{"id":996560,"url":"https://alion.io/job/bitdeer-technologies-group-advanced-packaging-leadarchitect","title":"Advanced Packaging Lead/Architect","company":{"id":174995,"name":"Bitdeer Technologies Group","domain":"bitdeer.com","url":"https://alion.io/company/bitdeer","size_band":"501-1000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Breezy","truth_index":{"grade":"B","score":75,"open_postings":13,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":40,"computed_at":"2026-11-10T06:52:35Z"}},"role":"Hardware","role_family":"Hardware","seniority":"lead","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["George Town, Malaysia"],"countries":["MY"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":24000,"max_usd":56000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":796},"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Bitcoin","optional":false},{"name":"HPC","optional":false}],"status":"live","first_seen_at":"2026-09-17T07:12:07Z","employer_posted_date":"2026-09-17","last_verified_at":"2026-11-10T18:05:52Z","board_verified":true,"closed_at":null,"days_open":54,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":54},"description":"About Bitdeer:\nBitdeer is a world-leading technology company for Bitcoin mining and AI cloud.\nBitdeer is committed to providing comprehensive Bitcoin mining solutions for its customers. Apart from designing industry-leading ASIC chips and manufacturing mining rigs, the Group handles complex processes involved in computing across the value chain. This includes equipment procurement, transport logistics, datacenter design and construction, equipment management, and network and facility operations. Bitdeer also offers advanced cloud capabilities to customers with a high demand for artificial intelligence.\nHeadquartered in Singapore, Bitdeer operates globally with a diversified 3 GW energy portfolio, and deploys Bitcoin mining and HPC datacenters in the United States, Bhutan, Norway, Canada, Malaysia, and Ethiopia.\nJob Summary:\nLead chip packaging design and simulation from architecture through production. Align silicon, memory, board, cooling and supplier teams to meet performance, reliability, cost and schedule targets. Own multiphysics analysis, technical decisions and design signoff.\nWhat you will be responsible for:\nDefine packaging roadmaps and product architectures, including structures, die placement, substrate stack-ups, interconnects and power delivery. Assess manufacturability, cost, yield and delivery risks.\nLead chip-package-board co-design. Review bump/ball maps, layout, routing and manufacturing constraints; drive design closure and release.\nLead signal integrity (SI), power integrity (PI), thermal and thermomechanical analysis. Define models, boundary conditions, design budgets, margins and signoff criteria.\nEstablish simulation-to-measurement validation. Coordinate prototype testing, model correlation and root-cause analysis; resolve electrical, thermal, structural and reliability issues.\nOwn technical interfaces with foundries, assembly/test partners and substrate vendors. Work with product, test and quality teams on pilot builds, qualification, yield improvement and production ramp.\nEstablish design reviews, version control, engineering change and documentation practices. Identify risks and drive technical trade-offs and decisions across teams.\nRecruit, develop and manage packaging design and simulation engineers. Define responsibilities, project plans and resources; build reusable methods, models and design guidelines.\nHow you will stand out:\nRequired qualifications:\nBachelor’s degree or above in electrical engineering, microelectronics, materials, mechanical engineering or a related field; 10+ years of relevant chip packaging design or development experience.\nOwnership of at least one complex packaging project from architecture through design, validation and volume production, with demonstrable decisions and results.\nKnowledge of flip-chip/FC-BGA, substrate design, materials and assembly processes, including trade-offs across high-speed interconnects, power delivery, cooling and reliability.\nHands-on depth in at least one area: package design, SI/PI, thermal or thermomechanical analysis, with the ability to guide multidisciplinary analysis and design signoff.\nTeam leadership, cross-functional collaboration and supplier technical management experience. Ability to use relevant EDA/simulation tools for analysis or review, with effective technical communication and documentation in English.\n\nPreferred qualifications: Advanced packaging experience in 2.5D/3D design, simulation or production is preferred, including relevant work on chiplets, heterogeneous integration, interposers, RDL, TSVs, microbumps or hybrid bonding.\nExperience with CPUs, GPUs, switch chips, high-performance ASICs, large or high-power packages, or familiarity with advanced packaging and substrate supply chains.\n\nWhat you will experience working with us:\nA culture that values authenticity and diversity of thoughts and backgrounds;\nAn inclusive and respectable environment with open workspaces and exciting start-up spirit;\nFast-growing company with the chance to network with industrial pioneers and enthusiasts;\nAbility to contribute directly and make an impact on the future of the digital asset industry;\nInvolvement in new projects, developing processes/systems;\nPersonal accountability, autonomy, fast growth, and learning opportunities;\nAttractive welfare benefits and developmental opportunities such as training and mentoring.","description_format":"text","description_chars":4386,"description_truncated":false,"requirements":{"experience_years_min":10,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[{"language":"English","level":"All levels","optional":false}]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Cryptocurrencies","Mining & Staking","AI Compute & Inference"],"lifecycle":[{"event":"open","at":"2026-09-17T08:10:36Z"}],"visa":[],"liveness":{"score":28,"band":"fade","label":"Fading","p_open":1,"p_active":0.518,"p_room":0.55,"age_days":53,"expected_fill_days":40,"reasons":["conf:4","stale_co","velocity","win:tail","comp:brand"],"computed_at":"2026-11-10T06:52:35Z"},"pay":null,"html_url":"https://alion.io/job/bitdeer-technologies-group-advanced-packaging-leadarchitect","json_url":"https://alion.io/job/bitdeer-technologies-group-advanced-packaging-leadarchitect.json","meta":{"generated_at":"2026-11-10T23:27:42Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":1982,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-11T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.1,"usd":0.01,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":174995},"rest":"https://alion.io/mcp/rest/get_company?id=174995"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fbitdeer-technologies-group-advanced-packaging-leadarchitect"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":2,"usd":0.2},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fbitdeer-technologies-group-advanced-packaging-leadarchitect"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.1,"usd":0.01},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fbitdeer-technologies-group-advanced-packaging-leadarchitect"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/bitdeer-technologies-group-advanced-packaging-leadarchitect\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fbitdeer-technologies-group-advanced-packaging-leadarchitect"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":996560}},{"tool":"search_jobs","arguments":{"company":"bitdeer.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":996560},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); 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