{"id":1253557,"url":"https://alion.io/job/astar-senior-scientist-ii-advanced-packaging-ime","title":"Senior Scientist II (Advanced Packaging), IME","company":{"id":50235,"name":"Agency for Science, Technology and Research","domain":"a-star.edu.sg","url":"https://alion.io/company/a-star-edu","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"SuccessFactors","truth_index":{"grade":"B","score":81,"open_postings":47,"ghost_share":0,"stale_share":0.979,"repost_share":0,"time_to_fill_p50_days":21,"computed_at":"2026-11-02T06:13:15Z"}},"role":"Hardware","role_family":"Hardware","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Singapore"],"countries":["SG"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":45000,"max_usd":97000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":28},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-09-25T18:38:00Z","employer_posted_date":"2026-09-25","last_verified_at":"2026-11-02T23:49:58Z","board_verified":true,"closed_at":null,"days_open":38,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":38},"description":"Job Description\nResearch Scientists - Optical Interconnects for Next-Generation AI Clusters\nWe are recruiting Research Scientists to join an ambitious research programme developing the next generation of ultra-high-bandwidth, ultra-energy-efficient optical interconnects for AI clusters.\nAs AI models continue to scale to trillions of parameters, future AI infrastructure will depend on new interconnect technologies that can move enormous volumes of data between compute and memory nodes with much lower energy consumption. This project focuses on enabling petascale interconnects through advanced 2.5D/3D electronic-photonic integration, targeting optical I/O beyond 100 Tb/s per compute node, up to 10 Tb/s/mm bandwidth density, and ~1 pJ/bit energy efficiency.\nThis is a unique opportunity to work at the intersection of advanced packaging, silicon photonics, high-speed interfaces, thermal design, and AI hardware systems. Successful candidates will contribute to technologies that are highly relevant to the future of hyperscale AI data centres and next-generation computing platforms.\nOur project aims to develop a 2.5D/3D integration-ready optical engine platform that brings optical communication much closer to the compute die. By tightly integrating electronic ICs (EICs) and photonic ICs (PICs) using advanced packaging and 3D integration approaches, the programme seeks to overcome the limitations of existing copper links and conventional co-packaged optics.\nThe reserach project will explore:\npackage architecture for dense electrical and optical I/O,\nhigh-speed EIC-PIC interface design,\n3D stacked optical engine modelling,\nthermal and link-performance optimization,\nhybrid bonding and heterogeneous integration,\nsimulation, characterization, and measurement of integrated modules.\nWe are particularly interested in candidates who can contribute in one or more of the following areas:\nResearch Scientist - Package Architecture, Link and Thermal Modelling\nYou will develop models for advanced package structures and use them in link analysis and thermal design to identify optimized package architectures capable of achieving sub-1 pJ/bit energy efficiency.\nResearch Scientist - High-Speed Interface and Optical Engine Design\nYou will design, simulate, and characterize high-speed parallel interfaces between EIC and PIC components, and develop high-level models of 3D stacked optical engines to optimize overall architecture and performance.\nResearch Scientist - EIC-PIC-Package Co-Design and Module Characterization\nYou will carry out simulation-based co-design of package, EIC, and PIC technologies to enable complete 3D-integrated systems, and contribute to the characterization and measurement of the resulting modules.\nWe welcome applicants with strong expertise in one or more of the following:\nadvanced semiconductor packaging,\nsilicon photonics or photonic integrated circuits,\nhigh-speed electrical interface design,\nsignal and power integrity,\nthermal modelling and analysis,\nheterogeneous integration and hybrid bonding,\ndevice/package/system co-design,\nhardware characterization and measurement.\nCandidates should be motivated by challenging, high-impact research and excited to work on enabling technologies for future AI systems.","description_format":"text","description_chars":3260,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":null,"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":[],"lifecycle":[{"event":"open","at":"2026-09-25T18:38:00Z"}],"visa":[],"liveness":{"score":22,"band":"cold","label":"Long shot","p_open":1,"p_active":0.482,"p_room":0.45,"age_days":37,"expected_fill_days":21,"reasons":["conf:10","stale_co","velocity","win:tail","comp:brand"],"computed_at":"2026-11-02T06:13:15Z"},"pay":null,"html_url":"https://alion.io/job/astar-senior-scientist-ii-advanced-packaging-ime","json_url":"https://alion.io/job/astar-senior-scientist-ii-advanced-packaging-ime.json","meta":{"generated_at":"2026-11-03T01:53:56Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":2586,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-04T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":50235},"rest":"https://alion.io/mcp/rest/get_company?id=50235"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fastar-senior-scientist-ii-advanced-packaging-ime"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fastar-senior-scientist-ii-advanced-packaging-ime"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fastar-senior-scientist-ii-advanced-packaging-ime"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/astar-senior-scientist-ii-advanced-packaging-ime\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fastar-senior-scientist-ii-advanced-packaging-ime"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":1253557}},{"tool":"search_jobs","arguments":{"company":"a-star.edu.sg","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":1253557},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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