functional teams to understand product and packaging requirements, identify customer needs, and resolve complex technical issues.\nCollaborate with OSAT partners, substrate suppliers, and material vendors to resolve technical issues, drive process development, optimize manufacturing processes, and improve yield.\nWork with quality and reliability teams to establish reliability criteria and qualification plans for semiconductor products across various market applications.\nDevelop and maintain package design guidelines, process specifications, simulation methodologies, and technical documentation.\n Qualifications\nPhD or Master’s degree in Mechanical Engineering or Electrical Engineering.\n5+ years of hands-on experience in semiconductor packaging development, package simulation, or packaging manufacturing.\nStrong understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.\nStrong knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.\nHands-on experience with major FEM tools; ANSYS experience is preferred.\nExperience with FloTHERM, Sigrity, or Icepak is a plus.\nExperience with Cadence Allegro is a plus.\nStrong analytical, problem-solving, communication, and collaboration skills.\nAbility to work effectively in cross-functional teams and influence technical decisions across organizations.\nFor positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position - except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) - may have to go through an export licensing review process.\nAnalog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.\nEEO is the Law: Notice of Applicant Rights Under the Law.\nJob Req Type: ExperiencedRequired Travel: Yes, 10% of the timeShift Type: 1st Shift/DaysThe expected wage range for a new hire into this position is $113,190 to $163,905.Actual wage offered may vary depending on work location, experience, education, training, external market data, internal payequity, or other bona fide factors.\n\nThis position qualifies for a discretionary performance-based bonus which is based on personal and company factors.\n\nThis position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.","description_format":"text","description_chars":4526,"description_truncated":false,"requirements":{"experience_years_min":5,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":false},"security_clearance":false,"languages":[]},"benefits":["401k plan"],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Sensors & Transducers","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-10-26T18:22:23Z"}],"visa":[],"liveness":{"score":63,"band":"ok","label":"Likely open","p_open":1,"p_active":0.632,"p_room":1,"age_days":7,"expected_fill_days":48,"reasons":["conf:3","stale_co","velocity","win:early","comp:brand"],"computed_at":"2026-11-03T05:54:40Z"},"pay":{"stated_usd_annual":163905,"is_top_pay":false},"html_url":"https://alion.io/job/analog-devices-staff-engineer-semi-packaging-engineering-3","json_url":"https://alion.io/job/analog-devices-staff-engineer-semi-packaging-engineering-3.json","meta":{"generated_at":"2026-11-04T04:16:20Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":6603,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-05T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":58431},"rest":"https://alion.io/mcp/rest/get_company?id=58431"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fanalog-devices-staff-engineer-semi-packaging-engineering-3"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fanalog-devices-staff-engineer-semi-packaging-engineering-3"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fanalog-devices-staff-engineer-semi-packaging-engineering-3"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/analog-devices-staff-engineer-semi-packaging-engineering-3\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fanalog-devices-staff-engineer-semi-packaging-engineering-3"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":3285949}},{"tool":"search_jobs","arguments":{"company":"analog.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":3285949},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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