{"id":4251372,"url":"https://alion.io/job/avient-rd-scientist-high-performance-computing-materials","title":"R&D Scientist - High Performance Computing Materials","company":{"id":1840824,"name":"Avient","domain":"avient.com","url":"https://alion.io/company/avient-com","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Oracle","truth_index":null},"role":"Science & Research","role_family":"Science & Research","seniority":"staff","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Avon Lake, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Design of Experiments","optional":false},{"name":"HPC","optional":false}],"status":"live","first_seen_at":"2026-09-29T19:48:17Z","employer_posted_date":"2026-09-29","last_verified_at":"2026-11-13T14:07:48Z","board_verified":true,"closed_at":null,"days_open":44,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":44},"description":"Job Summary\nWe are seeking an accomplished R&D Scientist to lead Avient's innovation in next-generation thermoplastic materials for High Performance Computing (HPC), AI infrastructure, and hyperscale data center applications.\nThis technical leader will develop advanced low dielectric constant and ultra-low dielectric loss materials for high-speed connector systems operating at increasingly demanding data rates. The successful candidate will combine expertise in materials science, electrical performance, device physics, and advanced characterization to accelerate commercialization of breakthrough materials for next-generation computing architectures.\nThe ideal candidate will have deep knowledge of the relationship among material structure, processing, characterization of electrical performance for complex form-factors, with experience supporting high-speed connectors, semiconductor packaging, advanced interconnects, data communications, RF systems, or other signal integrity-critical technologies.\nAs part of Avient's Corporate Technology Innovation organization, this role will influence technology strategy, intellectual property development, customer engagement, and future growth platforms at the forefront of AI and digital infrastructure.\nEssential Functions\nTechnical Leadership & Innovation\nLead development of next-generation thermoplastic materials for high-speed connector and interconnect applications in AI, cloud computing, networking, and hyperscale data centers.\n\nServe as the company's technical subject matter expert in dielectric materials, signal integrity, and material solutions for high-frequency electronics.\n\nDevelop material platforms with industry-leading dielectric constant (Dk), dissipation factor (Df), dimensional stability, thermal performance, processability, and reliability.\n\nIdentify emerging technology trends and establish roadmaps aligned with industry requirements for 224G, 448G, and next-generation data transmission architectures.\n\nExpand Avient's intellectual property portfolio through invention disclosures, patents, and new technology platforms.\n\nMaterials Development\nDesign and optimize thermoplastic formulations based on structure-property-performance relationships.\n\nEvaluate high-performance polymers, including LCP, PPE, PPS, PEEK, fluoropolymers, polyimides, and other advanced dielectric materials.\n\nInvestigate novel fillers, reinforcements, additives, and processing methods to achieve ultra-low dielectric loss.\n\nEstablish material selection criteria and specifications that meet customer requirements for signal integrity, thermal management, reliability, and manufacturability.\n\nUse advanced statistical methods, design of experiments (DOE), and data analytics to accelerate formulation optimization.\n\nCharacterization & Testing\nDevelop and execute advanced methods to characterize electrical, thermal, mechanical, and morphological properties.\n\nCorrelate molecular structure, morphology, crystallinity, and interfacial interactions with high-frequency dielectric performance.\n\nLead testing and analysis using techniques such as:\nVector Network Analysis (VNA)\nDielectric spectroscopy\nTime-domain reflectometry (TDR)\nDifferential scanning calorimetry (DSC)\nDynamic mechanical analysis (DMA)\nThermogravimetric analysis (TGA)\nMicroscopy and surface characterization techniques\n\nInterpret material- and device-level performance data to guide formulation and design decisions.\n\nCustomer & Market Engagement\nPartner with marketing and commercial teams to capture the voice of customers, including connector manufacturers, semiconductor suppliers, hyperscale data center operators, and OEMs, and understand future material requirements.\n\nTranslate emerging computing and networking trends into actionable material innovation opportunities.\n\nProvide technical leadership in customer interactions and development programs.\n\nPresent technical findings to customers, industry organizations, and executive leadership.\n\nCross-Functional Collaboration\nPartner with manufacturing, engineering, quality, procurement, and commercial teams to scale technologies from concept through commercialization.\n\nSupport pilot- and production-scale implementation of new material technologies.\n\nLead multidisciplinary project teams and external research collaborations with universities, national laboratories, suppliers, and industry consortia.\n\n Education & Experience\nMinimum Qualifications\nPh.D. in Materials Science & Engineering, Polymer Science, Physics, Electrical Engineering, Chemical Engineering, or a closely related field.\n\nAt least 5 years of industrial or advanced research experience developing materials for electronics, semiconductors, communications, or high-performance computing applications.\n\nPreferred Qualifications\n10+ years of experience in advanced materials development and commercialization.\n\nDemonstrated expertise in high-speed connectors, interconnects, semiconductor packaging, RF, microwave, or signal integrity applications.\n\nProven record of patents, technical publications, and successful commercialization of new technologies.\n\nExperience collaborating directly with customers and external technology 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