{"id":3292265,"url":"https://alion.io/job/apple-packaging-substrate-engineer-4","title":"Packaging Substrate Engineer","company":{"id":12,"name":"Apple","domain":"apple.com","url":"https://alion.io/company/apple","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Apple Jobs","truth_index":{"grade":"A","score":91,"open_postings":867,"ghost_share":0,"stale_share":0.161,"repost_share":0.002,"time_to_fill_p50_days":97,"computed_at":"2026-10-30T05:48:23Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"staff","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["San Francisco, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":198000,"max_usd":386000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":1394},"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Cadence Allegro","optional":true},{"name":"Photolithography","optional":true}],"status":"live","first_seen_at":"2026-10-26T18:34:19Z","employer_posted_date":"2026-10-26","last_verified_at":"2026-10-30T03:36:57Z","board_verified":true,"closed_at":null,"days_open":3,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":3},"description":"Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple’s internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation package structure and configuration optimization. You will be responsible for Apple package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with cross-functional teams to achieve the best package performance.\nDescription\nLead SoC package substrate technology development, pathfinding, and roadmap definition.\nWork with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.\nDrive industry with sophisticated package solutions, new architecture, material and process development, and spec definitions.\n5% International travel.\nMinimum Qualifications\nBS and 10+ years of relevant industry experience.\nPreferred Qualifications\nMS or Ph.D. and 8+ years of relevant industry experience.\nProven fundamentals in material/chemistry/mechanical engineering field(s).\nIn-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.\nHands-on experience in substrate manufacturing and technology development: Cu plating, lithography, dielectric material, via formation, solder resist, surface finish etc.\nFamiliarity with package assembly and integration process preferred.\nExperience in Cadence Allegro platform tools and design review for manufacturing (DFM).\nExceptional technology development & project management skills.\nStrong communication & collaborative skills.","description_format":"text","description_chars":1762,"description_truncated":false,"requirements":{"experience_years_min":10,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"phd","optional":true},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Operating Systems","Laptops","Smartwatches & Fitness Trackers","Tablets"],"lifecycle":[{"event":"open","at":"2026-10-26T20:26:07Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 6,350 · green card filings: 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