{"id":4210659,"url":"https://alion.io/job/applied-materials-account-technologist-pvd-advanced-packaging","title":"Account Technologist (PVD Advanced Packaging)","company":{"id":3903,"name":"Applied Materials","domain":"appliedmaterials.com","url":"https://alion.io/company/amat","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"A","score":85,"open_postings":258,"ghost_share":0.004,"stale_share":0.578,"repost_share":0.012,"time_to_fill_p50_days":54,"computed_at":"2026-11-12T10:38:37Z"}},"role":"Hardware","role_family":"Hardware","seniority":"staff","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Singapore"],"countries":["SG"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"PVD","optional":false},{"name":"Statistical Process Control","optional":false}],"status":"live","first_seen_at":"2026-11-10T00:00:00Z","employer_posted_date":"2026-11-10","last_verified_at":"2026-11-13T05:29:22Z","board_verified":true,"closed_at":null,"days_open":3,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":3},"description":"Who We Are\nApplied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.\nWhat We Offer\nLocation:\nSingapore,SGPYou’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible-while learning every day in a supportive leading global company. Visit our Careers website to learn more.\nAt Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.\nKey Responsibilities\nEnable Next-Gen Solutions Through Direct Engagement:\nAct as the technical owner for PVD solutions at assigned OSATs and Fabless accounts, ensuring alignment between design requirements and manufacturing processes.\nUnderstand Customers and Fabless stakes holders technical roadmap.\nPartner with Fabless packaging architects to define material stacks, reliability criteria, and integration flows; translate these into executable solutions for OSATs.\nLead joint qualification programs involving Fabless and OSAT stakeholders: define success metrics, DoEs, and acceptance gates; manage execution to schedule.\nProcess Qualification & Ramp:\nEstablish process-of-record (POR) for advanced packaging applications (e.g., RDL barrier/seed, TSV liners, hybrid bonding underlayers).\nDrive tool acceptance (FAT/SAT) and HVM ramp at OSAT sites: SPC setup, chamber matching, defectivity control, and yield stabilization.\nValidate PVD film integrity under Fabless-driven reliability tests (JEDEC/IPC standards: EM, TDDB, thermal cycling).\nCross-Functional Collaboration:\nCoordinate with Applied Materials’ Product Engineering, Field Service, and Quality teams to deliver robust solutions tailored to OSAT and Fabless needs.\nResolve integration challenges across packaging flows (e.g., ESD, adhesion, contamination, stress) through structured problem-solving.\nContinuous Improvement:\nLead structured root cause analysis on yield/reliability excursions; implement corrective actions and verify effectiveness.\nProvide feedback to internal engineering for hardware and process enhancements based on OSAT and Fabless requirements.\nRequired Qualifications\nBachelor’s or Master’s in Materials Science, Physics, Chemical Engineering, or related field; PhD preferred.\n10+ years in semiconductor equipment/process engineering with strong PVD experience in Advanced Packaging (FO-WLP, 2.5D/3D, RDL/UBM).\nProven success enabling solutions through direct engagement with OSATs and Fabless design houses.\nPreferred Qualifications\nExperience enabling hybrid bonding or chiplet integration through PVD underlayers.\nFamiliarity with APAC OSAT ecosystem and Fabless packaging roadmaps.\nProficiency in SPC, DOE, metrology, and yield analytics.\nExpertise in thin-film metallurgy (Cu, Ni, Ti, Ta/TaN, Co) and reliability-critical stack design.\nStrong communication skills to engage executive Fabless stakeholders and OSAT engineering teams.\nWork Location\nScience Park II (Moving to Tampines starting from mid-2027)\nAdditional Information\nTime Type:\nFull timeEmployee Type:\nAssignee / RegularTravel:\nYes, 50% of the TimeRelocation Eligible:\nYesApplied Materials is an Equal Opportunity Employer. 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