{"id":473281,"url":"https://alion.io/job/applied-materials-global-product-support-gps-engineer-advanced-packaging","title":"Global Product Support (GPS) Engineer - Advanced Packaging","company":{"id":3903,"name":"Applied Materials","domain":"appliedmaterials.com","url":"https://alion.io/company/amat","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"A","score":87,"open_postings":261,"ghost_share":0.004,"stale_share":0.51,"repost_share":0.011,"time_to_fill_p50_days":54,"computed_at":"2026-11-09T06:03:00Z"}},"role":"Product","role_family":"Product","seniority":"middle","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Santa Clara, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":124000,"max":171000,"currency":"USD","period":"year","gross":null,"usd_annual":171000},"salary_estimate":null,"experience_years_min":3,"visa_sponsorship":false,"relocation_package":false,"has_equity":true,"technologies":[],"status":"live","first_seen_at":"2026-08-03T00:00:00Z","employer_posted_date":"2026-08-03","last_verified_at":"2026-11-09T23:40:58Z","board_verified":true,"closed_at":null,"days_open":99,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":99},"description":"Who We Are\nApplied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world - like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.\nWhat We Offer\nSalary:\n$124,000.00 - $171,000.00Location:\nSanta Clara,CAYou’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible-while learning every day in a supportive leading global company. Visit our Careers website to learn more.\nAt Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.\nPosition Summary\nApplied Materials is seeking a Global Product Support (GPS) Engineer to support installation, startup, qualification, and ongoing operation of the Kinex™ Hybrid Bonding platform being deployed for the CTO advanced packaging development programs.\nThe successful candidate will serve as the primary equipment support engineer responsible for bringing the system from installation through process readiness while coordinating closely with Facilities, BESI, Applied Materials product engineering teams, and CTO process development teams.\nThis role combines hands-on equipment support, system integration, startup execution, facilities coordination, and vendor engagement. The engineer will play a key role in establishing Kinex as a strategic advanced packaging platform supporting die-to-wafer hybrid bonding, optical interconnect, and next-generation heterogeneous integration development.\nKey Responsibilities\nInstallation & Startup\nSupport Kinex installation activities from tool dock through release to engineering users\nCoordinate Tier 0, Tier 1 and Tier 2 startup activities\nDrive closure of installation punch-list items\nSupport factory acceptance and site acceptance activities with vendors\nDevelop recovery plans for installation and startup issues\nFacilities Integration\nSupport Facility Data Sheet (FDS) development and updates\nCoordinate with Facilities, EHS and infrastructure teams\nDefine and validate tool utility requirements\nSupport hookup and qualification activities\nEquipment Support\nPerform troubleshooting of mechanical, electrical, automation, and process-related issues\nDevelop preventative maintenance procedures\nSupport uptime improvement efforts\nAnalyze equipment performance and reliability trends\nDrive root cause investigations and corrective actions\nVendor & Product Engineering Engagement\nAct as primary technical interface with BESI and Kinex product engineering teams\nCoordinate technical reviews, service activities, upgrades, and modifications\nManage escalation of hardware and software issues\nSupport implementation of engineering changes and new capabilities\nAdvanced Packaging Development Support\nSupport hybrid bonding process development activities\nWork closely with CTO process engineers and researchers\nEnable wafer-to-wafer and die-to-wafer bonding development\nSupport new module integration and experimental hardware evaluations\nMinimum Qualifications\nBS in Mechanical Engineering, Electrical Engineering, Mechatronics, Systems Engineering or related engineering discipline\n3-7 years of engineering experience in semiconductor equipment - new college graduates applications will NOT be considered\nExperience supporting semiconductor manufacturing or development equipment\nStrong troubleshooting and root-cause analysis skills\nExcellent verbal and written communication skills\nAbility to work across facilities, vendors, process engineering, and operations teams\nPreferred Qualifications\nHighly Desired\nExperience with advanced packaging equipment\nExperience with hybrid bonding, wafer bonding, die attach, packaging, or assembly systems\nExperience with wet clean processes and systems\nEquipment installation and startup experience\nFacilities hookup and utility integration experience\nVendor management and supplier coordination experience\nHands-on experience troubleshooting complex semiconductor equipment\nPreferred\nKnowledge of:Automated material handling systems\nVacuum systems\nPlasma processing systems\nWet processing equipment\nMetrology systems\n\nExperience generating or reviewing:Site prep / installation documentation\nEquipment specifications\nStartup plans\nQualification procedures\n\nBonus Qualifications\nPrior experience with BESI equipment\nHybrid bonding process knowledge\n300 mm equipment experience\nProject management experience\nCleanroom construction or tool installation experience\nAdditional Information\nTime Type:\nFull timeEmployee Type:\nAssignee / RegularTravel:\nYes, 10% of the TimeRelocation Eligible:\nYesThe salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.\nFor all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.\nApplied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.\nIn addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at ,or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. 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