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We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team.\nDescription\nWork with cross-functional teams and lead package integration and architecture efforts.\nWork with 3rd party and OSAT to bring packaging solution from concept to HVM Drive industry with advanced package solutions and specs.\nWork to bring innovative packaging solutions from concept to mass production, including package, module, and technology development.\nPeople managerial skills highly desirable.\nTravel - 5-10%\nMinimum Qualifications\nBS and 20+ years of relevant industry experience.\nPreferred Qualifications\nWe are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development, Managerial skills highly desired.\nGood understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, and FA.\nKnowledgeable in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints.\nBackground and Knowledge of Cellular/Connectivity/PMU packaging highly desirable.\nExcellent problem solving with strong physics and fundamentals.\nExcellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers.\nMulti-functional coverage on package layout (Cadence APD/Allegro), critical signal integrity / power integrity, thermal, design rules, BOM, design for manufacturing, reliability, and cost.\nAbility to work independently and take on projects with minimum supervision.\nAbility to lead and manage 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