{"id":2135669,"url":"https://alion.io/job/apple-packaging-assembly-engineer-2","title":"Packaging Assembly Engineer","company":{"id":12,"name":"Apple","domain":"apple.com","url":"https://alion.io/company/apple","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Apple Jobs","truth_index":{"grade":"B","score":75,"open_postings":925,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":49,"computed_at":"2026-10-10T05:45:15Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"staff","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["San Diego, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":171000,"max_usd":341000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":1114},"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-03-13T18:47:31Z","employer_posted_date":"2026-10-11","last_verified_at":"2026-10-11T19:23:20Z","board_verified":true,"closed_at":null,"days_open":212,"trust":{"level":"stale","repost_count":0,"flags":["stale"],"days_open":211},"description":"Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In this highly visible role, you will own development, optimization and sustaining the advanced flip-chip BGA (FCBGA) assembly process from pathfinding, NPI through high-volume manufacturing by defining assembly baseline processes, deciding package BOM, establishing package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC.\nDescription\nResponsible to lead packaging assembly technology development. Work with cross functional team and lead SoC Package development efforts. Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging solution from concept to HVM. Drive industry with advanced Package solutions, new material development, and specs. Minimum 5% International travel.\nMinimum Qualifications\nBS and 10+ years of experience in relevant industry experience or equivalent\nPreferred Qualifications\nM.S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering or an equivalent field is desired.\n5+ years of extensive experience in Semiconductor Packaging field. Working knowledge in materials characterization and analysis\nWorking knowledge of large FCBGA package, MCM package, 2.5D packaging and 3D packaging technology. General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.\nGood communication skills that can enable you to work well with internal multi-functional teams and overseas suppliers.\nAbility to work independently and take on projects with minimum supervision.\nGood engineering problem solving skills with strong engineering physics and fundamentals.\nCan use package design softwares, APD, Virtuoso, etc. Working knowledge in memory packaging.\nGood program management skill","description_format":"text","description_chars":2111,"description_truncated":false,"requirements":{"experience_years_min":10,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":true},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Operating Systems","Laptops","Smartwatches & Fitness Trackers","Tablets"],"lifecycle":[{"event":"open","at":"2026-10-09T01:35:03Z"},{"event":"close","at":"2026-10-09T01:39:59Z"},{"event":"reopen","at":"2026-10-09T06:23:17Z"},{"event":"close","at":"2026-10-11T12:23:15Z"},{"event":"reopen","at":"2026-10-11T19:23:20Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 6,350 · green card filings: 37","filings_12m":6350,"filings_prev_12m":6527,"green_card_filings_12m":37,"median_offered_wage_usd":177355,"route":null,"cap_exempt":false,"checked_at":"2026-10-03T21:08:04+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":12,"band":"cold","label":"Long shot","p_open":1,"p_active":0.435,"p_room":0.28,"age_days":210,"expected_fill_days":49,"reasons":["conf:2","stale_co","urgency","velocity","win:tail","crowd:brand"],"computed_at":"2026-10-10T05:45:15Z"},"pay":null,"html_url":"https://alion.io/job/apple-packaging-assembly-engineer-2","json_url":"https://alion.io/job/apple-packaging-assembly-engineer-2.json","meta":{"generated_at":"2026-10-11T22:13:13Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":11789,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-12T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":12},"rest":"https://alion.io/mcp/rest/get_company?id=12"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fapple-packaging-assembly-engineer-2"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fapple-packaging-assembly-engineer-2"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fapple-packaging-assembly-engineer-2"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/apple-packaging-assembly-engineer-2\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fapple-packaging-assembly-engineer-2"}]}