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Salary
$33k – $74k per year (Estimated)
Location
In office (Hong Kong)
Seniority
Junior
Employment
Full-Time
Overview
Company
Impact
Profile match
ASMPT is a leading supplier of semiconductor assembly and surface mount technology equipment. Its die bonders and placement machines automate electronics manufacturing. The company is listed in Hong Kong and serves chipmakers worldwide.
  • Define process flow, requirements and specifications and verify through Design of Experiment (DoE) to optimize current machinery performance

  • Discuss with customers about the conceptual process design of new product and the enhancement of existing products’ process design

  • Support on-site process optimization and/or trouble-shooting through engineering evaluation to meet customer requirements

  • Debug the machinery functions to ensure meeting customer requirements and conduct process analysis to study the parameter test results from DoE for process optimization

  • Support internal machinery optimization before buy-off

  • Test the samples provided by customers for bonding

Requirements

  • Degree or higher in Applied Physics / Applied Mathematics / Mechanical Engineering / Materials science / Chemical Engineering or relevant disciplines

  • Good understanding of DoE, FMECA, statistics and instrumentation

  • Strong in analytical methods

  • Detail-oriented with a critical degree of accuracy regarding analysis

  • Working experience in micro-electronics is a plus

  • Occasional business trip is required

Attractive salary and fringe benefits package will be offered to the right candidates.

Interested parties please submit your application with cover letter, resume, certificate and transcripts.

Data collected will be used for recruitment purpose only. Suitable candidates may be referred to other vacancies within our company.

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