{"id":3023792,"url":"https://alion.io/job/astera-labs-principal-photonics-package-architect","title":"Principal Photonics Package Architect","company":{"id":178069,"name":"Astera Labs","domain":"asteralabs.com","url":"https://alion.io/company/astera-labs-2","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Greenhouse","truth_index":{"grade":"B","score":82,"open_postings":54,"ghost_share":0,"stale_share":0.537,"repost_share":0,"time_to_fill_p50_days":73,"computed_at":"2026-10-23T05:54:15Z"}},"role":"Semiconductors","role_family":"Semiconductors","seniority":"lead","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["San Jose, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":185000,"max":240000,"currency":"USD","period":"year","gross":null,"usd_annual":240000},"salary_estimate":null,"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Ansys HFSS","optional":false},{"name":"NVLink","optional":false}],"status":"live","first_seen_at":"2026-07-31T20:56:36Z","employer_posted_date":"2026-10-17","last_verified_at":"2026-10-23T04:29:24Z","board_verified":true,"closed_at":null,"days_open":83,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":83},"description":"Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com.\nLocation: San Jose, CA (On-site). \nAbout the Role \nAstera Labs is seeking a Principal Photonics Package Architect to define and drive package architecture for next-generation photonics products for scale up and scale out AI infrastructure applications. This is a high-impact senior individual contributor role focused on aligning electrical, thermal, and mechanical design requirements across functions, enabling robust package implementation, and guiding package technology decisions for NPO and CPO products. \nResponsibilities \nDefinephotonicspackage architecture, defineelectricaland opticalinterface specifications, and establishsignal integrityand power integrityrequirements. \nEstablish and manage Thermal Design Power (TDP) budgets and thermal performance targets. \nDrive cross-functional alignment with EIC, PIC, and hardware teams on co-design constraintsand drive system optical link budget. \nPartner with validation, test, and reliability teams to define DFT and DFR requirements and acceptance criteria. \nFinalize bump map and ball map, andmanage ECOs and revision control of package design databases. \nLead package-level design reviews and own the package design technical roadmap. \nBasic Qualifications \nB.S., M.S., or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related field. \n10+ years of experience in semiconductor or photonicspackage development, package design, or package integration, with demonstratedtechnical leadership. \nStrong understanding of package architecture tradeoffs across electrical, optical, thermal, mechanical, and manufacturability considerations. \nExperience working across chip, board, and system-level design electrical and optical interfaces in complex product development environments. \nExperience with package EDA tools and electrical simulation tools, including Cadence APD+ and Ansys HFSS. \nExperience with advanced packaging design, including 2.5D and 3D package architectures. \nFamiliarity with package design flows, design database management, and engineering change control practices. \nAbility to drive technical decisions, resolve cross-functional issues, and communicate architecture direction clearly to stakeholders. \nStrong foundationin design reviews, risk assessment, and design quality from concept through production release. \nPreferred Qualifications \nExperience with industry-standard opticalinterfaces and interconnect technologies relevant to package design. \nExperience with advancedphotonicspackaging technologies for data center interconnects. \nExperience supporting package bring-up and correlating design assumptions with validation results. \nExperience supporting cross-functional design closure with silicon, photonics, board, validation, test, and reliability teams. \nKnowledge of package design for NPO or CPO products. \nSalary range is $185,000 to $240,000 depending on experience, level, and business need. This role may be eligible for discretionary bonus, incentives and benefits.\nWe know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.","description_format":"text","description_chars":4086,"description_truncated":false,"requirements":{"experience_years_min":10,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Optical Communications","Processors, MCUs & AI Chips","Servers & Data Center Hardware"],"lifecycle":[{"event":"open","at":"2026-10-21T18:29:22Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 77 · green card filings: 7","filings_12m":77,"filings_prev_12m":50,"green_card_filings_12m":7,"median_offered_wage_usd":168155,"route":null,"cap_exempt":false,"checked_at":"2026-10-15T11:24:14+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":25,"band":"fade","label":"Fading","p_open":1,"p_active":0.558,"p_room":0.44,"age_days":83,"expected_fill_days":73,"reasons":["conf:1","stale_co","velocity","win:tail","crowd:brand"],"computed_at":"2026-10-23T05:54:15Z"},"pay":{"stated_usd_annual":240000,"is_top_pay":false},"html_url":"https://alion.io/job/astera-labs-principal-photonics-package-architect","json_url":"https://alion.io/job/astera-labs-principal-photonics-package-architect.json","meta":{"generated_at":"2026-10-23T06:10:55Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":10074,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-24T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":178069},"rest":"https://alion.io/mcp/rest/get_company?id=178069"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fastera-labs-principal-photonics-package-architect"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fastera-labs-principal-photonics-package-architect"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fastera-labs-principal-photonics-package-architect"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/astera-labs-principal-photonics-package-architect\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fastera-labs-principal-photonics-package-architect"}]}