{"id":2133658,"url":"https://alion.io/job/apple-soc-packaging-engineer","title":"SoC Packaging Engineer","company":{"id":12,"name":"Apple","domain":"apple.com","url":"https://alion.io/company/apple","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Apple Jobs","truth_index":{"grade":"B","score":75,"open_postings":925,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":49,"computed_at":"2026-10-10T05:45:15Z"}},"role":"Hardware","role_family":"Hardware","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Taipei, Taiwan"],"countries":["TW"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":20000,"max_usd":51000,"period":"year","method":"role_country_seniority_unknown","sample_n":18},"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"HPC","optional":false}],"status":"live","first_seen_at":"2026-06-29T10:44:03Z","employer_posted_date":"2026-10-11","last_verified_at":"2026-10-11T19:23:20Z","board_verified":true,"closed_at":null,"days_open":104,"trust":{"level":"stale","repost_count":0,"flags":["stale"],"days_open":103},"description":"At Apple, we believe our products begin with our people. By hiring a team with varied strengths, we drive creative thought. By giving that team everything they need, we drive innovation. By hiring incredible engineers, we drive precision. And through our collaborative process, we build memorable experiences for our customers.\nThese elements come together to make Apple an amazing environment for motivated people to do the greatest work of their lives. You will become part of a hands-on development team that sets the standard in cultivating excellence, creativity and innovation. Will you help us design the next generation of revolutionary Apple products?\nDescription\nWe are looking for a senior level advanced packaging engineer to develop exciting new products. Your role is to interface between internal product/device design, process integration and external suppliers to develop and deploy new packaging technologies. We are looking for individuals who are very innovative with a proven track record to bring packaging solution from concept to high-volume manufacturing.\nMinimum Qualifications\nM.S or Ph.D. degree in Photonics, Physics, Materials science or similar disciplines with a minimum of 5 years of experience in high performance computing, data center and SiPH (silicon photonics) applications.\nIn-depth knowledge in advanced 2.5D/3D packaging for EIC/PIC die integration, Chip-on-Wafer processes, Photonic component assembly (FAU and fiber) and MCM module assembly.\nPreferred Qualifications\nGood understanding to optics and photonics fundamentals, device/module integration.\nKnowledge in Optical device laser, modulator, photo detector, passive components is a plus.\nProven track record to drive issue resolution with good understanding to root cause and physics, motivate and mobilize all levels within supplier to accomplish any given task. Able to perform independent research and development work with minimal supervision.\nGood written and verbal communication skills. 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