{"id":3850647,"url":"https://alion.io/job/apple-memory-packaging-engineer-4","title":"Memory Packaging Engineer","company":{"id":12,"name":"Apple","domain":"apple.com","url":"https://alion.io/company/apple","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Apple Jobs","truth_index":{"grade":"A","score":90,"open_postings":829,"ghost_share":0,"stale_share":0.181,"repost_share":0.004,"time_to_fill_p50_days":90,"computed_at":"2026-11-06T05:58:05Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"staff","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["San Diego, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-10-29T01:44:08Z","employer_posted_date":"2026-11-06","last_verified_at":"2026-11-06T23:59:14Z","board_verified":true,"closed_at":null,"days_open":8,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":8},"description":"Join the team at the heart of memory innovation for every Apple product. As a Memory Packaging Engineer, you will architect the memory solutions that power the industry-leading performance of Apple's hardware. We push the boundaries of bandwidth density, power efficiency, and system integration through meticulous co-design between memory technology and our world-class systems. If you are driven to solve the industry's toughest packaging challenges, your work will have a profound and lasting impact on the products used by millions.\nDescription\nIn this role, you will drive the definition, development, and qualification of next-generation memory packages critical to Apple’s future products.\nYou will guide the package roadmaps of our memory partners and collaborate with internal engineering teams to enable bandwidth and density scaling.\nYour ownership will span the entire product lifecycle, from initial concept through qualification.\nMinimum Qualifications\nBS and 10+ years of relevant industry experience.\nPreferred Qualifications\nMS or PhD preferred, with 10+ years of industry experience in package design and assembly process development of high-bandwidth and high-density memory packages.\nStrong knowledge of thin-die stacking technologies including wirebond, flip-chip, and wafer/die bonding.\nStrong knowledge of packaging materials and design to engineer warpage and CTE properties and mitigate thermal challenges.\nSolid working experience in package test and reliability, system-level downstream process interaction, and packaging inspection metrology.\nDeep understanding of SI/PI co-design with memory die and high-speed DDR or differential signaling.\nUnderstanding of how memory die floorplan and architecture influence package structure and routing, with experience collaborating with memory die design teams.\nExcellent communication skills for collaborating with internal teams and managing external vendors.","description_format":"text","description_chars":1930,"description_truncated":false,"requirements":{"experience_years_min":10,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"phd","optional":true},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Operating Systems","Laptops","Smartwatches & Fitness Trackers","Tablets"],"lifecycle":[{"event":"open","at":"2026-11-06T03:00:13Z"}],"visa":[{"country":"US","licensed_sponsor":true,"adverts_offering_sponsorship_24m":0,"sanctioned_now":false,"evidence":"H-1B filings in 12 months: 6,350 · green card filings: 39","filings_12m":6350,"filings_prev_12m":6528,"green_card_filings_12m":39,"median_offered_wage_usd":177313,"route":null,"cap_exempt":false,"checked_at":"2026-11-06T22:30:08+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":100,"band":"hot","label":"Hiring now","p_open":1,"p_active":1,"p_room":1,"age_days":8,"expected_fill_days":90,"reasons":["conf:2","wave","urgency","velocity","win:early","comp:brand"],"computed_at":"2026-11-06T05:58:05Z"},"pay":null,"html_url":"https://alion.io/job/apple-memory-packaging-engineer-4","json_url":"https://alion.io/job/apple-memory-packaging-engineer-4.json","meta":{"generated_at":"2026-11-07T00:11:31Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":451,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-08T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":12},"rest":"https://alion.io/mcp/rest/get_company?id=12"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fapple-memory-packaging-engineer-4"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fapple-memory-packaging-engineer-4"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fapple-memory-packaging-engineer-4"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/apple-memory-packaging-engineer-4\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fapple-memory-packaging-engineer-4"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":3850647}},{"tool":"search_jobs","arguments":{"company":"apple.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":3850647},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. Docs: https://alion.io/developers"}}