College Intern - Process & product development in PVD chambers in Hybrid bonding for SOIC (advanced packaging)

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Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

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With engineer’s guidance to perform, collect data and analyze on unusually complex experiments to develop the complicated physical vapor deposition (PVD) product

Job scope including:

a) PVD process optimization & measure metal film properties, organize data/reports for review;

b) Perform hardware characterization on moderately difficult systems, within safety guidelines;

c) With engineer’s guidance, involve in troubleshooting moderately complex problems, perform Root Cause Analysis and resolve moderately difficult process engineering issues

Learning Outcome:

Able to think constructively, solve problems creatively and bring new possibilities to life Be able to involve in innovate cycles for new product. Learn start-of-art semiconductor technologies and engage with various problem-solving occasions for top semiconductor foundries.

Additional Information

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Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.