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Salary
≈ $149k – $289k per year (Estimated)
Location
In office (Austin)
Seniority
Middle · 3+ years exp
Visa
H-1B filings in 12 months: 6,350 · for this role: 1,366 · green card filings: 37

Confirmed on the employer's own hiring board on Oct 21, 2026. First seen by Alion on May 28, 2026. Apple scores A on the Alion truth index.

Overview
Company
Impact
Profile match
Apple is an American multinational technology company founded in 1976 by Steve Jobs, Steve Wozniak and Ronald Wayne, and headquartered in Cupertino, California. It designs and sells consumer hardware including the iPhone, Mac, iPad, Apple Watch, AirPods and Vision Pro, together with the operating systems and silicon that run them. A growing services division built around the App Store, iCloud, Apple Music, Apple TV+ and Apple Pay now contributes a large share of profit, making Apple one of the most valuable companies in the world.

At Apple, we work every single day to craft products that enrich people's lives! Do you love creating elegant solutions to highly complex challenges? Do you intrinsically see the importance in every detail? As part of our Silicon Technologies group, you’ll help design and manufacture our next-generation, high-performance, power-efficient processor, system-on-chip (SoC). You’ll ensure Apple products and services can seamlessly and efficiently handle the tasks that make them beloved by millions. Joining our group means you’ll be responsible for crafting and building the technology that fuels Apple’s devices. Together, we will enable our customers to do all the things they love with their devices! In this highly visible role, you will be a part of a critical team responsible for physical verification of an SOC.

Description

  • As a member of our physical design team, you will perform various types of physical verification checks (such as LVS, DRC, design-for-manufacturing & design-for-yield, and lithography) at the chip and block level.
  • You will collaborate with the CAD/Technology teams for flow bring up and validation. We work directly with the implementation team during the entire chip design cycle to drive signoff closure for tapeout.
  • You will lead schedules and support cross-functional engineering efforts.
  • You will work on padring, bump, RDL design, and working with the package and floorplan teams.

Minimum Qualifications

BS and 3+ years of relevant industry experience.

Preferred Qualifications

Experienced with physical verification flows such as DRC/LVS/ANT/HVDRC signoff flows and full-chip integration methodology

Experience with ESD and macro placement design guidelines, digital and analog mixed signal back-end verification checks and methodology

Knowledge of all aspects of ASIC physical design and physical verification checks

Scripting skills perl/python/tcl to debug flow related issues and automate checks

Experienced in industry standard tools used for physical verification such as Mentor Calibre, Synopsys ICV, etc.

Tapeout experience with a track record of successful signoff

Layout design experience is a plus

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