Wireless Module Engineer

Apple is where individual imaginations gather committing to the values that lead to great work. Every new product we build, service we create, or Apple Store experience we deliver is the result of us making each other’s ideas stronger. That happens because every one of us shares a belief that we can make something wonderful and share it with the world, changing lives for the better. It’s the diversity of our people and their thinking that inspires the innovation that runs through everything we do. When we bring everybody in, we can do the best work of our lives. Here, you’ll do more than join something - you’ll add something. The Wireless Module Engineer (WME) is well-versed in multiple fields for wireless module development: RF design, packaging, product engineering (including yield analysis), ATE, and reliability engineering.

Description

The Wireless Module Engineer (WME) is a highly motivated, self-driven technical lead responsible for driving the development of wireless modules from early architecture definition through mass-production ramp. This role requires strong cross-functional collaboration and the ability to deeply engage across a broad spectrum of technical domains including RF design, reliability, manufacturing test, supply chain, and system integration. The WME will initiate and lead early-phase RF architecture and specification discussions between internal engineering teams and Outsourced Semiconductor Assembly & Test (OSAT). They will ensure all OSATs comply with internal specification formats, review procedures, and approval workflows. The WME will drive the formal module design release process, establishing and reviewing checkpoints for schematics, PCB layout, electromagnetic/RF simulation results, design-for-manufacturability (DFM), test data readiness, and OSAT design feedback

In addition to communicating risks and priorities, the core responsibility of WME is to manage module integration and ATE test coverage at OSATs. WME will function as a general manager overseeing all aspects of ATE maturity preparation for hardware-such as load boards, daughter cards, sockets, and handlers-and software, firmware, module calibrations, GRR, and CPK/data analysis.

This role is expected to drive OSATs, set priorities, and collaborate closely with them to validate and approve the final ATE hardware and software integration, test coverage, and corresponding test limits, ensuring timely delivery of tested modules for product NPI builds. Following the NPI builds, WME will lead the failure analysis process with the OSATs and work with them to implement improvement activities, including enhancing ATE testers, optimizing software/firmware test time, and improving overall yield and retest rates. This role will involve traveling to international OSATs for Module & ATE bring up for 1-2 weeks before the product NPI builds. WME is expected to have a broad spectrum of technical depth to debug additional bring up issues during travel. For e.g. I2C & PCIe interface related issues. This team member will facilitate collaboration with multi-functional groups at Apple and define the test coverage. Typical test coverage includes but not limited to Open-Short & Continuity test, VCO calibration and test, TX/RX power calibration and test, RF packet test, EVM test, RX sensitivity test. They will collaborate closely with internal reliability engineering teams to translate expected product field-usage profiles into feasible and data-driven reliability test models for modules and components. This role supports multiple product lines within the Hardware Technology organization, ensuring technical excellence, risk visibility, and disciplined execution from early concept through manufacturing ramp.

Minimum Qualifications

BS and a minimum of 10 years relevant industry experience

Strong RF fundamentals.

Proven track record for effective written/verbal communication, leading projects with self-motivation.

Preferred Qualifications

2 or more years of wireless module development experience from early concept to MP for consumer electronic devices.

Strong RF design background. Additional experience in packaging, product engineering, ATE, and reliability engineering is highly desirable.

Strong data analysis skills including yield analysis (Cpk), and retest rate analysis, required for data sheet closures.

Capable of working at both high-level theory and detailed hands-on execution.

Experienced in managing vendor teams and leading cross-time-zone meetings.

AI/ML experience with expertise in Data Analysis is a plus.

Very good communication skills, verbal and written, including the capability to drive meetings to make key decisions on wireless technologies.

Ability to define best engineering methods for custom Wireless module and component development during prototyping phase.

Experience in setting up project schedules and work breakdown structures while communicating risks with prioritization.

Proficient in reviewing mechanical/electrical designs for sockets, fixtures, and test systems.

Ability to travel internationally.