{"id":3898246,"url":"https://alion.io/job/apple-advanced-packaging-development-engineer","title":"Advanced Packaging Development Engineer","company":{"id":12,"name":"Apple","domain":"apple.com","url":"https://alion.io/company/apple","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Apple Jobs","truth_index":{"grade":"A","score":89,"open_postings":812,"ghost_share":0,"stale_share":0.222,"repost_share":0.004,"time_to_fill_p50_days":90,"computed_at":"2026-11-07T05:47:08Z"}},"role":"Hardware","role_family":"Hardware","seniority":"staff","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["San Francisco, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-11-06T19:28:42Z","employer_posted_date":"2026-11-06","last_verified_at":"2026-11-07T22:54:18Z","board_verified":true,"closed_at":null,"days_open":1,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":1},"description":"Apple’s Advanced Packaging team is seeking an experienced Packaging Development Engineer to drive next-generation packaging integration and technology development for future products. In this role, you will lead the definition, development, and qualification of cutting-edge 2.5D and 3D packaging technologies-incorporating features such as hybrid bonding, high-density interposers, fine-pitch microbumps, and Through-Silicon Vias (TSVs).\nYou will work cross-functionally with silicon design, physical design, SI/PI, thermal, and manufacturing teams to guide technologies from early architecture exploration through qualification and high-volume manufacturing.\nDescription\nIn this role, you will be responsible for advanced package integration and technology development within a cross-functional team, driving novel 2.5D/3D architectures from early concept through qualification.\nMinimum Qualifications\nBS and 10 +years of relevant industry experience\nPreferred Qualifications\nPhD and 6+ years of experience in relevant industry, preferred.\nStrong technical background in 2.5D/3D packaging and semiconductor integration schemes (such as hybrid bonding, interposers, fine-pitch microbumps, and TSVs).\nSolid grasp of fab BEoL/MEoL interconnect processing, wafer-level packaging, and advanced assembly flows.\nUnderstanding of packaging materials, thermo-mechanical reliability, and chip-package interaction failure mechanisms.\nBroad systems mindset with the ability to balance package-level choices against silicon, electrical, thermal, and manufacturing constraints.\nExperience utilizing layout, physical design, or modeling tools alongside engineering data analysis.\nProven track record collaborating with and driving external foundries, OSATs, or material vendors.\nExcellent communication and collaboration skills across cross-functional hardware 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